EP20K60EQC208-2X

The EP20K60EQC208-2X is an APEX-20KE series field programmable gate array (FPGA) in a 208-BFQFP surface-mount package. It combines a MultiCore architecture with look-up table (LUT) logic and embedded system blocks (ESBs) to deliver flexible, on-chip logic and memory for mid-density programmable designs.

Designed for commercial-grade applications, this device targets system integration tasks such as interface bridging, custom logic implementation, and memory buffering where moderate gate count, on-chip RAM and a broad I/O set are required. Key benefits include integrated embedded memory, MultiVolt I/O support, and clock management features from the APEX-20K family.

Key Features

• Core Architecture MultiCore architecture with LUT logic and product-term logic for register- and combinatorial-intensive functions; family-level APEX-20K design enables a balance of logic density and embedded resources.
• Logic Resources Approximately 2,560 logic elements (LEs) providing the programmable logic capacity to implement mid-sized custom logic and glue functions; family listing associates this device with up to 162,000 system gates.
• Embedded Memory Approximately 32,768 bits of on-chip RAM implemented via embedded system blocks (ESBs) suitable for FIFOs, dual-port RAM and content-addressable memory (CAM) functions.
• I/O and Interface Flexibility 148 user I/O pins with MultiVolt I/O interface support (1.8 V, 2.5 V, 3.3 V and 5.0 V) to interface with a wide range of external devices and bus standards.
• Clock Management Family-level support for flexible clocking including up to four PLLs, a built-in low-skew clock tree and multiple global clock signals for deterministic timing and system synchronization.
• Power and Voltage Internal supply operation in the 1.71 V to 1.89 V range; device-level features in the APEX-20K family include low-power design options and programmable ESB power-saving modes.
• Package and Mounting 208-BFQFP (supplier device package: 208-PQFP, 28 × 28) surface-mount package suitable for standard SMT assembly processes; commercial temperature grade (0 °C to 85 °C).
• Standards and High-speed I/O Family-level I/O capabilities include support for high-speed external memories (such as DDR SDRAM and ZBT SRAM), LVDS channels and common high-speed I/O standards used in embedded systems.
• Compliance RoHS compliant.

Typical Applications

• Interface Bridging Ideal for protocol conversion and bus interfacing where flexible I/O voltage support and moderate logic density are required to connect diverse subsystems.
• Memory Buffering and FIFO Control On-chip ESBs and approximately 32,768 bits of embedded RAM enable implementation of FIFOs and dual-port RAM for buffering between clock domains or variable-rate peripherals.
• Custom Logic and Glue Logic Use the 2,560 logic elements to consolidate discrete logic, implement state machines, or offload timing-critical control functions from a host processor.
• High-speed I/O Interfaces Suitable for mid-speed serial and parallel I/O applications leveraging MultiVolt compatibility and family-level support for LVDS and external memory interfaces.

Unique Advantages

• Balanced Integration: Combines LUT-based logic and dedicated embedded system blocks to deliver both logic and memory on a single device, reducing external component count.
• Flexible I/O Voltage Support: MultiVolt I/O capability enables direct interfacing to a variety of 1.8 V–5.0 V peripherals without complex level-shifting.
• On-chip Memory for Data Flow: Approximately 32.8 kbits of embedded RAM provide local storage for buffering, lookup tables, and small data structures, simplifying board-level memory design.
• Deterministic Clocking: Family-level PLLs and low-skew clock tree features help maintain timing integrity across global and local clock domains for synchronized system operation.
• Commercial Temperature and RoHS Compliance: Commercial-grade operating range (0 °C to 85 °C) and RoHS compliance align with standard production and environmental requirements.
• Standard Surface-mount Package: 208-BFQFP surface-mount packaging (28 × 28 PQFP footprint) supports common SMT assembly workflows and footprint reuse.