EP20K160EFC144-2
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 88 81920 6400 144-LQFP |
|---|---|
| Quantity | 824 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 88 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 640 | Number of Logic Elements/Cells | 6400 | ||
| Number of Gates | 404000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of EP20K160EFC144-2 – APEX-20KE® Field Programmable Gate Array (FPGA) IC, 6,400 logic elements, 81,920 bits embedded RAM, 144-LQFP
The EP20K160EFC144-2 is an APEX-20KE family FPGA offered in a 144-pin LQFP package. It implements a MultiCore architecture that integrates lookup-table (LUT) logic, product-term logic and embedded memory blocks to support register‑intensive and memory‑centric designs.
Targeted at commercial applications, this device provides 6,400 logic elements, approximately 81,920 bits of on-chip RAM and 88 user I/O pins, delivering a balance of integration, flexible I/O and clock management for embedded systems, protocol bridging and interface control functions.
Key Features
- Core architecture MultiCore architecture combining LUT logic, product-term logic, and embedded system blocks (ESBs) for mixed register- and memory-intensive functions.
- Logic density 6,400 logic elements and up to 404,000 system gates (family figure) to implement mid-range programmable logic designs.
- Embedded memory Approximately 81,920 bits of on-chip RAM; ESBs can be used to implement FIFOs, dual-port RAM and content-addressable memory (CAM).
- I/O and interface support 88 user I/O pins with MultiVolt I/O interface support for interfacing across common voltage domains and programmable clamp and slew-rate control options.
- Clock management Flexible clocking with up to four PLLs, a built-in low-skew clock tree and features such as ClockLock, ClockBoost and ClockShift for phase and delay control.
- Performance-oriented I/O Family-level features include high-speed I/O support and LVDS capability; the architecture supports high-speed external memory interfaces and PCI operation modes (family-level specification).
- Package and power Surface-mount 144-LQFP package (supplier package listed as 144-TQFP, 20×20). Internal supply range listed as 1.71 V to 1.89 V and designed for low-power operation with programmable power-saving modes (family-level).
- Commercial temperature grade Rated for 0 °C to 85 °C operation for commercial applications.
- Standards and testability Family-level JTAG boundary-scan support and architectural features that aid system integration and testability.
Typical Applications
- Embedded controllers Implement custom control logic, state machines and peripheral glue logic where integrated RAM and moderate logic density are required.
- Memory interface and buffering Use ESBs to build FIFOs and dual-port RAM for DDR/SDRAM interface buffering and data path staging in commercial systems.
- Protocol bridging and I/O aggregation Combine MultiVolt I/O capability with flexible clocking to implement protocol bridges and multi‑voltage interface hubs.
- Prototyping and product differentiation Rapidly iterate custom logic and feature sets for commercial products that require on-chip memory and configurable logic blocks.
Unique Advantages
- Integrated memory and logic: Approximately 81,920 bits of on-chip RAM paired with 6,400 logic elements reduces external component count for buffering and control functions.
- Flexible clocking toolkit: Multiple PLLs, low-skew clock tree and programmable clock features enable deterministic timing and simplified clock distribution.
- Multi-voltage I/O compatibility: I/O structure supports multiple voltage domains so the FPGA can interface directly with a range of commercial logic levels.
- Compact surface-mount package: 144-pin LQFP (144-TQFP supplier package 20×20) offers a space-efficient solution with 88 user I/O pins for dense I/O layouts.
- Commercial temperature suitability: Rated for 0 °C to 85 °C, matching the needs of a wide range of commercial electronic products.
- Family-level scalability: Built on the APEX 20K programmable logic family architecture, allowing designers to reference family features and scaling options within the same platform.
Why Choose EP20K160EFC144-2?
The EP20K160EFC144-2 delivers a balanced combination of logic capacity, embedded RAM and flexible clock and I/O features in a compact 144-pin LQFP package for commercial applications. Its MultiCore architecture and ESB-based memory provide practical on-chip resources for buffering, protocol handling and register-intensive logic.
This device is well suited to designers who need a mid-range FPGA solution within the APEX 20K family—offering predictable clock management, multi-voltage interfacing and on-chip memory to simplify board-level design and reduce bill-of-materials for commercial products.
Request a quote or submit a quote today to obtain pricing and availability for the EP20K160EFC144-2.

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