EP20K160EFC484-1

IC FPGA 316 I/O 484FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 316 81920 6400 484-BBGA

Quantity 1,835 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O316Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs640Number of Logic Elements/Cells6400
Number of Gates404000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of EP20K160EFC484-1 – APEX-20KE® Field Programmable Gate Array (FPGA), 484-BBGA

The EP20K160EFC484-1 is an APEX-20KE family FPGA offering MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory for system-on-a-programmable-chip (SOPC) integration. It targets designs requiring on-chip memory, flexible I/O and mid-range logic density for commercial applications.

This device provides 6,400 logic elements, approximately 81,920 bits of embedded RAM, and 316 user I/Os in a 484-BBGA (23×23) surface-mount package. The part is specified for a commercial temperature range (0 °C to 85 °C) and is RoHS compliant.

Key Features

  • Core architecture  MultiCore architecture combining LUT logic, product-term logic, and embedded system blocks (ESBs) for implementing register-intensive and memory functions.
  • Logic density  6,400 logic elements (LEs) with a system gate count up to 404,000, suitable for mid-range programmable logic implementations.
  • Embedded memory  Approximately 0.082 Mbits of on-chip RAM (81,920 bits) enabling FIFOs, dual-port RAM, and CAM implementations in ESBs.
  • I/O and interface flexibility  316 user I/O pins with MultiVolt I/O interface support to connect with 1.8 V, 2.5 V, 3.3 V, and 5.0 V devices; programmable clamp and slew-rate control are supported at the family level.
  • Clock and timing  Flexible clock management including up to four phase-locked loops (PLLs), a built-in low-skew clock tree, and features for clock delay, skew reduction and phase/delay shifting (ClockLock, ClockBoost, ClockShift).
  • High-speed memory and bus support  Family-level support for DDR SDRAM and ZBT SRAM and compliance with PCI Local Bus Specification (3.3 V operation, Revision 2.2) for bus-interface applications.
  • Power and supply  Internal supply specified around 1.71 V to 1.89 V; device family supports low-power operation and power-saving modes in ESBs.
  • Package and mounting  484-ball BGA (484-BBGA, 23×23) surface-mount package for compact board integration.
  • Commercial grade and compliance  Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

  • Embedded systems and SOPC integration  Use the ESB and MultiCore architecture to implement integrated system functions, on-chip memory buffers, and custom logic for embedded platforms.
  • Memory interface and buffering  Implement DDR SDRAM and ZBT SRAM controllers and on-chip FIFOs using the device’s embedded RAM and ESB resources.
  • PCI and bus bridging  Implement PCI Local Bus interfacing at 3.3 V (Revision 2.2) and design bus bridge logic leveraging abundant I/O and programmable logic.
  • High-speed I/O and protocol bridging  Take advantage of MultiVolt I/O support and programmable I/O features to connect and translate between multiple voltage domains and I/O standards.

Unique Advantages

  • MultiCore integration:  Combines LUT logic, product-term logic, and embedded memory to reduce external component needs and simplify system architecture.
  • Balanced logic and memory resources:  6,400 logic elements paired with ~81.9 kbits of embedded RAM enable mixed logic-plus-memory functions such as FIFOs and dual-port RAM without sacrificing logic capacity.
  • Flexible I/O connectivity:  316 user I/Os and MultiVolt support allow direct interfacing to multiple voltage domains, reducing level-shifting hardware.
  • Comprehensive clock management:  Up to four PLLs and a low-skew clock tree provide on-chip clock control for synchronous, high-performance designs.
  • Compact BGA package:  The 484-BBGA (23×23) package enables a dense board footprint while supporting a large I/O count.
  • Commercial temperature and RoHS compliance:  Specified for 0 °C to 85 °C operation and RoHS compliant to meet common commercial product requirements.

Why Choose EP20K160EFC484-1?

The EP20K160EFC484-1 positions itself as a mid-density APEX-20KE FPGA offering a balanced combination of logic elements, embedded memory, and flexible I/O in a compact 484-BBGA package. Its MultiCore architecture and ESB capabilities make it well suited for designs that require integrated memory functions, SOPC-style integration, and robust clock management.

This device is a fit for commercial embedded designs that need programmable logic with on-chip RAM, multiple I/Os across voltage domains, and configurable clocking. It delivers a scalable solution within the APEX 20K family for teams focused on integration, board-level density, and adherence to commercial temperature and RoHS requirements.

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