EP20K60EFC324-2X

The EP20K60EFC324-2X is an APEX-20KE® field programmable gate array (FPGA) supplied in a 324-ball BGA package. It combines a MultiCore architecture with embedded memory blocks and programmable logic to support mid-range custom digital designs requiring flexible I/O and on-chip RAM.

Targeted for commercial applications, this device offers 2,560 logic elements, 32,768 bits of embedded RAM, 196 user I/O pins, and support for MultiVolt I/O interfaces while operating from a 1.71 V to 1.89 V internal supply across a 0 °C to 85 °C temperature range.

Key Features

• Core architecture  MultiCore architecture integrating look-up table (LUT) logic, product-term logic, and embedded memory; LUT logic is intended for register‑intensive functions while embedded system blocks (ESBs) implement memory functions.
• Logic resources  2,560 logic elements (LEs) enabling mid-range logic integration and user-defined digital functions.
• On-chip memory  32,768 bits of embedded RAM provided via ESBs for FIFOs, dual-port RAM, or content-addressable memory implementations.
• I/O and interface support  196 user I/O pins with MultiVolt I/O support to interface with 1.8 V, 2.5 V, 3.3 V, and 5.0 V devices; programmable output slew-rate control and individual tri-state control per pin.
• Clock and timing  Flexible clock management including up to four phase-locked loops (PLLs), a built-in low-skew clock tree, and features such as ClockLock, ClockBoost, and ClockShift for programmable clock phase and delay.
• Power and operating range  Internal supply specified at 1.71 V to 1.89 V and designed for low-power operation; operating temperature range 0 °C to 85 °C.
• Packaging and mounting  Surface-mount 324-BGA package (supplier device package: 324-FBGA, 19×19) for compact board-level integration.
• Compliance  RoHS compliant for lead-free manufacturing environments.

Typical Applications

• Consumer electronics  Implement custom peripherals, interface bridging, and control logic where compact packaging and MultiVolt I/O support simplify board-level integration.
• Networking & communications  Use on-chip RAM and programmable logic for packet buffering, protocol adaptation, and timing-critical I/O handling.
• Test & measurement equipment  Deploy for data capture, custom data processing, and flexible I/O arrangements in bench and automated test systems.
• Prototyping and OEM designs  Rapidly iterate system logic and integrate memory-intensive blocks such as FIFOs and dual-port RAM using the ESBs and LUT-based logic.

Unique Advantages

• Integrated MultiCore architecture: Combines LUT logic, product-term logic, and embedded memory blocks to implement mixed register- and memory-intensive functions on a single device.
• Deterministic clocking and PLL support: Up to four PLLs, multiple global clock signals, and programmable clock features help manage skew and enable clock multiplication/division for complex timing domains.
• Flexible I/O interfacing: 196 user I/O pins with MultiVolt I/O support and programmable output control simplify interfacing to a wide range of external devices and bus standards.
• On-chip memory for buffering: 32,768 bits of embedded RAM (ESBs) support FIFOs, dual-port RAM, and CAM implementations without eating into logic resources.
• Compact, manufacturable package: 324-BGA surface-mount package (324-FBGA, 19×19) offers a space-efficient solution for board-level integration in commercial products.
• RoHS compliant and commercial temperature range: Ready for lead-free production and designed for commercial operating temperatures (0 °C to 85 °C).

Why Choose EP20K60EFC324-2X?

The EP20K60EFC324-2X delivers a balanced mid-range FPGA option with 2,560 logic elements, substantial on-chip RAM, and a rich set of clock and I/O features drawn from the APEX-20KE family architecture. Its MultiCore approach and ESB resources enable designers to consolidate memory and logic functions, reducing external BOM and simplifying system partitioning.

This device is well suited for commercial embedded systems, communication interfaces, prototyping environments, and OEM products that require flexible I/O, programmable clock management, and compact BGA packaging—all while operating within standard commercial temperature and supply ranges.

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