EP20K600EBC652-3

IC FPGA 488 I/O 652BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 311296 24320 652-BGA

Quantity 128 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package652-BGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case652-BGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2432Number of Logic Elements/Cells24320
Number of Gates1537000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits311296

Overview of EP20K600EBC652-3 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 311296 24320 652-BGA

The EP20K600EBC652-3 is an APEX-20KE family FPGA providing MultiCore architecture with LUT-based logic and embedded system blocks (ESBs) for memory and product-term functions. This surface-mount, commercial-grade device delivers a high-density programmable logic platform with substantial I/O and on-chip memory for complex, interface-rich embedded systems.

Designed for applications that require large logic capacity and flexible I/O, the device combines 24,320 logic elements with approximately 0.31 Mbits of embedded memory and 488 user I/Os to support data-path, control and memory interfacing tasks while operating from a 1.71 V to 1.89 V internal supply.

Key Features

  • Core architecture MultiCore architecture with LUT-based logic and embedded system blocks (ESBs) for implementing register-intensive and memory-centric functions.
  • Logic capacity 24,320 logic elements providing scalable combinatorial and sequential logic resources for mid-to-high complexity designs.
  • Embedded memory Approximately 0.31 Mbits of on-chip RAM suitable for FIFOs, dual-port RAM and CAM-style implementations using ESBs.
  • I/O and interfaces 488 user I/Os to support extensive peripheral and external memory connectivity; MultiVolt I/O interface support noted in the family datasheet for common voltage domains.
  • Performance and timing Family-level features include flexible clock management with multiple PLLs, a built-in low-skew clock tree and support for up to eight global clocks (as described for APEX 20K devices).
  • Power Designed for low-power operation with an internal supply voltage in the 1.71 V–1.89 V range for this device variant.
  • Package and mounting 652-BGA package (45 × 45) in a surface-mount form factor for high-density board integration.
  • Operating conditions and compliance Commercial operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Communications equipment Use the device for protocol bridging, interface aggregation and FPGA-based packet processing where dense logic and abundant I/O are required.
  • Memory interface controllers Implement DDR SDRAM or ZBT SRAM controller logic and buffering using the device’s ESBs and on-chip RAM resources (family-level support for high-speed external memories is documented).
  • Embedded system controllers Ideal for control and data-path tasks in embedded platforms that need configurable logic, FIFOs and dual-port RAM implemented on-chip.
  • High-density digital processing Suitable for mid-range digital signal and control applications that benefit from 24,320 logic elements and extensive I/O pinout.

Unique Advantages

  • High logic and memory density: 24,320 logic elements together with approximately 0.31 Mbits of embedded RAM enable complex logic and buffering on a single device.
  • Rich I/O complement: 488 user I/Os provide the connectivity needed to interface multiple external devices and memory buses without external multiplexing.
  • Flexible on-chip resources: Embedded system blocks (ESBs) allow implementation of FIFOs, dual-port RAM and CAM functions, reducing external memory dependency.
  • Board-level integration: 652-BGA (45 × 45) surface-mount package supports high-density PCB layouts and modern assembly processes.
  • Commercial-grade operating range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial and industrial-adjacent applications where that temperature range is required.
  • Standards-conscious supply and compliance: Operates from a 1.71 V–1.89 V internal supply and is RoHS compliant, supporting modern manufacturing and environmental requirements.

Why Choose EP20K600EBC652-3?

The EP20K600EBC652-3 positions itself as a mid-to-high-density FPGA option within the APEX-20KE family, offering a balanced combination of logic elements, embedded memory and abundant I/O in a compact 652-BGA package. It is well suited for designers who need significant on-chip resources for interface-heavy, memory-centric or control-focused applications while maintaining a commercial temperature rating.

Customers seeking a programmable, integrative solution can leverage the device’s MultiCore architecture and ESBs to consolidate multiple functions on-chip, reduce bill-of-materials complexity and accelerate system development using the APEX 20K family feature set documented in the datasheet.

Request a quote or submit a parts inquiry to receive pricing and availability information for the EP20K600EBC652-3.

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