EP20K1500EFC33-1X

IC FPGA 808 I/O 1020FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 808 442368 51840 1020-BBGA

Quantity 1,035 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O808Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5184Number of Logic Elements/Cells51840
Number of Gates2392000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of EP20K1500EFC33-1X – APEX-20KE® FPGA, 51,840 Logic Elements, 1020-BBGA

The EP20K1500EFC33-1X is an APEX-20KE family field programmable gate array (FPGA) in a 1020-BBGA package. It combines a MultiCore architecture with lookup-table (LUT) logic and embedded system blocks (ESBs) to support register‑intensive and memory‑centric functions for mid- to high-density programmable logic applications.

With 51,840 logic elements, approximately 0.44 Mbits of embedded memory and 808 user I/Os, this device is aimed at designers needing high integration, flexible I/O and on-chip memory for communications, embedded systems and high‑performance peripheral interfaces.

Key Features

  • Core Architecture — MultiCore architecture integrating LUT logic and product‑term logic for a balance of register and combinatorial function implementation.
  • Logic Capacity — 51,840 logic elements providing substantial programmable logic resources and a reported 2,392,000 maximum system gates.
  • Embedded Memory — Approximately 0.44 Mbits of on‑chip RAM (442,368 bits) available without reducing logic resources, suitable for FIFOs, dual‑port RAM and CAM implementations using ESBs.
  • High I/O Count — 808 user I/Os to support complex board-level interfaces and high‑pin-count designs.
  • Advanced Clock Management — Up to four phase‑locked loops (PLLs), a built‑in low‑skew clock tree and support for up to eight global clock signals plus ClockLock, ClockBoost and ClockShift features for flexible clocking.
  • I/O Flexibility — MultiVolt I/O interface support and programmable output control; device family documentation cites support for interfaces such as LVDS, PCI (3.3 V), and memory interfaces including DDR SDRAM and ZBT SRAM.
  • Power — Internal supply voltage range listed as 1.71 V to 1.89 V; ESBs include programmable power‑saving modes.
  • Package & Mounting — Surface‑mount 1020‑BBGA (supplier package: 1020‑FBGA 33×33) for compact board integration.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

  • Communications & Networking — Implement protocol bridges, packet processing or high‑speed I/O aggregation using the device’s high I/O count and embedded memory for buffering.
  • Embedded System Integration — Build system‑on‑a‑chip style functions combining logic, memory and product‑term resources for control and data‑path tasks.
  • Memory Interface Controllers — Support DDR SDRAM and ZBT SRAM interfaces where on‑chip ESBs and flexible I/O simplify external memory management.
  • PCI‑Based Peripherals — Implement PCI 3.3 V peripheral logic and bus interfacing leveraging the device’s I/O feature set and timing capabilities.

Unique Advantages

  • Highly integrated programmable fabric: 51,840 logic elements plus ESBs let you combine logic and memory functions on a single device, reducing board complexity.
  • Substantial on‑chip RAM: Approximately 0.44 Mbits of embedded memory supports FIFOs, dual‑port RAM and CAM without using logic resources.
  • Extensive I/O resources: 808 user I/Os accommodate complex, multi‑lane interfaces and mixed‑signal board designs.
  • Flexible clocking: Multiple PLLs and advanced clock features enable precise clock domain control and low‑skew distribution for timing‑sensitive designs.
  • MultiVolt I/O support: Interface with a range of external voltages while maintaining an internal supply in the 1.71 V–1.89 V range.
  • RoHS compliant, commercial grade: Designed for commercial temperature operation (0 °C to 85 °C) with environmental compliance noted.

Why Choose EP20K1500EFC33-1X?

The EP20K1500EFC33-1X positions itself as a high‑density, highly integrated FPGA option within the APEX‑20KE family. Its combination of 51,840 logic elements, significant embedded RAM and a large user I/O count makes it suitable for designers who need on‑chip memory, flexible I/O and advanced clocking in a single surface‑mount package.

This device is well suited to teams building communications, embedded computing and high‑performance peripheral applications that require scalable logic capacity, integrated memory blocks and multi‑voltage I/O flexibility, with the long‑term benefits of a documented device family and RoHS compliance.

To request a quote or submit a procurement inquiry for EP20K1500EFC33-1X, please provide your quantity and delivery requirements and a sales contact will follow up with pricing and availability details.

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