EP20K600EBC652-1

IC FPGA 488 I/O 652BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 311296 24320 652-BGA

Quantity 1,255 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package652-BGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case652-BGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2432Number of Logic Elements/Cells24320
Number of Gates1537000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits311296

Overview of EP20K600EBC652-1 – APEX-20KE Field Programmable Gate Array (652‑BGA)

The EP20K600EBC652-1 is an Intel APEX-20KE series FPGA in a 652‑ball BGA (45×45) surface-mount package. It implements the APEX MultiCore architecture—integrating look-up table (LUT) logic, product-term logic, and embedded memory blocks—providing a programmable platform for complex digital systems.

With 24,320 logic elements, approximately 0.31 Mbits of embedded memory, 488 I/O pins and up to 1,537,000 system gates, this device targets high-density applications that need integrated memory, flexible I/O and configurable clock management within a commercial‑grade 0 °C to 85 °C operating range.

Key Features

  • Core Architecture  MultiCore architecture combining LUT logic and product-term logic to implement register‑intensive and combinatorial functions.
  • Logic Capacity  24,320 logic elements and up to 1,537,000 system gates for complex logic integration.
  • Embedded Memory  Approximately 0.31 Mbits of on‑chip RAM (ESBs) usable for FIFO, dual‑port RAM or CAM implementations.
  • I/O and Interface Support  488 I/O pins with MultiVolt I/O support and programmable clamp/slew control; supports advanced I/O standards and high‑speed interfaces described in the APEX‑20K family documentation.
  • Clock and Timing  Flexible clock management with up to four PLLs, a built‑in low‑skew clock tree and features such as ClockLock, ClockBoost and ClockShift for phase/delay control.
  • Power and Supply  Internal supply operation within the specified 1.71 V to 1.89 V range for core operation; device family includes programmable power‑saving modes.
  • Package and Mounting  652‑BGA package (45×45) optimized for surface‑mount assembly in compact, high‑pin‑count designs.
  • Commercial Grade and Compliance  Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

  • Embedded Systems & SOPC Integration  Use the APEX MultiCore architecture and embedded system blocks to consolidate logic and memory functions for system‑on‑programmable‑chip designs.
  • High‑Speed Memory Interfaces  Implement controllers and interfaces for external memories—documentation for the APEX‑20K family includes support examples for DDR SDRAM and ZBT SRAM.
  • Bus and Peripheral Interfaces  Deploy PCI‑compatible and other high‑performance bus logic leveraging the device’s flexible I/O and timing features.
  • High‑Bandwidth I/O and Signal Processing  Design LVDS and other high‑speed I/O channels and local interconnect paths for demanding data‑throughput and signal‑processing tasks.

Unique Advantages

  • High integration density: 24,320 logic elements and up to 1.5+ million system gates enable consolidation of complex digital subsystems into a single device, reducing board-level component count.
  • On‑chip embedded memory: Approximately 0.31 Mbits of ESB memory supports FIFOs, dual‑port RAM and CAM implementations without sacrificing logic resources.
  • Robust clock management: Up to four PLLs plus ClockLock, ClockBoost and ClockShift features simplify multi‑domain clocking and phase/delay tuning.
  • Flexible I/O: 488 I/O pins with MultiVolt support and programmable output control make it straightforward to interface with a broad range of external devices and memory standards.
  • Compact package: 652‑BGA (45×45) surface‑mount package provides high pin count in a compact footprint for dense, manufacturable PCB layouts.
  • Commercial suitability and compliance: Commercial temperature range (0 °C to 85 °C) and RoHS compliance support standard industrial and commercial applications.

Why Choose EP20K600EBC652-1?

The EP20K600EBC652-1 positions itself as a high‑density, commercially rated FPGA solution within the APEX‑20K family, combining substantial logic capacity, embedded memory, and flexible I/O in a 652‑BGA package. Its MultiCore architecture and advanced clocking capabilities make it well suited for design teams consolidating logic, memory controllers and high‑speed interfaces into a single programmable device.

For engineering teams focused on scalable, integrated digital designs that require a balance of logic density, on‑chip RAM and configurable I/O, this device offers a verifiable specification set and compliance attributes aligned with commercial application requirements.

Request a quote or submit your procurement inquiry today to begin evaluating EP20K600EBC652-1 for your design needs.

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