EP20K60EQC208-1

IC FPGA 148 I/O 208QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 148 32768 2560 208-BFQFP

Quantity 786 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O148Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells2560
Number of Gates162000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of EP20K60EQC208-1 – APEX-20KE FPGA, 2,560 Logic Elements, 32,768-bit RAM, 208-BFQFP

The EP20K60EQC208-1 is an APEX-20KE® Field Programmable Gate Array (FPGA) in a 208‑BFQFP package designed for commercial applications. It integrates a MultiCore architecture with look-up table (LUT) logic and embedded system blocks (ESBs) to support register‑intensive and memory‑intensive functions.

With 2,560 logic elements, approximately 32,768 bits of embedded memory, and 148 user I/Os, this device targets mid-density programmable logic requirements where integration, flexible I/O, and on‑chip memory are key design drivers.

Key Features

  • Core Logic  2,560 logic elements providing combinatorial and register resources suitable for mid-density designs; device family supports LUT-based and product-term logic as part of its MultiCore architecture.
  • Embedded Memory  Approximately 32,768 bits of on-chip RAM implemented via embedded system blocks (ESBs) that can be used for FIFOs, dual-port RAM, and content-addressable memory as described for the APEX‑20K family.
  • I/O Capacity and Flexibility  148 user I/O pins with MultiVolt I/O interface support (1.8 V, 2.5 V, 3.3 V, 5.0 V per APEX‑20K family specifications), enabling straightforward interfacing with a variety of peripheral voltage domains.
  • Clock and Timing  On‑chip clock management features from the APEX‑20K family including multiple PLLs, low‑skew clock tree and multiple global clock signals to support synchronous design needs.
  • Power  Designed for low‑power operation with an internal supply voltage in the 1.71 V to 1.89 V range and family-level power‑saving ESB modes.
  • Package and Mounting  208‑BFQFP surface‑mount package (supplier device package: 208‑PQFP, 28×28) for standard PCB assembly processes.
  • Operating Conditions  Commercial grade operation from 0 °C to 85 °C.
  • Density and Capacity  Up to 162,000 gates of logic capacity (family figure applicable to EP20K60E class) supporting a broad set of mid‑range designs.

Typical Applications

  • Embedded System Integration  Use the ESBs and LUT resources to implement memory buffers, FIFOs, and custom logic in SOPC-style system-on-chip implementations.
  • Interface Bridging and Protocol Support  MultiVolt I/O and abundant I/O count make the device suitable for bridging between different voltage domains and interfacing with diverse peripherals.
  • Memory and Buffer Control  On-chip RAM and dual-port memory capabilities enable buffering and temporary storage for data path or communication applications.
  • General-Purpose Logic Acceleration  Mid-density logic and dedicated interconnect features support acceleration of control, signal processing, and glue‑logic tasks in commercial products.

Unique Advantages

  • Balanced Integration: Combines 2,560 logic elements with embedded memory to reduce external component count for mid-density systems.
  • Flexible I/O Support: 148 user I/Os with APEX‑20K family MultiVolt capability simplify mixed‑voltage system designs and peripheral interfacing.
  • On‑Chip Memory for Data Handling: Approximately 32,768 bits of ESB RAM support FIFOs, dual‑port RAM, and CAM implementations without external memory.
  • Clock Management Features: Family-level PLL and clock tree options provide flexible timing and multiple global clocks to streamline synchronous designs.
  • Standard Package and Assembly: 208‑BFQFP surface-mount package supports common PCB assembly processes for streamlined manufacturing.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C for applications targeting standard commercial environments.

Why Choose EP20K60EQC208-1?

The EP20K60EQC208-1 positions itself as a mid-density FPGA option delivering a practical mix of logic resources, embedded memory, and flexible I/O in a compact 208‑BFQFP package. Its MultiCore architecture and ESB capabilities suit designs that require on‑chip buffering, memory-based logic, and mixed‑voltage interfacing without adding external glue circuitry.

This device is well suited for engineers and procurement teams looking for a commercially graded, surface‑mount FPGA that balances on‑chip memory and logic capacity with family-level clocking and I/O features. Its specification set supports scalable designs where integration and predictable electrical characteristics are important.

Request a quote or submit an inquiry to obtain pricing, availability, and additional ordering information for the EP20K60EQC208-1.

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