EP20K600EFC33-3

IC FPGA 588 I/O 1020FBGA
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 588 311296 24320 1020-BBGA, FCBGA

Quantity 1,367 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGA, FCBGANumber of I/O588Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2432Number of Logic Elements/Cells24320
Number of Gates1537000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits311296

Overview of EP20K600EFC33-3 – APEX-20K® Field Programmable Gate Array (FPGA) IC

The EP20K600EFC33-3 is an APEX-20K® field programmable gate array (FPGA) from Altera, supplied in a 1020-BBGA FCBGA (33×33) package for surface-mount assembly. It is a commercial-grade, RoHS-compliant device intended for embedded and commercial system designs.

With 24,320 logic elements, approximately 0.31 Mbits of embedded memory (311,296 total RAM bits), 588 I/O pins and about 1,537,000 gates, the device targets applications that require substantial logic density and I/O capacity while operating from a 1.71–1.89 V core supply and within a 0 °C to 85 °C temperature range.

Key Features

  • Core Logic 24,320 logic elements provide substantial capacity for implementing complex custom logic, state machines and glue logic within a single FPGA.
  • Gate Count Approximately 1,537,000 gates enable large-scale logic integration and consolidation of discrete functions.
  • Embedded Memory Approximately 0.31 Mbits of on-chip RAM (311,296 bits) supports buffering, FIFOs and small data storage needs directly inside the FPGA fabric.
  • I/O Density 588 I/O pins deliver extensive interfacing options for parallel buses, multiple peripherals and multi-channel connectivity.
  • Package and Mounting 1020-BBGA FCBGA (33×33) package, surface-mount mounting type, suitable for compact board layouts where high pin count is required.
  • Power Core voltage supply range of 1.71 V to 1.89 V for compatibility with specified system power rails.
  • Operating Range Commercial operating temperature range of 0 °C to 85 °C to match standard commercial embedded applications.
  • Regulatory RoHS-compliant construction for environmental and regulatory compatibility in commercial products.

Typical Applications

  • Commercial Embedded Systems — Implement custom control logic, protocol handling and system integration where up to 24,320 logic elements and high I/O count are required.
  • I/O-Intensive Interfaces — Use the 588 I/Os for bridging multiple peripherals, parallel interfaces or multi-channel sensor arrays.
  • Data Buffering and Small Memory Functions — Leverage approximately 0.31 Mbits of embedded RAM for FIFOs, buffering and on-chip data staging in signal-processing chains.
  • Prototyping and Integration — Consolidate discrete logic and custom functions into a single FPGA package to reduce board complexity and accelerate design iterations.

Unique Advantages

  • High Logic Capacity: 24,320 logic elements provide the density needed to integrate complex designs and reduce reliance on external CPLDs or discrete logic.
  • Extensive I/O Resources: 588 I/Os enable direct connections to numerous peripherals and parallel buses without extra interfacing components.
  • On-Chip Memory: Approximately 0.31 Mbits of embedded RAM reduces external memory dependency for buffering and temporary storage.
  • Compact Ball Grid Package: 1020-BBGA FCBGA (33×33) offers a high pin-count footprint for space-constrained boards while supporting surface-mount assembly.
  • Commercial Temperature Rating: Rated for 0 °C to 85 °C, suitable for a wide range of non-automotive, commercial applications.
  • Regulatory Compliance: RoHS compliance supports environmental requirements for many commercial products.

Why Choose EP20K600EFC33-3?

The EP20K600EFC33-3 combines significant logic density, substantial I/O resources and embedded memory in a compact FCBGA package, making it well suited for commercial embedded systems that require consolidation of functions and flexible interfacing. Its specified voltage range and commercial temperature rating align with standard board-level power and thermal designs.

Designed by Altera, this APEX-20K® FPGA offers a balanced option for designers who need large-scale programmable logic and on-chip memory without moving into industrial or automotive grades. It provides a clear path to reduce BOM complexity and accelerate development for commercial applications.

Request a quote or submit an RFQ to receive pricing and availability information for EP20K600EFC33-3.

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