EP20K160EFC144-1

IC FPGA 88 I/O 144TQFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 88 81920 6400 144-LQFP

Quantity 479 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O88Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs640Number of Logic Elements/Cells6400
Number of Gates404000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits81920

Overview of EP20K160EFC144-1 – APEX-20KE FPGA IC, 88 I/O, 81,920-bit RAM, 6,400 Logic Elements, 144-LQFP

The EP20K160EFC144-1 is an APEX-20KE field programmable gate array (FPGA) from Intel, built on the APEX 20K family MultiCore architecture. It integrates lookup-table (LUT) logic, product-term logic and embedded system blocks (ESBs) to support register‑intensive and memory‑centric functions.

With 6,400 logic elements, approximately 0.082 Mbits of embedded memory and 88 I/O pins in a 144‑LQFP package, this commercial‑grade device is suited for designs that require on‑chip RAM, flexible I/O and integrated clock management within a surface‑mount footprint.

Key Features

  • Logic Capacity — 6,400 logic elements delivering the programmable fabric needed for register‑intensive and combinatorial logic.
  • Embedded Memory — 81,920 bits of on‑chip RAM (approximately 0.082 Mbits) implemented in ESBs for FIFOs, dual‑port RAM and content‑addressable memory.
  • System Integration (MultiCore) — MultiCore architecture combining LUT logic, product‑term logic and embedded memory to consolidate logic and memory functions on a single device.
  • I/O and Interfaces — 88 user I/O pins with MultiVolt support and programmable I/O features (programmable clamp to VCCIO, individual tri‑state enables, programmable output slew‑rate) to interface with a range of external devices.
  • Clock Management — Flexible clock circuitry with up to four PLLs, a built‑in low‑skew clock tree and support for up to eight global clock signals; includes features such as ClockLock, ClockBoost and ClockShift for phase and delay control.
  • Performance Scale — Device family heritage supports up to 404,000 system gates on this density level, providing substantial logic resource headroom for complex designs.
  • Power and Supply — Designed for low‑voltage operation with a specified supply range of 1.71 V to 1.89 V and surface‑mount package for compact board integration.
  • Package & Mounting — 144‑LQFP package (supplier device package listed as 144‑TQFP, 20×20) for surface‑mount assembly.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
  • RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

  • Embedded Systems — Implement on‑chip memory functions and custom control logic where embedded FIFOs, dual‑port RAM or CAM structures are required.
  • Interface & Bridge Logic — Use the device’s MultiVolt I/O and programmable I/O features to bridge between different voltage domains or protocol interfaces.
  • High‑performance Buffering — Deploy ESBs for FIFO buffering and dual‑port memory in data path designs that need compact on‑chip storage.
  • Clocked Data Processing — Leverage multiple PLLs and global clocks for synchronous designs requiring low‑skew distribution and phase/delay tuning.

Unique Advantages

  • Integrated Memory and Logic: Embedded system blocks provide dedicated on‑chip RAM and memory primitives, reducing external memory needs and BOM complexity.
  • Flexible Clocking: Multiple PLLs and programmable clock features enable precise clock domain management and timing optimization within a single device.
  • Programmable I/O Control: MultiVolt I/O and programmable clamp/slew/tri‑state controls simplify interfacing with diverse external components and help manage signal integrity.
  • Compact, Surface‑Mount Package: 144‑LQFP (20×20 supplier footprint) provides a compact form factor for space‑constrained board layouts while supporting surface‑mount assembly.
  • Commercial‑grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for typical commercial embedded deployments.

Why Choose EP20K160EFC144-1?

The EP20K160EFC144-1 delivers a balanced combination of logic capacity, embedded memory and flexible I/O within the proven APEX 20K family architecture. It addresses designs that need integrated memory primitives (FIFOs, dual‑port RAM, CAM), multi‑domain I/O interfacing and advanced clock management, all in a 144‑lead surface‑mount package.

This device is well suited to development teams and procurement for commercial embedded, communications and interface applications that require a compact FPGA solution with integrated on‑chip memory and configurable clock/I/O resources backed by the APEX 20K device family.

Request a quote or submit a purchasing inquiry to obtain pricing, availability and lead‑time details for the EP20K160EFC144-1.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up