EP20K60EBC356-2

IC FPGA 196 I/O 356BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 196 356-LBGA

Quantity 1,586 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case356-LBGANumber of I/O196Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells2560
Number of Gates162000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of EP20K60EBC356-2 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 196 356-LBGA

The EP20K60EBC356-2 is a commercial-grade APEX-20KE® field programmable gate array (FPGA) from Altera. It provides a mid-density, reprogrammable logic fabric designed for digital logic implementation where integrated logic, embedded memory, and I/O capacity are required.

Key on-chip resources include 2,560 logic elements, 32,768 bits of embedded RAM, and 196 I/O pins. The device comes in a 356-LBGA (356-BGA, 35×35) package, operates from a 1.71 V to 1.89 V core supply, and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

  • Logic Capacity 2,560 logic elements for implementing custom digital logic and medium-complexity functions.
  • Embedded Memory 32,768 bits of on-chip RAM (approximately 32.8 Kbits) to support buffering, small FIFOs, and state storage.
  • I/O Count 196 user I/O pins to interface with external peripherals, sensors, and system buses.
  • Gate Density Approximately 162,000 gates of overall device complexity for mapping a wide range of logic designs.
  • Power and Supply Core voltage supply range of 1.71 V to 1.89 V for compatible system power rails.
  • Package & Mounting 356-LBGA (356-BGA, 35×35) package in a surface-mount form factor suitable for compact board layouts.
  • Temperature Range Commercial operating range from 0 °C to 85 °C for standard commercial applications.
  • RoHS Compliance RoHS compliant for environmental and regulatory alignment.

Typical Applications

  • Prototyping and Development Use as a reprogrammable platform for implementing and validating digital logic, state machines, and custom IP during design cycles.
  • Control and Interface Logic Implement glue logic, protocol translation, and I/O aggregation where medium-density logic and plentiful I/O are required.
  • Embedded System Integration Provide custom datapath elements, buffering, and peripheral interfacing in compact, surface-mount designs.

Unique Advantages

  • Balanced Logic and Memory The combination of 2,560 logic elements and 32,768 bits of on-chip RAM supports mixed logic and small memory functions without external SRAM for many designs.
  • High I/O Count in a Compact Package 196 I/O pins in a 356-LBGA package enable rich peripheral connectivity while keeping PCB footprint compact.
  • Commercial-Grade Reliability Specified for 0 °C to 85 °C operation to meet standard commercial application requirements.
  • Controlled Power Envelope Narrow core supply range (1.71 V–1.89 V) simplifies power-supply design and integration with compatible rails.
  • Surface-Mount Convenience Surface-mount 356-LBGA packaging supports automated assembly and dense board layouts.

Why Choose EP20K60EBC356-2?

The EP20K60EBC356-2 is positioned as a mid-density, commercial FPGA suitable for designers who need a balanced mix of logic elements, embedded RAM, and a high I/O count in a compact BGA package. Its specifications make it appropriate for a wide range of commercial digital logic tasks where reprogrammability and on-chip resources reduce external component count.

This device is a practical choice for development teams and product designers looking for a commercially graded FPGA solution that combines integration, moderate gate density, and straightforward thermal and power requirements.

Request a quote or submit an inquiry to receive pricing and availability information for the EP20K60EBC356-2. Our team can help you evaluate this device for your next commercial FPGA design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up