EP20K600EFC33-1
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 588 311296 24320 1020-BBGA |
|---|---|
| Quantity | 1,044 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 588 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2432 | Number of Logic Elements/Cells | 24320 | ||
| Number of Gates | 1537000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 311296 |
Overview of EP20K600EFC33-1 – APEX-20KE Field Programmable Gate Array (FPGA) IC
The EP20K600EFC33-1 is an APEX-20KE series FPGA delivering a high-density, system-on-a-programmable-chip architecture optimized for complex logic and embedded-memory integration. Its MultiCore architecture combines LUT-based logic, product-term logic, and embedded system blocks to support register‑intensive and memory‑intensive functions.
Targeted at commercial applications requiring high I/O count and on-chip memory, this device offers 24,320 logic elements, approximately 0.31 Mbits of embedded memory, and 588 user I/O pins for demanding programmable-logic tasks where integration and flexible I/O are important.
Key Features
- Core Architecture MultiCore architecture integrating look-up table (LUT) logic, product-term logic, and embedded memory for balanced logic and memory implementation.
- Logic Density 24,320 logic elements (LEs) and approximately 1,537,000 system gates provide high-density programmable logic resources for complex designs.
- Embedded Memory Approximately 0.31 Mbits (311,296 bits) of on-chip RAM organized in embedded system blocks (ESBs) suitable for FIFOs, dual-port RAM, and CAM functions.
- I/O and Interface Flexibility 588 user I/O pins with MultiVolt I/O support and programmable I/O features enable interfacing with multiple voltage domains and high-speed external memory interfaces.
- Clock Management Advanced clock circuitry with up to four PLLs, a built-in low-skew clock tree and multiple global clock signals to support synchronized, high-performance timing architectures.
- Power and Supply Internal voltage operation specified between 1.71 V and 1.89 V and device-level options for power-saving ESB modes to help manage system power.
- Package and Mounting Available in a 1020-BBGA package (supplier device package 1020-FBGA, 33×33) designed for surface-mount assembly.
- Commercial Temperature Grade Rated for commercial operation from 0 °C to 85 °C and RoHS compliant for environmental and manufacturing requirements.
Typical Applications
- High‑density logic controllers Implement complex finite-state machines, protocol handling, and datapath logic using the device’s large logic element and gate count.
- Embedded memory buffering Use the ESBs and on-chip RAM for FIFO buffering, temporary storage, and dual-port RAM needs in data-path and streaming applications.
- High‑I/O interface hubs Leverage 588 I/O pins and MultiVolt I/O support to bridge multiple peripherals and memory interfaces within commercial systems.
- Clocked system functions Use the integrated PLLs and low‑skew clock tree for synchronized multi-clock designs and timing-critical subsystems.
Unique Advantages
- Highly integrated programmable fabric: 24,320 logic elements combined with embedded memory reduce external component count and simplify board design.
- Significant on‑chip RAM capacity: Approximately 0.31 Mbits of embedded memory supports buffering and local data storage without immediate reliance on external RAM.
- Extensive I/O resources: 588 user I/O pins provide flexibility for multi‑device interfacing and dense connector or bus implementations.
- Advanced clocking features: Multiple PLLs and a built-in low‑skew clock tree facilitate precise timing management for multi-domain systems.
- Compact surface-mount packaging: The 1020-BBGA (33×33) package enables high-density PCB layouts while accommodating sizable logic and I/O counts.
- Commercial-grade and RoHS compliant: Designed for commercial temperature ranges and RoHS compliance to meet standard manufacturing and environmental requirements.
Why Choose EP20K600EFC33-1?
The EP20K600EFC33-1 positions itself as a high-density, commercially rated FPGA choice where integrated memory, abundant logic elements, and broad I/O counts are required. Its MultiCore architecture and embedded system blocks make it suitable for designs that merge register-intensive logic with embedded memory functions while keeping BOM complexity down.
This device is well suited to commercial and enterprise designs that need scalable programmable logic, flexible clocking, and dense I/O within a compact surface-mount package, delivering long-term value through integration and a feature set tailored to complex system-level integration.
Request a quote or submit an inquiry to get pricing, availability, and additional procurement details for EP20K600EFC33-1.

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