EP20K60EFC144-2X

IC FPGA 93 I/O 144FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 93 32768 2560 144-BGA

Quantity 607 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-FBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-BGANumber of I/O93Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells2560
Number of Gates162000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of EP20K60EFC144-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC, 2,560 logic elements, ~32,768-bit embedded RAM, 93 I/O, 144-BGA

The EP20K60EFC144-2X is an Intel APEX-20KE family field programmable gate array (FPGA) in a 144‑BGA package. It combines the APEX MultiCore architecture with LUT-based logic and embedded system blocks to deliver a programmable logic device tailored for commercial applications.

With 2,560 logic elements, approximately 32,768 bits of on-chip RAM and 93 user I/Os, this device targets system integration tasks such as protocol bridging, memory interfacing and embedded control where compact footprint, flexible I/O and on-chip memory are required. The device operates from a 1.71–1.89 V core supply and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

  • Core architecture – APEX MultiCore architecture integrating LUT logic and embedded system blocks (ESBs) to implement register‑intensive and memory functions.
  • Logic density – 2,560 logic elements providing a programmable fabric for combinatorial and sequential logic; approximately 162,000 maximum system gates reported for the EP20K60E family.
  • Embedded memory – Approximately 32,768 bits of on‑chip RAM suitable for FIFOs, small dual‑port RAMs or buffering functions via ESBs.
  • I/O and interface flexibility – 93 user I/O pins with MultiVolt I/O interface support (series capability for 1.8 V, 2.5 V, 3.3 V and 5.0 V levels) and programmable I/O features described in the APEX‑20K family documentation.
  • Clock management – Series features include multiple PLLs, a low‑skew clock tree and programmable clock phase/delay options to support synchronous system designs.
  • Low‑voltage operation – Core supply range 1.71 V to 1.89 V for lower power operation; device family also documents power‑saving ESB modes.
  • Package and mounting – 144‑BGA (144‑FBGA, 13×13 mm) surface‑mount package for compact board layouts.
  • Commercial grade – Specified for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

  • Embedded control and glue logic – Use the device’s LUT logic and 2,560 logic elements to implement custom control paths, protocol conversion and peripheral aggregation.
  • Memory interface and buffering – Approximately 32,768 bits of on‑chip RAM and ESB support enable FIFO buffers and local memory for external memory interfacing or data staging.
  • High‑speed I/O bridging – MultiVolt I/O support and APEX series I/O features make the device suitable for bridging between different I/O voltage domains.
  • Prototyping and OEM subsystem integration – Compact 144‑BGA package and surface‑mount footprint facilitate integration into space‑constrained commercial systems.

Unique Advantages

  • MultiCore integration: Combines LUT logic with embedded system blocks to consolidate logic and memory functions on a single device, reducing external components.
  • On‑chip memory: Approximately 32,768 bits of embedded RAM let you implement FIFOs and small buffers without external SRAM, simplifying board design.
  • Flexible I/O: Support for multiple voltage domains and programmable I/O features enables direct interfacing to a wide range of peripherals and legacy interfaces.
  • Deterministic clocking: Series clock management features such as PLLs and a low‑skew clock tree help maintain synchronous timing across complex logic functions.
  • Compact packaging: 144‑FBGA (13×13) surface‑mount package provides a high‑density solution for PCB real estate‑constrained designs.
  • Commercial readiness: RoHS compliant and specified for 0 °C to 85 °C operation for general commercial product deployment.

Why Choose EP20K60EFC144-2X?

The EP20K60EFC144-2X brings APEX‑20KE family architecture into a compact 144‑BGA package, delivering a balanced combination of logic capacity (2,560 logic elements), embedded memory (~32,768 bits) and flexible I/O for commercial applications. Its MultiCore approach and embedded system blocks enable integrated implementations of control logic and local memory functions that reduce board complexity.

This device is well suited to engineers and OEMs building compact, cost‑sensitive commercial systems that require programmable logic, on‑chip buffering and multi‑voltage interfacing. The device’s documented family features for clock management and I/O programmability provide scalable building blocks for mid‑range FPGA designs.

If you would like pricing, availability or a formal quote for EP20K60EFC144-2X, submit a request to receive a quote or sales inquiry.

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