EP20K600EBC652-1X
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 311296 24320 652-BGA |
|---|---|
| Quantity | 6 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 652-BGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 652-BGA | Number of I/O | 488 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2432 | Number of Logic Elements/Cells | 24320 | ||
| Number of Gates | 1537000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 311296 |
Overview of EP20K600EBC652-1X – APEX-20KE FPGA (652-BGA)
The EP20K600EBC652-1X is an APEX-20KE field programmable gate array in a 652-ball BGA (45×45) package, optimized for system integration and high-density logic implementations. Built on the APEX 20K family architecture, the device combines look-up table (LUT) logic, product-term logic and embedded memory blocks to support complex, register- and memory-intensive designs across commercial temperature ranges.
With 24,320 logic elements, approximately 0.31 Mbits of embedded memory and 488 user I/Os, this device targets applications that require dense programmable logic, flexible I/O and on-chip memory with commercial-grade operating conditions.
Key Features
- Core architecture MultiCore architecture integrating LUT logic, product-term logic and embedded system blocks (ESBs) for flexible mapping of register- and combinatorial-intensive functions.
- Logic density 24,320 logic elements and approximately 1,537,000 system gates enable implementation of large, complex logic functions on a single device.
- Embedded memory Approximately 311,296 bits of on-chip RAM available for FIFOs, dual-port RAM and CAM-style implementations via ESBs.
- I/O capability 488 user I/Os with MultiVolt support to interface with 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling; support for high-speed external memories including DDR SDRAM and ZBT SRAM.
- Clock management Flexible clocking with up to four phase-locked loops (PLLs), up to eight global clock signals and features for reducing skew and adjusting phase/delay.
- High-speed serial/parallel I/O LVDS support up to 840 Mbits per channel and bidirectional I/O performance enabling fast tCO and tSU for complex logic paths.
- Low-power design Designed for reduced power operation with internal supply voltage in the 1.71–1.89 V range and ESB power-saving modes referenced in the family architecture.
- Package & mounting 652-BGA (45×45) surface-mount package suited to high-density PCB layouts and automated assembly processes.
- Commercial temperature grade Operating range from 0 °C to 85 °C; RoHS-compliant manufacturing.
Typical Applications
- System integration & SOPC designs Use the integrated LUT/product-term/ESB architecture to consolidate multiple subsystems and implement SOPC-style functions on a single FPGA.
- Memory interface controllers Implement DDR SDRAM and ZBT SRAM controllers using the device’s embedded RAM and high-speed I/O capabilities.
- High-speed I/O bridging Bridge diverse I/O standards and voltage domains with MultiVolt I/O support and LVDS channels for high-throughput links.
- Complex digital signal control Realize register-heavy and combinatorial logic for signal processing, protocol handling and timing-critical control functions.
Unique Advantages
- Highly integrated architecture: MultiCore design and ESBs combine logic and embedded memory to reduce external component count and simplify board-level design.
- Scalable logic capacity: 24,320 logic elements and over one million system gates support migration from mid- to high-density implementations without changing the FPGA family.
- Versatile I/O and memory support: MultiVolt I/O, LVDS and external memory interfaces allow direct connection to a wide range of peripherals and DRAM devices.
- Flexible clocking: Multiple PLLs and global clock resources enable low-skew, phase-adjustable clocking for complex timing domains.
- Commercial-ready packaging: 652-BGA surface-mount package offers a compact footprint for high-density boards while supporting automated assembly.
- Regulatory and environmental compliance: RoHS-compliant device construction reduces end-product compliance effort.
Why Choose EP20K600EBC652-1X?
The EP20K600EBC652-1X delivers a balanced mix of logic density, embedded memory and flexible I/O in a single APEX-20KE device. Its MultiCore architecture and ESBs make it appropriate for designs that combine register-rich logic, memory buffering and high-speed peripheral interfaces, while the included clock management features support complex timing requirements.
Engineers and procurement teams seeking a commercial-grade FPGA with substantial on-chip resources, broad I/O adaptability and a compact 652-BGA package will find this device suited for system consolidation, memory interface designs and high-throughput I/O applications.
Request a quote or submit a procurement inquiry to receive pricing, availability and delivery options for EP20K600EBC652-1X.

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