EP20K160EBC356-1N

The EP20K160EBC356-1N is an APEX-20KE family FPGA IC from Intel, implementing a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory blocks. This mid-density FPGA delivers a balanced combination of logic resources, on-chip RAM, flexible I/O and advanced clock management for embedded control, communications, and memory-interface applications.

With 6,400 logic elements, approximately 0.082 Mbits of embedded memory, and 271 I/O pins in a compact 356-LBGA package, the device targets designs that require integrated logic and memory with commercial-temperature operation and RoHS compliance.

Key Features

• Core architecture (MultiCore)  MultiCore architecture integrates LUT logic, product-term logic, and embedded system blocks (ESBs) to implement register-intensive and combinatorial functions.
• Logic capacity  6,400 logic elements and 404,000 system gates provide mid-range programmable logic for custom processing and control functions.
• Embedded memory  Approximately 0.082 Mbits of on-chip RAM (81,920 bits) with ESB implementations that support FIFO buffers, dual-port RAM, and content-addressable memory (CAM).
• I/O versatility  271 user I/O pins with MultiVolt I/O interface support to interoperate with multiple I/O voltage domains and configurable per-pin features such as output slew-rate control and tri-state enable.
• Clock and timing  Flexible clock management with up to four PLLs, a built-in low-skew clock tree, up to eight global clocks, and programmable features for clock phase, delay, multiplication and division.
• High-speed interfaces  Support in the APEX 20K family for PCI 3.3-V operation and high-speed memory interfaces (including DDR SDRAM and ZBT SRAM), plus support for LVDS and other advanced I/O standards.
• Power and package  Designed for low-power operation with a core supply voltage range of 1.71 V to 1.89 V. Commercial operating temperature of 0 °C to 85 °C and RoHS-compliant. Supplied in a 356-LBGA (35 × 35 mm) package.

Typical Applications

• Embedded control and processing  Implement custom state machines, glue logic, and control handlers using the device’s LUTs and logic elements.
• Memory interface controllers  Build DDR SDRAM or ZBT SRAM controllers and FIFOs using on-chip ESBs and embedded RAM.
• Peripheral and bus bridging  Implement PCI 3.3-V bus interfaces, protocol bridges, and custom I/O handling with the device’s flexible I/O and timing features.
• Communications and I/O aggregation  Aggregate and serialize I/O channels, leveraging LVDS-capable interfaces and programmable clocking for multi-channel timing alignment.

Unique Advantages

• Integrated logic and memory: Combines 6,400 logic elements with ESB-backed RAM for compact implementations of controllers, FIFOs, and CAMs, reducing external component count.
• Flexible clocking: Multiple PLLs, global clocks, and programmable clock-shift features simplify timing architectures for complex designs.
• Wide I/O support: 271 user I/Os and MultiVolt interface capability enable direct interfacing to a broad range of peripherals and voltage domains.
• Commercial-ready package: 356-LBGA package and 0 °C to 85 °C operating range suit mainstream embedded and communications products requiring compact footprints.
• Standards-oriented interfaces: Family-level support for PCI and high-speed memory interfaces facilitates system integration in bus- and memory-centric designs.
• Regulatory compliance: RoHS-compliant construction supports modern manufacturing and environmental requirements.

Why Choose EP20K160EBC356-1N?

The EP20K160EBC356-1N delivers a practical balance of logic density, embedded memory, and flexible I/O in the APEX-20KE architecture—making it a strong choice for mid-density programmable designs that require integrated memory functions and advanced clock management. Its combination of 6,400 logic elements, ~81.9k bits of on-chip RAM, and extensive I/O allows designers to consolidate functions and simplify board-level integration.

As a member of the APEX 20K family, this FPGA provides an architectural path to higher-density devices within the same device family while offering commercial-grade temperature operation and RoHS compliance for mainstream embedded, communications, and memory-interface applications.

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