EP20K600CF672C7
| Part Description |
APEX-20KC® Field Programmable Gate Array (FPGA) IC 508 672-BBGA, FCBGA |
|---|---|
| Quantity | 373 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 508 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2432 | Number of Logic Elements/Cells | 24320 | ||
| Number of Gates | 1537000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 311296 |
Overview of EP20K600CF672C7 – APEX-20KC® Field Programmable Gate Array (FPGA) IC, 672-BBGA FCBGA, 508 I/O
The EP20K600CF672C7 is an APEX-20KC® family field programmable gate array (FPGA) supplied in a 672-BBGA (FCBGA) package. It provides a programmable hardware platform with 24,320 logic elements, approximately 0.31 Mbits of embedded memory and up to 508 general-purpose I/O for dense digital designs.
Designed for commercial-temperature applications, this surface-mount FPGA operates from a 1.71 V to 1.89 V core supply and is RoHS compliant, making it suitable for a range of compact, I/O-centric programmable logic implementations.
Key Features
- Core Logic 24,320 logic elements enabling complex combinational and sequential logic integration within a single device.
- Embedded Memory Approximately 0.31 Mbits of on-chip RAM to support buffering, state storage and small lookup tables.
- I/O Capacity 508 I/O pins to support extensive peripheral and interface connectivity on I/O-heavy boards.
- Gate Equivalent 1,537,000 gates of equivalent logic capacity for sizable programmable designs.
- Power Core supply voltage range of 1.71 V to 1.89 V for compatibility with low-voltage system domains.
- Package & Mounting 672-BBGA, FCBGA package (supplier package: 672-FBGA, 27×27) in a surface-mount form factor for compact PCB layouts.
- Temperature & Grade Commercial grade operation from 0 °C to 85 °C for standard embedded and electronic equipment environments.
- Environmental RoHS compliant, supporting regulatory-driven materials requirements.
Typical Applications
- Custom digital logic Implement application-specific finite state machines, protocol handling and custom accelerators using the device’s 24,320 logic elements.
- Embedded system controllers Integrate control logic and housekeeping functions while leveraging on-chip memory for small data buffers and state storage.
- I/O-dense interface bridging Use the 508 I/O pins to aggregate multiple peripherals, sensors or bus interfaces in a compact package.
Unique Advantages
- High-density programmable logic: 24,320 logic elements provide substantial capacity to consolidate multiple functions into one FPGA, reducing external components.
- On-chip memory for local buffering: Approximately 0.31 Mbits of embedded RAM supports small buffers and lookup storage without external memory.
- Extensive I/O count: 508 I/O pins enable flexible interfacing and simplify board-level routing for I/O-rich designs.
- Compact FCBGA footprint: 672-ball BGA (27×27) package supports high pin count in a space-efficient surface-mount package suitable for dense PCBs.
- Low-voltage operation: 1.71 V to 1.89 V core supply aligns with low-voltage system architectures to ease power-domain integration.
- RoHS compliant: Meets common materials compliance requirements for commercial electronic products.
Why Choose EP20K600CF672C7?
The EP20K600CF672C7 positions itself as a compact, high-density FPGA solution for designers who need substantial programmable logic capacity, significant I/O, and modest on-chip memory in a surface-mount BGA package. Its 24,320 logic elements and 508 I/O provide a balance of integration and flexibility for embedded and I/O-centric applications operating within the commercial temperature range.
Choosing this device helps consolidate multiple functions into a single programmable component, reducing BOM complexity and enabling design iterations without changing hardware. Its RoHS compliance and standardized FCBGA package make it a practical option for production-oriented electronic designs.
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