EP20K60EFC324-1X

The EP20K60EFC324-1X is an APEX-20KE® Field Programmable Gate Array (FPGA) supplied in a 324-ball BGA package. It provides a mid-range programmable logic solution with 2,560 logic elements and on-chip embedded memory suited to commercial electronic designs.

Built for surface-mount PCB assembly and commercial temperature operation, this FPGA offers a balance of configurable logic, I/O capacity, and compact packaging for applications requiring programmable digital logic within a defined supply and temperature envelope.

Key Features

• Logic Capacity 2,560 logic elements (cells) for implementing custom digital logic and combinational/sequential functions.
• Embedded Memory Approximately 0.033 Mbits of total on-chip RAM (32,768 bits) for buffering, state storage, and small data structures.
• I/O Density 196 user I/Os to support a wide range of external interfaces and parallel connections.
• Gate Count Equivalent to 162,000 gates, enabling moderate-complexity logic integration.
• Power Core voltage supply range of 1.71 V to 1.89 V compatible with low-voltage FPGA power rails.
• Package & Mounting 324-ball FBGA (19 × 19) package, surface-mount for compact board-level integration.
• Operating Range Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant, meeting lead-free environmental requirements for commercial products.

Typical Applications

• Embedded Systems — Implement custom control logic and peripheral interfacing using the device's 2,560 logic elements and 196 I/Os.
• Consumer and Commercial Electronics — Integrate programmable logic in commercial-grade products that operate within 0 °C to 85 °C.
• Prototyping and Development — Use the FPGA's mid-range logic and I/O resources for hardware prototyping and validation of digital designs.
• Interface Bridging — Deploy the device for glue-logic and protocol adaptation where moderate gate count and multiple I/Os are required.

Unique Advantages

• Balanced Logic Density: 2,560 logic elements provide a mid-range capacity suitable for a variety of configurable functions without excessive board area.
• Integrated On-Chip Memory: 32,768 bits of embedded RAM to support local buffering and state retention, reducing external memory needs for modest data storage.
• High I/O Count: 196 I/Os allow flexible interfacing to peripherals, sensors, and other digital subsystems.
• Compact BGA Footprint: 324-FBGA (19 × 19) packaging enables a dense PCB layout while supporting surface-mount assembly processes.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for commercial product deployments.
• Low-Voltage Operation: Core supply range of 1.71 V to 1.89 V aligns with low-voltage system designs.

Why Choose EP20K60EFC324-1X?

The EP20K60EFC324-1X delivers a compact, configurable FPGA option with 2,560 logic elements, approximately 0.033 Mbits of embedded RAM, and 196 I/Os in a 324-ball BGA. Its commercial temperature rating and RoHS compliance make it suitable for integration into a wide range of commercial electronic products that require programmable logic and moderate I/O capacity.

Choose this device when a mid-range, surface-mount FPGA solution is needed to consolidate glue logic, implement custom peripherals, or prototype digital subsystems within the specified supply voltage and operating temperature constraints.

Request a quote or submit an inquiry to receive pricing and availability for the EP20K60EFC324-1X. Our team will provide the specific procurement details you need to move your design forward.