EP20K60EFC144-2XN

IC FPGA 93 I/O 144FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 93 32768 2560 144-BGA

Quantity 1,547 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-FBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-BGANumber of I/O93Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells2560
Number of Gates162000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of EP20K60EFC144-2XN – APEX-20KE FPGA, 144‑BGA

The EP20K60EFC144-2XN is an APEX-20KE field programmable gate array supplied in a 144-BGA (13×13) package for surface-mount assembly. It integrates 2,560 logic elements, 32,768 bits of on-chip RAM, and 93 user I/O pins, delivering a compact, reprogrammable logic platform for commercial embedded and digital applications.

Built on the APEX 20K family architecture, this device combines LUT-based logic, product-term logic and embedded system blocks to support register‑intensive and memory‑centric functions while offering flexible I/O and clock management for system designs that require deterministic timing and multi‑voltage interfacing.

Key Features

  • Logic Capacity — 2,560 logic elements and up to 162,000 system gates provide mid-range programmable logic resources for control, glue‑logic and moderate-density datapath implementations.
  • On-chip Memory — 32,768 bits of embedded RAM (ESBs) suitable for FIFOs, small dual‑port RAM blocks and other memory functions used in buffering and state storage.
  • MultiCore Architecture — Integrates LUT logic, product‑term logic and embedded memory to support both register‑intensive and combinatorial functions in the same device.
  • Flexible I/O — 93 user I/O pins with MultiVolt I/O interface support (1.8 V, 2.5 V, 3.3 V, 5.0 V as supported by the series) for easy interfacing with a variety of peripherals and voltage domains.
  • Clock Management — Series-level features include up to four PLLs, up to eight global clock signals, a built-in low‑skew clock tree, and programmable phase/delay shifting for predictable timing control.
  • Low‑Voltage Internal Supply — Operates with an internal supply in the 1.71 V to 1.89 V range, optimized for low-power operation on 1.8 V cores.
  • Package & Assembly — 144‑BGA (144‑FBGA, 13×13) surface-mount package suitable for compact board designs.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C and compliant with RoHS environmental requirements.

Typical Applications

  • Communications & Networking — Implement protocol bridging, packet buffering and interface logic using the device’s programmable I/O and embedded RAM.
  • Embedded Control — Use as glue logic and real‑time control in instrumentation, consumer electronics and automation where moderate logic density and on‑chip memory are required.
  • Memory Interface & Buffering — Leverage ESBs for FIFO buffers and small dual‑port memory structures in systems that interface to external memory devices.
  • Prototyping & Development — Mid-density FPGA resources and flexible I/O make the device suitable for proof‑of‑concept designs and evaluation of custom logic functions.

Unique Advantages

  • Balanced Logic and Memory: Provides a combined 2,560 logic elements and 32,768 bits of embedded RAM to implement both control logic and local data storage without external RAM for many use cases.
  • Multi‑Voltage I/O Compatibility: Supports a range of I/O voltage levels to simplify integration with different peripheral devices and system voltage domains.
  • Deterministic Clocking: Integrated PLLs and a low‑skew clock tree help maintain predictable timing across global clocks for synchronous designs.
  • Compact Packaging: 144‑BGA (13×13) footprint enables high‑density board layouts while retaining robust I/O counts for small form‑factor applications.
  • Commercial Temperature Range: Rated 0 °C to 85 °C to match typical commercial product environments.
  • RoHS Compliant: Complies with RoHS requirements for environmentally conscious manufacturing and assembly.

Why Choose EP20K60EFC144-2XN?

The EP20K60EFC144-2XN positions itself as a capable mid-density FPGA option within the APEX-20KE family, offering a practical balance of logic elements, embedded RAM and flexible I/O in a compact 144‑BGA package. Its architecture supports a mix of register‑intensive logic and memory‑centric functions, while the integrated clock management and MultiVolt I/O capabilities make it suitable for a wide range of commercial embedded designs.

This device is well suited to teams developing communications interfaces, embedded controllers, and prototype systems that require reprogrammable logic with built‑in memory and predictable timing, backed by the broader APEX‑20K series feature set.

Request a quote or submit an inquiry to obtain pricing and availability for the EP20K60EFC144-2XN.

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