EP20K600EBC652-2

The EP20K600EBC652-2 is an APEX-20KE family Field Programmable Gate Array (FPGA) from Intel, delivered in a 652-BGA (45×45) surface-mount package. It combines a high-density programmable logic fabric with embedded memory and flexible I/O, providing a platform for designs that require substantial on-chip logic and memory resources.

Architected for system integration, the device supports the APEX family’s MultiCore approach and on-chip embedded system blocks for memory-centric functions, making it suitable for applications that demand extensive logic resources, significant embedded RAM, and versatile interfacing options.

Key Features

• High-density logic: 24,320 logic elements delivering up to 1,537,000 system gates for complex logic implementations.
• Embedded memory: Approximately 0.311 Mbits (311,296 bits) of on-chip RAM for FIFOs, dual-port RAM and other memory functions.
• I/O capacity and package: 488 user I/O pins in a 652-BGA (45×45) surface-mount package to support dense external connectivity.
• Low-voltage core supply: Internal supply voltage range of 1.71 V to 1.89 V, suitable for 1.8 V core operation.
• Clock management: Flexible clock management including support for multiple PLLs and a built-in low-skew clock tree (series-level feature).
• Advanced I/O support: Series-level support for MultiVolt I/O levels and a wide range of I/O standards, enabling connections to 1.8 V, 2.5 V, 3.3 V and 5.0 V devices as applicable.
• Memory and interface support: Series-level support for high-speed external memories including DDR SDRAM and ZBT SRAM for designs that require external memory interfaces.
• Commercial temperature and compliance: Rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• High-density programmable logic: Implement complex state machines, protocol engines or custom datapaths that require tens of thousands of logic elements and up to 1.5 million gates of capacity.
• Memory-intensive functions: On-chip RAM and embedded system blocks support FIFOs, dual-port RAM and CAM implementations where deterministic on-chip memory is required.
• I/O-heavy designs: 488 user I/O pins and MultiVolt I/O support enable bridging between multiple voltage domains and interfacing to diverse external peripherals and memories.

Unique Advantages

• Substantial on-chip logic and gates: 24,320 logic elements and 1,537,000 gates allow consolidation of complex functions into a single FPGA, reducing external logic count.
• Integrated embedded memory: Approximately 0.311 Mbits of RAM supports memory-centric blocks on chip, minimizing latency and external memory bandwidth for certain functions.
• Flexible I/O and package density: 488 I/O in a 652-ball BGA provides large external connectivity in a compact surface-mount footprint.
• Design flexibility with series-level features: MultiCore architecture, embedded system blocks and programmable clocking features offer multiple implementation options for system designers.
• RoHS compliant and commercially rated: RoHS compliance and a 0 °C to 85 °C operating range meet standard commercial product requirements.

Why Choose EP20K600EBC652-2?

The EP20K600EBC652-2 delivers a balanced combination of high logic density, embedded memory, and broad I/O capability in a compact 652-BGA package. It is positioned for designs that require significant on-chip resources and flexible interfacing while operating within commercial temperature ranges.

For teams developing memory-centric or I/O-intensive systems, this APEX-20KE device provides the integration and series-level features needed to reduce external components and simplify board-level design, while offering a clear upgrade path within the APEX family for scalability.

Request a quote or submit a pricing inquiry to evaluate the EP20K600EBC652-2 for your next design project.