EP20K600CF672I8

IC FPGA 508 I/O 672FBGA
Part Description

APEX-20KC® Field Programmable Gate Array (FPGA) IC 508 311296 24320 672-BBGA

Quantity 1,253 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O508Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2432Number of Logic Elements/Cells24320
Number of Gates1537000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits311296

Overview of EP20K600CF672I8 – APEX-20KC FPGA, 672-BBGA

The EP20K600CF672I8 is an APEX-20KC family field programmable gate array (FPGA) offering a high-density, MultiCore™ architecture that integrates look-up table (LUT) logic and embedded memory blocks. It targets complex logic and interface tasks where a mix of abundant logic resources, on-chip RAM, and flexible I/O is required.

With 24,320 logic elements, approximately 0.31 Mbits of embedded memory, support for MultiVolt I/O and advanced clock management, this device is suited for designs requiring programmable logic, embedded system blocks (ESBs) for FIFOs and dual-port RAM, and robust I/O connectivity in industrial temperature environments.

Key Features

  • Core & Logic  MultiCore architecture using LUT-based logic; includes 24,320 logic elements and dedicated carry and cascade chains for arithmetic and high-fan-in logic.
  • Embedded Memory  ESBs providing approximately 0.31 Mbits (311,296 bits) of RAM usable without reducing available logic; ESBs support FIFOs, dual-port RAM and CAM implementations.
  • I/O & Interfaces  508 user I/O pins with MultiVolt I/O support for 1.8 V, 2.5 V and 3.3 V interfaces, programmable clamp to VCCIO, programmable output slew-rate and individual tri-state control. Supports advanced I/O standards referenced in the device architecture.
  • Clock & Timing  Flexible clock management with up to four phase-locked loops (PLLs), built-in low-skew clock tree, up to eight global clocks and features for programmable clock phase, delay and multiplication/division.
  • Power & Process  Low-power design with a nominal internal supply around 1.8 V (product data lists 1.71 V to 1.89 V supply range) and copper interconnect to help reduce power consumption.
  • Package & Temperature  Surface-mount 672-BBGA package (supplier device package: 672-FBGA, 27×27) and industrial operating temperature range from −40 °C to 100 °C.
  • Density & Capacity  System gate capacity consistent with the APEX 20KC family (product data lists 1,537,000 gates for this device class) and tools support for design implementation.
  • Design Tools & Ecosystem  Architecture supported by vendor toolchains and megafunction libraries for synthesis, place-and-route and optimized IP use (as described for the APEX 20KC series).

Typical Applications

  • High-performance interface bridging  Implement PCI/PCI-X or other protocol bridging and custom bus logic using abundant logic elements and flexible I/O voltage support.
  • Memory interface controllers  Design DDR SDRAM or ZBT SRAM controllers and buffering logic leveraging ESBs and the device's memory support.
  • Multi-channel serial/parallel data processing  Use LVDS and other high-speed I/O channel support for data acquisition, aggregation and packet processing.
  • Register-intensive control and buffering  Implement register-heavy state machines and FIFO-based buffering using LUT logic and ESBs for deterministic performance.

Unique Advantages

  • High logic density: 24,320 logic elements and a system-gate capacity consistent with the EP20K600C class enable complex designs to be implemented on-chip.
  • Significant embedded memory: Approximately 0.31 Mbits of on-chip RAM provided by ESBs lets you implement FIFOs, dual-port RAM or CAM without consuming LUT resources.
  • Flexible, MultiVolt I/O: Support for 1.8 V, 2.5 V and 3.3 V I/O simplifies interfacing to mixed-voltage systems and reduces external level-shifting needs.
  • Advanced clock management: Up to four PLLs, low-skew clock tree and programmable clock features enable precise timing control for complex synchronous designs.
  • Industrial temperature range: Rated for −40 °C to 100 °C operation for deployments that require extended environmental robustness.
  • Proven architecture and tool support: APEX 20KC family features such as dedicated carry/cascade chains and vendor design tools streamline implementation of arithmetic, control and memory functions.

Why Choose EP20K600CF672I8?

The EP20K600CF672I8 delivers a balanced mix of density, embedded memory, flexible I/O and clocking features in a compact 672-BBGA package for industrial-temperature applications. Its MultiCore architecture and ESBs make it well suited to designs that need register-heavy logic, on-chip buffering and high-speed interface support while keeping core logic resources available.

This device is aimed at engineers building systems that require scalable programmable logic with built-in memory resources, robust clock control and multi-voltage I/O—providing long-term design flexibility through an established device architecture and vendor tool support.

Request a quote or submit a pricing inquiry to receive current availability and volume pricing for EP20K600CF672I8.

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