EP20K600EFC672-3N

The EP20K600EFC672-3N is an APEX-20KE series Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA package. It delivers a mid-range combination of programmable logic, on-chip memory, and a high I/O count for system designs that require flexible digital implementation and board-level integration.

Key on-chip resources include 24,320 logic elements, approximately 0.31 Mbits of embedded memory, and 508 user I/O pins, while the device operates from a 1.71 V–1.89 V core supply and is specified for commercial temperature operation (0°C to 85°C).

Key Features

• Core Logic  24,320 logic elements provide programmable logic capacity suitable for medium-density digital implementations.
• Embedded Memory  Approximately 0.31 Mbits (311,296 bits) of on-chip RAM supports local buffering and state storage for custom logic functions.
• I/O and Gate Count  508 user I/O pins and a device gate count of 1,537,000 enable broad connectivity and substantial logic integration on a single device.
• Package and Mounting  672-ball BBGA package (supplier device package: 672-FBGA, 27×27) in a surface-mount form factor for compact board layouts.
• Power  Core voltage supply specified at 1.71 V to 1.89 V for the device core.
• Temperature and Grade  Commercial grade operation from 0°C to 85°C.
• Regulatory  RoHS compliant.

Typical Applications

• Custom Digital Systems  Implement application-specific logic, protocol bridges, or control algorithms using the device's 24,320 logic elements and substantial gate count.
• I/O-Intensive Interfaces  High pin count (508 I/O) supports designs that require multiple parallel interfaces or numerous external peripherals.
• Embedded Memory-Dependent Functions  On-chip RAM (approximately 0.31 Mbits) enables buffering, FIFOs, and small data storage for timing-critical logic paths.

Unique Advantages

• High Logic Density: 24,320 logic elements and 1,537,000 gates allow consolidation of complex digital functions into a single FPGA device.
• Substantial I/O Capacity: 508 user I/O pins reduce the need for external I/O expanders and simplify board-level connectivity.
• On-Device Memory: Approximately 0.31 Mbits of embedded RAM supports local data handling and lowers external memory requirements for moderate buffering needs.
• Compact BGA Package: 672-ball BBGA (27×27) package enables a high pin count in a compact surface-mount form factor for dense PCBs.
• Low-Voltage Core: 1.71 V–1.89 V core supply supports modern low-voltage FPGA architectures and power budgets.
• RoHS Compliant: Meets lead-free environmental requirements for compliant design and manufacturing.

Why Choose EP20K600EFC672-3N?

The EP20K600EFC672-3N positions itself as a mid-density FPGA option that balances programmable logic resources, embedded memory, and a high I/O count in a compact BGA package. Its combination of 24,320 logic elements, 508 I/O pins, and on-chip RAM makes it suited for designs that require integrated digital functionality with substantial board-level connectivity while operating within commercial temperature ranges.

This device is appropriate for engineering teams and procurement looking for a RoHS-compliant, surface-mount FPGA that provides scalable logic integration and memory resources in a single-package solution.

Request a quote today to evaluate EP20K600EFC672-3N for your next design and receive pricing and availability information tailored to your procurement needs.