EP20K600EFI672-2X

IC FPGA 508 I/O 672FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 508 311296 24320 672-BBGA

Quantity 776 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O508Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2432Number of Logic Elements/Cells24320
Number of Gates1537000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits311296

Overview of EP20K600EFI672-2X – APEX-20KE FPGA, 24,320 logic elements, 672‑BBGA

The EP20K600EFI672-2X is an APEX-20KE family field programmable gate array (FPGA) in a 672‑BBGA package for surface-mount applications. It combines a MultiCore architecture with embedded system blocks (ESBs) to deliver programmable logic alongside embedded memory and product-term logic for designs that require high-density logic and on-chip storage.

This device targets designs that need integrated memory functions, FIFO and dual-port RAM implementations, and flexible I/O and clocking resources within an industrial-grade temperature range and RoHS-compliant construction.

Key Features

  • Core Architecture MultiCore architecture integrating lookup-table (LUT) logic, product-term logic, and embedded memory as described for the APEX 20K family.
  • Logic Capacity 24,320 logic elements and up to 1,537,000 system gates, enabling high-density logic implementations.
  • Embedded Memory Approximately 0.31 Mbits of on-chip RAM (311,296 bits) with ESBs suitable for FIFO buffers, dual-port RAM, and content-addressable memory (CAM).
  • I/O 508 user I/O pins and MultiVolt I/O interface support in the APEX 20K family for interfacing with a range of voltage levels and advanced I/O standards.
  • Clock Management Family-level support for flexible clocking including up to four PLLs, a low-skew clock tree, and programmable clock-phase/delay features.
  • Power and Voltage Operates from an internal supply range of 1.71 V to 1.89 V and incorporates family-level low-power design features.
  • Package and Mounting Surface-mount 672‑BBGA (supplier package: 672‑FBGA 27×27) for high I/O density and compact board integration.
  • Industrial Rating and Environmental Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Typical Applications

  • Embedded systems and SOPC integration: Implement system-on-a-programmable-chip (SOPC) designs using the APEX 20K family’s MultiCore architecture and ESBs for integrated functions.
  • Memory interface and buffering: Use embedded RAM and ESBs for FIFO buffering, dual-port RAM, and CAM implementations in data-path designs.
  • High-density control and logic: Deploy the device where significant combinatorial and register-intensive logic is required, leveraging 24,320 logic elements.
  • High-speed I/O and protocol bridging: Support advanced I/O standards and multi-voltage interfacing for bridging peripherals and high-speed external memories.
  • Industrial equipment: Suitable for industrial applications that require extended temperature operation and surface-mount packaging.

Unique Advantages

  • Highly integrated architecture: Combines LUT logic, product-term logic, and ESBs to support mixed logic and memory functions on-chip.
  • Large logic and gate capacity: 24,320 logic elements with up to 1,537,000 system gates for complex, high-density designs.
  • On-chip embedded memory: Approximately 0.31 Mbits of RAM with ESB support for FIFOs and dual-port RAM reduces dependence on external memory for many buffering tasks.
  • Flexible clocking: Multiple PLLs and programmable clock features enable precise clock distribution and phase/delay control for synchronous systems.
  • Robust industrial operation: Rated for −40 °C to 100 °C and delivered in a compact 672‑BBGA surface-mount package for demanding environments.
  • Standards-capable I/O: Family-level support for multiple voltage interfaces and advanced I/O standards to accommodate varied peripheral and memory interfaces.

Why Choose EP20K600EFI672-2X?

The EP20K600EFI672-2X delivers a balance of high logic capacity, embedded memory, and advanced clock and I/O resources within an industrial-grade, RoHS-compliant 672‑BBGA package. Its APEX 20K family architecture—featuring MultiCore LUT/product-term logic and ESBs—addresses designs that require integrated memory functions alongside large-scale programmable logic.

This device is suited to engineers and teams building complex embedded systems, high-density control logic, and designs that benefit from on-chip buffering and flexible clock management, all within an extended operating temperature range.

Request a quote or submit an inquiry to discuss pricing, availability, and how the EP20K600EFI672-2X can fit your design requirements.

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