EP20K60EFC324-2N
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 196 32768 2560 324-BGA |
|---|---|
| Quantity | 310 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 196 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2560 | Number of Logic Elements/Cells | 2560 | ||
| Number of Gates | 162000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of EP20K60EFC324-2N – APEX-20KE® FPGA, 324-BGA, 2,560 Logic Elements
The EP20K60EFC324-2N is an APEX-20KE family field programmable gate array (FPGA) in a 324-FBGA (19×19) package designed for commercial-temperature applications. It combines a MultiCore architecture with LUT-based logic and embedded system blocks (ESBs) to deliver integrated programmable logic and on-chip memory for mid-density designs.
Targeted at designs that require flexible I/O, embedded memory, and programmable clock management, this device supports a wide range of interface topologies and system integration tasks while operating within a 1.71 V–1.89 V internal supply range and a 0 °C to 85 °C temperature window.
Key Features
- Core and Logic 2,560 logic elements (LEs) providing up to 162,000 system gates for mid-density programmable logic functions.
- Embedded Memory (ESB) 32,768 total RAM bits of on-chip memory; ESBs support implementation of FIFO buffers, dual-port RAM, and content-addressable memory (CAM) functions.
- I/O Capacity and Flexibility 196 user I/O pins with MultiVolt I/O interface support allowing interfacing with 1.8 V, 2.5 V, 3.3 V, and 5.0 V signaling levels as supported by the APEX 20K family.
- Clock Management Family-level clock features include up to four PLLs, a built-in low-skew clock tree, up to eight global clock signals, and programmable clock phase/delay controls (ClockLock, ClockBoost, ClockShift features described for the series).
- High-Speed Interface Support Family data describes support for high-speed external memories (such as DDR SDRAM and ZBT SRAM), PCI-compliant 3.3 V operation, and high-performance differential signaling options including LVDS.
- Package and Mounting 324-BGA (324-FBGA 19×19) surface-mount package suitable for compact board layouts.
- Power and Environmental Internal supply range specified at 1.71 V–1.89 V; device is RoHS compliant and rated for commercial temperature operation from 0 °C to 85 °C.
Typical Applications
- Embedded System Integration Use the device’s MultiCore architecture and ESBs to consolidate logic and memory functions for compact embedded designs.
- Memory Interface Controllers Implement DDR and ZBT memory interfaces using on-chip ESBs and the device’s high-speed I/O capabilities.
- Bus and Bridge Logic Leverage PCI support and flexible I/O voltage options to implement bridge, protocol conversion, and bus interfacing logic.
- High-Speed I/O and Communications Deploy LVDS channels and high-performance I/O timing to handle high-bandwidth serial or parallel data paths.
Unique Advantages
- Integrated Memory and Logic: 32,768 bits of embedded RAM alongside 2,560 logic elements reduce external memory needs and simplify board-level design.
- Flexible I/O Voltage Support: MultiVolt I/O options allow direct interfacing with a broad range of peripheral voltages, minimizing level-shifting components.
- Programmable Clocking: On-chip PLLs and clock-management features permit precise timing control and reduced reliance on external clock components.
- Compact, Surface-Mount Package: The 324-FBGA (19×19) package enables high pin count in a compact footprint for space-constrained PCBs.
- Commercial-Grade Qualification: Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial product requirements.
Why Choose EP20K60EFC324-2N?
The EP20K60EFC324-2N positions itself as a mid-density, commercially rated FPGA that balances programmable logic capacity, on-chip memory, and flexible I/O in a compact 324-FBGA package. Its APEX 20K family architecture—combining LUT logic with embedded system blocks—supports integration of memory-intensive and register-heavy functions without excessive external components.
This device is well suited for designers building commercial embedded systems, memory interface controllers, and I/O-rich applications that require a combination of integrated RAM, programmable clocking, and multi-voltage I/O support. Its family-level features help provide a scalable migration path within the APEX 20K lineup.
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