EP20K600EBC652-1X

IC FPGA 488 I/O 652BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 311296 24320 652-BGA

Quantity 6 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package652-BGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case652-BGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2432Number of Logic Elements/Cells24320
Number of Gates1537000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits311296

Overview of EP20K600EBC652-1X – APEX-20KE FPGA (652-BGA)

The EP20K600EBC652-1X is an APEX-20KE field programmable gate array in a 652-ball BGA (45×45) package, optimized for system integration and high-density logic implementations. Built on the APEX 20K family architecture, the device combines look-up table (LUT) logic, product-term logic and embedded memory blocks to support complex, register- and memory-intensive designs across commercial temperature ranges.

With 24,320 logic elements, approximately 0.31 Mbits of embedded memory and 488 user I/Os, this device targets applications that require dense programmable logic, flexible I/O and on-chip memory with commercial-grade operating conditions.

Key Features

  • Core architecture  MultiCore architecture integrating LUT logic, product-term logic and embedded system blocks (ESBs) for flexible mapping of register- and combinatorial-intensive functions.
  • Logic density  24,320 logic elements and approximately 1,537,000 system gates enable implementation of large, complex logic functions on a single device.
  • Embedded memory  Approximately 311,296 bits of on-chip RAM available for FIFOs, dual-port RAM and CAM-style implementations via ESBs.
  • I/O capability  488 user I/Os with MultiVolt support to interface with 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling; support for high-speed external memories including DDR SDRAM and ZBT SRAM.
  • Clock management  Flexible clocking with up to four phase-locked loops (PLLs), up to eight global clock signals and features for reducing skew and adjusting phase/delay.
  • High-speed serial/parallel I/O  LVDS support up to 840 Mbits per channel and bidirectional I/O performance enabling fast tCO and tSU for complex logic paths.
  • Low-power design  Designed for reduced power operation with internal supply voltage in the 1.71–1.89 V range and ESB power-saving modes referenced in the family architecture.
  • Package & mounting  652-BGA (45×45) surface-mount package suited to high-density PCB layouts and automated assembly processes.
  • Commercial temperature grade  Operating range from 0 °C to 85 °C; RoHS-compliant manufacturing.

Typical Applications

  • System integration & SOPC designs  Use the integrated LUT/product-term/ESB architecture to consolidate multiple subsystems and implement SOPC-style functions on a single FPGA.
  • Memory interface controllers  Implement DDR SDRAM and ZBT SRAM controllers using the device’s embedded RAM and high-speed I/O capabilities.
  • High-speed I/O bridging  Bridge diverse I/O standards and voltage domains with MultiVolt I/O support and LVDS channels for high-throughput links.
  • Complex digital signal control  Realize register-heavy and combinatorial logic for signal processing, protocol handling and timing-critical control functions.

Unique Advantages

  • Highly integrated architecture: MultiCore design and ESBs combine logic and embedded memory to reduce external component count and simplify board-level design.
  • Scalable logic capacity: 24,320 logic elements and over one million system gates support migration from mid- to high-density implementations without changing the FPGA family.
  • Versatile I/O and memory support: MultiVolt I/O, LVDS and external memory interfaces allow direct connection to a wide range of peripherals and DRAM devices.
  • Flexible clocking: Multiple PLLs and global clock resources enable low-skew, phase-adjustable clocking for complex timing domains.
  • Commercial-ready packaging: 652-BGA surface-mount package offers a compact footprint for high-density boards while supporting automated assembly.
  • Regulatory and environmental compliance: RoHS-compliant device construction reduces end-product compliance effort.

Why Choose EP20K600EBC652-1X?

The EP20K600EBC652-1X delivers a balanced mix of logic density, embedded memory and flexible I/O in a single APEX-20KE device. Its MultiCore architecture and ESBs make it appropriate for designs that combine register-rich logic, memory buffering and high-speed peripheral interfaces, while the included clock management features support complex timing requirements.

Engineers and procurement teams seeking a commercial-grade FPGA with substantial on-chip resources, broad I/O adaptability and a compact 652-BGA package will find this device suited for system consolidation, memory interface designs and high-throughput I/O applications.

Request a quote or submit a procurement inquiry to receive pricing, availability and delivery options for EP20K600EBC652-1X.

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