EP20K160EFC144-3

The EP20K160EFC144-3 is a commercial‑grade APEX‑20KE family field programmable gate array (FPGA) from Intel. It implements a MultiCore architecture combining look‑up table (LUT) logic, product‑term logic and embedded system blocks (ESBs) to support register‑intensive and memory‑intensive functions.

Designed for embedded and communications applications that require mid‑range logic capacity, this device offers 6,400 logic elements, approximately 81,920 bits of on‑chip RAM and 88 user I/O pins in a 144‑LQFP surface‑mount package.

Key Features

• Logic Capacity — 6,400 logic elements and a maximum system gate count of 404,000 provide mid‑range programmable logic resources for control, glue logic and moderate FPGA functions.
• Embedded Memory — Approximately 81,920 bits of embedded RAM (ESBs) for FIFOs, dual‑port RAM and CAM implementations within the device fabric.
• I/O and Interfaces — 88 user I/O pins with MultiVolt I/O interface support across common levels; series documentation indicates support for a wide range of I/O standards and high‑speed interfaces.
• Clock Management — Series‑level clock features include up to four PLLs, low‑skew clock tree, multiple global clocks and programmable clock phase/delay capabilities.
• Power and Voltage — Designed for low‑power operation with a listed supply range of 1.71 V to 1.89 V for the device core; MultiVolt I/O options are available at the family level.
• Package & Mounting — 144‑LQFP (supplier package 144‑TQFP 20×20), surface‑mount mounting for compact PCB layouts.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant manufacturing and materials.

Typical Applications

• Embedded Control — Implement microcontroller offload, peripheral glue logic and custom state machines using 6,400 logic elements and on‑chip RAM for buffering.
• Memory Interface and Buffering — Use ESBs to implement FIFOs and dual‑port RAM for buffering between subsystems or memory controllers.
• Communications and I/O Bridging — Deploy as an interface bridge or protocol translator leveraging flexible I/O levels and series‑level high‑speed I/O support.
• Prototyping and System Integration — Mid‑density FPGA resource set in a compact surface‑mount package for rapid development and hardware validation of commercial products.

Unique Advantages

• Balanced logic and memory — 6,400 logic elements combined with ~81,920 bits of embedded RAM enable mixed logic and buffering functions without external RAM for many designs.
• Flexible I/O options — Family‑level MultiVolt I/O support and advanced I/O features allow straightforward interfacing to a range of peripheral voltage domains.
• Integrated clock resources — Multiple PLLs and clock management features simplify timing architecture for multi‑clock designs.
• Compact, manufacturable package — 144‑LQFP surface‑mount package supports dense board layouts and standard PCB assembly flows.
• Commercial temperature and RoHS compliance — Meets 0 °C to 85 °C operating range needs for commercial applications and RoHS material requirements.

Why Choose EP20K160EFC144-3?

As part of the APEX‑20K family, the EP20K160EFC144-3 delivers a practical balance of programmable logic, embedded memory and I/O in a compact 144‑LQFP package for commercial embedded and communications designs. Its MultiCore architecture and ESB resources make it suitable for designs that combine register‑intensive logic and on‑chip memory functions.

Designers looking for a mid‑density FPGA with flexible I/O, internal RAM for buffering and integrated clock management can rely on this part to simplify board-level integration while maintaining predictable thermal and electrical characteristics within the specified operating range.

Request a quote or submit an inquiry to obtain pricing and availability for EP20K160EFC144-3 and to discuss how this APEX‑20KE FPGA can fit your next commercial design.