EP20K1500EBC652-1X

IC FPGA 488 I/O 652BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 442368 51840 652-BGA

Quantity 1,106 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package652-BGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case652-BGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5184Number of Logic Elements/Cells51840
Number of Gates2392000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of EP20K1500EBC652-1X – APEX-20KE Field Programmable Gate Array (FPGA) 652-BGA

The EP20K1500EBC652-1X is a commercial-grade APEX-20KE family FPGA from Intel designed for system-on-programmable-chip integration. It implements a MultiCore architecture combining lookup-table (LUT) logic, product-term logic, and embedded memory blocks to support complex digital functions.

With 51,840 logic elements, approximately 0.44 Mbits of embedded memory, and 488 user I/O pins in a 652-BGA (45×45) package, this device is suited for dense logic integration, memory-centric functions, and high-pin-count interfacing in commercial embedded and communications applications.

Key Features

  • Core Architecture  MultiCore architecture integrating LUT logic and product-term logic for register- and combinatorial-intensive functions.
  • Large Logic Capacity  51,840 logic elements and approximately 2,392,000 system gates provide high-density programmable logic for complex designs.
  • Embedded Memory  Approximately 442,368 RAM bits of on-chip memory for FIFOs, dual-port RAM, and CAM-style implementations without reducing available logic.
  • I/O and Interface Flexibility  488 user I/O pins with MultiVolt I/O support and programmable clamp/slew-rate control to interface with multiple voltage domains.
  • Clock Management  Built-in clock management including up to four PLLs, low-skew clock tree, and programmable features such as ClockLock, ClockBoost, and ClockShift for flexible clocking.
  • High-speed I/O Support  Family-level support for high-speed interfaces and standards including LVDS performance and PCI-compliant operation for 3.3-V systems.
  • Power and Supply  Designed for low-power operation with a specified voltage supply range of 1.71 V to 1.89 V.
  • Package and Thermal  652-ball BGA (45×45) surface-mount package; commercial operating temperature range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • System Integration / SOPC  Implement embedded system blocks and integrate LUT and memory resources for custom system-on-chip functions.
  • Memory Interface Controllers  Implement DDR SDRAM and ZBT SRAM interfaces and on-chip FIFOs using the device’s embedded memory resources.
  • Bus and Bridge Logic  Develop PCI-compliant 3.3-V bus interfaces and custom protocol bridges leveraging the device’s I/O capabilities.
  • High-speed Data Paths  Utilize LVDS-capable I/O and dedicated clock management for high-throughput signal-path and data-acquisition designs.

Unique Advantages

  • Highly integrated programmable fabric: Combines LUT logic, product-term logic, and embedded system blocks to consolidate functions and reduce external components.
  • Substantial on-chip memory: Approximately 0.44 Mbits of RAM enables implementation of FIFOs, buffers, and memory-centric logic without consuming logic-element capacity.
  • Extensive I/O resources: 488 I/O pins and MultiVolt support simplify interfacing with multiple voltage domains and high-pin-count systems.
  • Advanced clocking: Up to four PLLs plus ClockLock/ClockBoost/ClockShift features provide flexible, low-skew clock distribution for synchronous designs.
  • Commercial-grade package: 652-BGA (45×45) surface-mount package supports dense board-level integration in commercial temperature environments.
  • Standards-oriented I/O support: Family-level support for LVDS and PCI signaling enables ready implementation of common high-speed interfaces.

Why Choose EP20K1500EBC652-1X?

The EP20K1500EBC652-1X offers a balanced combination of high logic capacity, substantial embedded memory, and flexible I/O in a single commercial-grade FPGA package. Its MultiCore architecture and integrated system blocks make it suitable for designs that require on-chip memory, complex combinatorial and register logic, and robust clock management.

This part is well suited to engineers and teams building commercial embedded systems, interface controllers, and memory-centric logic where a high density of logic elements, versatile I/O, and programmable clock features are required. The device’s RoHS compliance and surface-mount 652-BGA package support modern PCB assembly and environmental requirements.

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