EP20K60EFC324-3N
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 196 324-BGA |
|---|---|
| Quantity | 1,453 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 196 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2560 | Number of Logic Elements/Cells | 2560 | ||
| Number of Gates | 162000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of EP20K60EFC324-3N – APEX-20KE® Field Programmable Gate Array (FPGA) IC 196 324-BGA
The EP20K60EFC324-3N is an Altera APEX-20KE series Field Programmable Gate Array provided in a 324-ball BGA (19 × 19) surface-mount package. It offers a balanced set of on-chip resources in a compact package for commercial-grade designs.
Key device attributes include 2,560 logic elements, approximately 0.033 Mbits of embedded memory (32,768 total RAM bits), 196 I/O pins, and an estimated 162,000 gates. The device operates from a 1.71 V to 1.89 V supply and supports an operating temperature range of 0 °C to 85 °C. RoHS compliance is indicated.
Key Features
- Core Architecture Field Programmable Gate Array (APEX-20KE series) in a compact, surface-mount BGA.
- Logic Capacity 2,560 logic elements enabling implementation of custom digital logic and mid-range designs; approximately 162,000 gates of logic density.
- Embedded Memory 32,768 total RAM bits (approximately 0.033 Mbits) for on-chip data buffering and state storage.
- I/O 196 user I/O pins to support multiple peripheral interfaces and system interconnects.
- Package & Mounting 324-ball FBGA (19 × 19) package designed for surface-mount PCB assembly in space-constrained boards.
- Power & Temperature Single-supply operation from 1.71 V to 1.89 V and rated for a commercial operating range of 0 °C to 85 °C.
- Compliance RoHS-compliant construction for regulatory and end-product considerations.
Typical Applications
- Custom digital processing Use the device’s 2,560 logic elements and 162,000 gates to implement tailored digital functions and control logic.
- I/O-intensive interfaces 196 I/O pins provide flexibility for connecting multiple peripherals, sensors, and external logic domains.
- On-chip buffering and state storage The 32,768-bit embedded memory supports local data buffering, small FIFOs, and state retention for finite-state machines.
Unique Advantages
- Balanced resource mix: A combination of 2,560 logic elements and 32,768 bits of RAM supports mid-range programmable logic tasks without excessive resource overprovisioning.
- High I/O count: 196 I/O pins enable direct interfacing to a wide range of peripherals and external logic, reducing the need for external expanders.
- Compact BGA footprint: The 324-BGA (19 × 19) package lets designers fit programmable logic into space-constrained PCB layouts.
- Low-voltage operation: 1.71 V to 1.89 V supply range suits designs that target modern low-voltage system rails.
- Commercial temperature rating: Rated for 0 °C to 85 °C, appropriate for standard commercial-environment electronic products.
- RoHS compliance: Environmentally compliant construction supports regulatory requirements for many markets.
Why Choose EP20K60EFC324-3N?
The EP20K60EFC324-3N positions itself as a compact, commercial-grade FPGA option within the APEX-20KE family, delivering a pragmatic mix of logic, embedded memory, and I/O in a 324-BGA package. Its specification set—2,560 logic elements, approximately 0.033 Mbits of on-chip RAM, 196 I/O pins, and a 1.71 V–1.89 V supply—makes it suitable for designers who require mid-range programmable logic in space- and power-constrained designs.
For teams focused on commercial applications where a balance of integration, I/O flexibility, and RoHS compliance matters, this device offers a clear, specification-driven choice that supports reliable, repeatable implementation across production runs.
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