EP20K60EFC324-2N

The EP20K60EFC324-2N is an APEX-20KE family field programmable gate array (FPGA) in a 324-FBGA (19×19) package designed for commercial-temperature applications. It combines a MultiCore architecture with LUT-based logic and embedded system blocks (ESBs) to deliver integrated programmable logic and on-chip memory for mid-density designs.

Targeted at designs that require flexible I/O, embedded memory, and programmable clock management, this device supports a wide range of interface topologies and system integration tasks while operating within a 1.71 V–1.89 V internal supply range and a 0 °C to 85 °C temperature window.

Key Features

• Core and Logic  2,560 logic elements (LEs) providing up to 162,000 system gates for mid-density programmable logic functions.
• Embedded Memory (ESB)  32,768 total RAM bits of on-chip memory; ESBs support implementation of FIFO buffers, dual-port RAM, and content-addressable memory (CAM) functions.
• I/O Capacity and Flexibility  196 user I/O pins with MultiVolt I/O interface support allowing interfacing with 1.8 V, 2.5 V, 3.3 V, and 5.0 V signaling levels as supported by the APEX 20K family.
• Clock Management  Family-level clock features include up to four PLLs, a built-in low-skew clock tree, up to eight global clock signals, and programmable clock phase/delay controls (ClockLock, ClockBoost, ClockShift features described for the series).
• High-Speed Interface Support  Family data describes support for high-speed external memories (such as DDR SDRAM and ZBT SRAM), PCI-compliant 3.3 V operation, and high-performance differential signaling options including LVDS.
• Package and Mounting  324-BGA (324-FBGA 19×19) surface-mount package suitable for compact board layouts.
• Power and Environmental  Internal supply range specified at 1.71 V–1.89 V; device is RoHS compliant and rated for commercial temperature operation from 0 °C to 85 °C.

Typical Applications

• Embedded System Integration  Use the device’s MultiCore architecture and ESBs to consolidate logic and memory functions for compact embedded designs.
• Memory Interface Controllers  Implement DDR and ZBT memory interfaces using on-chip ESBs and the device’s high-speed I/O capabilities.
• Bus and Bridge Logic  Leverage PCI support and flexible I/O voltage options to implement bridge, protocol conversion, and bus interfacing logic.
• High-Speed I/O and Communications  Deploy LVDS channels and high-performance I/O timing to handle high-bandwidth serial or parallel data paths.

Unique Advantages

• Integrated Memory and Logic: 32,768 bits of embedded RAM alongside 2,560 logic elements reduce external memory needs and simplify board-level design.
• Flexible I/O Voltage Support: MultiVolt I/O options allow direct interfacing with a broad range of peripheral voltages, minimizing level-shifting components.
• Programmable Clocking: On-chip PLLs and clock-management features permit precise timing control and reduced reliance on external clock components.
• Compact, Surface-Mount Package: The 324-FBGA (19×19) package enables high pin count in a compact footprint for space-constrained PCBs.
• Commercial-Grade Qualification: Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial product requirements.

Why Choose EP20K60EFC324-2N?

The EP20K60EFC324-2N positions itself as a mid-density, commercially rated FPGA that balances programmable logic capacity, on-chip memory, and flexible I/O in a compact 324-FBGA package. Its APEX 20K family architecture—combining LUT logic with embedded system blocks—supports integration of memory-intensive and register-heavy functions without excessive external components.

This device is well suited for designers building commercial embedded systems, memory interface controllers, and I/O-rich applications that require a combination of integrated RAM, programmable clocking, and multi-voltage I/O support. Its family-level features help provide a scalable migration path within the APEX 20K lineup.

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