EP20K60EBC356-1

IC FPGA 196 I/O 356BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 196 32768 2560 356-LBGA

Quantity 517 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case356-LBGANumber of I/O196Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells2560
Number of Gates162000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of EP20K60EBC356-1 – APEX-20KE® Field Programmable Gate Array (FPGA), 196 I/Os, ~32.8kbits RAM, 2,560 logic elements, 356-LBGA

The EP20K60EBC356-1 is a commercial-grade APEX-20KE family FPGA offered in a 356-LBGA package. It implements a MultiCore™ architecture that integrates look-up table (LUT) logic, product-term logic and embedded memory blocks (ESBs), making it suitable for designs that require a mix of register-intensive logic and on-chip memory.

With 2,560 logic elements, approximately 32.8kbits of embedded RAM, 196 user I/Os and a maximum system gate count of 162,000, this device targets commercial embedded systems, communications and general-purpose programmable logic applications where moderate density, flexible I/O and on-chip memory are required.

Key Features

  • Programmable Logic Core MultiCore architecture combining LUT-based logic and product-term logic for efficient implementation of register- and combinatorial-intensive functions; device family gate density listed at 162,000 maximum system gates.
  • Logic Resources 2,560 logic elements available to implement custom logic and state machines in a compact FPGA footprint.
  • Embedded Memory 32,768 total RAM bits (approximately 32.8kbits) provided by ESBs for FIFOs, dual-port RAM or CAM-style structures.
  • I/O Capability 196 user I/O pins to support a wide range of peripheral interfaces and board-level connections.
  • Clock Management Family-level support for up to four phase-locked loops (PLLs), multiple global clocks and clock features such as ClockShift and ClockBoost for flexible timing control.
  • Power and Voltage Internal supply and operating ranges provided for low-power operation; this device’s specified internal supply range is 1.71 V to 1.89 V per product data.
  • Package and Mounting 356-LBGA (356-BGA, 35×35 mm) surface-mount package for high-density board integration.
  • Operating Range and Compliance Commercial temperature grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental requirements.

Typical Applications

  • Embedded control and logic Implement control state machines, protocol handlers and glue logic where on-chip RAM and moderate logic density accelerate development.
  • Communications and interfaces Use the device’s flexible I/O and on-chip memory for packet buffering, interface bridging and protocol adaptation in commercial communication equipment.
  • Memory buffering and data path Leverage ESBs for FIFO and dual-port RAM implementations to support streaming and buffering between subsystems.
  • Prototyping and system integration Rapidly iterate system-on-programmable-chip (SOPC) concepts that combine logic, memory and I/O in a single FPGA package.

Unique Advantages

  • Integrated memory and logic: ESBs and LUT/product-term logic in a single device reduce the need for external RAM in many buffering and control tasks.
  • Balanced density for commercial designs: 2,560 logic elements and a 162,000-gate system capacity provide a practical balance of logic and gate counts for mid-range applications.
  • Flexible I/O count: 196 user I/Os support multiple peripherals and board-level interfaces without excessive external routing complexity.
  • Clocking flexibility: Multiple PLLs and global clocks enable deterministic clock distribution and phase adjustments for synchronized multi-domain designs.
  • Compact, surface-mount package: The 356-LBGA (35×35) package provides high pin count and thermal characteristics suited to dense PCB layouts.
  • Commercial-grade and RoHS compliant: Designed for commercial operating conditions (0 °C to 85 °C) and compliant with RoHS environmental requirements.

Why Choose EP20K60EBC356-1?

The EP20K60EBC356-1 places a balanced set of programmable resources—logic elements, embedded RAM and a high I/O count—into a compact 356-LBGA package for commercial embedded designs. Its MultiCore architecture and ESB-based memory enable efficient implementation of mixed register- and memory-intensive functions, while on-chip clock management features provide the timing control needed for multi-domain applications.

This device is suited to engineers and teams developing commercial embedded systems, communications interfaces and prototype SOPC integrations who require moderate density, flexible I/O and embedded memory in a surface-mount FPGA solution.

If you would like pricing, availability or to request a quote for EP20K60EBC356-1, please submit an inquiry or request a quote through your preferred procurement channel.

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