EP20K600EBC652-3
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 311296 24320 652-BGA |
|---|---|
| Quantity | 128 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 652-BGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 652-BGA | Number of I/O | 488 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2432 | Number of Logic Elements/Cells | 24320 | ||
| Number of Gates | 1537000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 311296 |
Overview of EP20K600EBC652-3 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 311296 24320 652-BGA
The EP20K600EBC652-3 is an APEX-20KE family FPGA providing MultiCore architecture with LUT-based logic and embedded system blocks (ESBs) for memory and product-term functions. This surface-mount, commercial-grade device delivers a high-density programmable logic platform with substantial I/O and on-chip memory for complex, interface-rich embedded systems.
Designed for applications that require large logic capacity and flexible I/O, the device combines 24,320 logic elements with approximately 0.31 Mbits of embedded memory and 488 user I/Os to support data-path, control and memory interfacing tasks while operating from a 1.71 V to 1.89 V internal supply.
Key Features
- Core architecture MultiCore architecture with LUT-based logic and embedded system blocks (ESBs) for implementing register-intensive and memory-centric functions.
- Logic capacity 24,320 logic elements providing scalable combinatorial and sequential logic resources for mid-to-high complexity designs.
- Embedded memory Approximately 0.31 Mbits of on-chip RAM suitable for FIFOs, dual-port RAM and CAM-style implementations using ESBs.
- I/O and interfaces 488 user I/Os to support extensive peripheral and external memory connectivity; MultiVolt I/O interface support noted in the family datasheet for common voltage domains.
- Performance and timing Family-level features include flexible clock management with multiple PLLs, a built-in low-skew clock tree and support for up to eight global clocks (as described for APEX 20K devices).
- Power Designed for low-power operation with an internal supply voltage in the 1.71 V–1.89 V range for this device variant.
- Package and mounting 652-BGA package (45 × 45) in a surface-mount form factor for high-density board integration.
- Operating conditions and compliance Commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Communications equipment Use the device for protocol bridging, interface aggregation and FPGA-based packet processing where dense logic and abundant I/O are required.
- Memory interface controllers Implement DDR SDRAM or ZBT SRAM controller logic and buffering using the device’s ESBs and on-chip RAM resources (family-level support for high-speed external memories is documented).
- Embedded system controllers Ideal for control and data-path tasks in embedded platforms that need configurable logic, FIFOs and dual-port RAM implemented on-chip.
- High-density digital processing Suitable for mid-range digital signal and control applications that benefit from 24,320 logic elements and extensive I/O pinout.
Unique Advantages
- High logic and memory density: 24,320 logic elements together with approximately 0.31 Mbits of embedded RAM enable complex logic and buffering on a single device.
- Rich I/O complement: 488 user I/Os provide the connectivity needed to interface multiple external devices and memory buses without external multiplexing.
- Flexible on-chip resources: Embedded system blocks (ESBs) allow implementation of FIFOs, dual-port RAM and CAM functions, reducing external memory dependency.
- Board-level integration: 652-BGA (45 × 45) surface-mount package supports high-density PCB layouts and modern assembly processes.
- Commercial-grade operating range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial and industrial-adjacent applications where that temperature range is required.
- Standards-conscious supply and compliance: Operates from a 1.71 V–1.89 V internal supply and is RoHS compliant, supporting modern manufacturing and environmental requirements.
Why Choose EP20K600EBC652-3?
The EP20K600EBC652-3 positions itself as a mid-to-high-density FPGA option within the APEX-20KE family, offering a balanced combination of logic elements, embedded memory and abundant I/O in a compact 652-BGA package. It is well suited for designers who need significant on-chip resources for interface-heavy, memory-centric or control-focused applications while maintaining a commercial temperature rating.
Customers seeking a programmable, integrative solution can leverage the device’s MultiCore architecture and ESBs to consolidate multiple functions on-chip, reduce bill-of-materials complexity and accelerate system development using the APEX 20K family feature set documented in the datasheet.
Request a quote or submit a parts inquiry to receive pricing and availability information for the EP20K600EBC652-3.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018