EP20K60EQC208-3
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 148 32768 2560 208-BFQFP |
|---|---|
| Quantity | 293 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 148 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2560 | Number of Logic Elements/Cells | 2560 | ||
| Number of Gates | 162000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of EP20K60EQC208-3 – APEX-20KE® FPGA, 2,560 logic elements, 32,768 bits RAM, 148 I/O, 208-BFQFP
The EP20K60EQC208-3 is an APEX-20KE® family field-programmable gate array (FPGA) offered in a 208-BFQFP package for surface-mount applications. It implements the APEX MultiCore architecture combining LUT-based logic and embedded system blocks (ESBs) for integrated memory and product-term logic.
Designed for system-on-a-programmable-chip applications, the device targets designs that require moderate logic density, on-chip RAM, flexible I/O interfacing, and programmable clock management within a commercial-temperature range.
Key Features
- Core Logic 2,560 logic elements (LEs) and an architecture that integrates LUT logic and product-term logic for register- and combinatorial-intensive functions.
- Embedded Memory Total on-chip RAM: 32,768 bits (approximately 32 Kbits) provided by ESBs suitable for FIFOs, dual-port RAM, or CAM implementations.
- I/O Resources 148 user I/O pins with MultiVolt I/O interface support across the APEX 20K family, enabling interfacing with multiple voltage domains.
- Clocking and Timing Family-level support for flexible clock management including up to four PLLs, low-skew clock trees, and programmable clock phase/delay features.
- Power Internal supply operating range specified at 1.71 V to 1.89 V for low-power operation consistent with APEX 20K device characteristics.
- Package & Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28) for surface-mount assembly, with a commercial operating temperature range of 0°C to 85°C.
- Standards and Integration APEX 20K family features such as MultiVolt I/O, supported high-speed I/O standards, and embedded system blocks that facilitate SOPC-style integration.
- Compliance RoHS compliant.
Typical Applications
- Embedded systems: Implement control logic, state machines, and local memory arrays using the device’s 2,560 logic elements and 32 Kbits of on-chip RAM.
- High-speed I/O interfaces: Use the MultiVolt I/O capability for bridging between different voltage domains and for designs requiring flexible I/O signaling.
- Custom digital logic and prototyping: Rapidly develop and verify custom logic functions, leveraging the LUT-based fabric and embedded system blocks for memory-intensive blocks like FIFOs.
- Peripheral and bus interfacing: Integrate peripheral logic or interface controllers where programmable clock management and multi-domain I/O are needed.
Unique Advantages
- Integrated logic and memory: On-chip ESBs and LUT logic reduce external memory needs for many mid-density designs, simplifying PCB layout.
- Flexible I/O support: MultiVolt I/O capability enables straightforward interfacing with a range of external devices and voltage domains.
- Programmable clock management: Built-in PLLs and clock-shift features allow precise timing control inside the FPGA, aiding synchronous system design.
- Commercial-temperature qualification: Specified for 0°C to 85°C operation to match typical commercial application environments.
- Compact, surface-mount package: 208-BFQFP (28×28) offers a balance of pin count and board-space efficiency for medium-density implementations.
Why Choose EP20K60EQC208-3?
The EP20K60EQC208-3 combines 2,560 logic elements with approximately 32 Kbits of embedded RAM and 148 user I/O pins in a 208-BFQFP surface-mount package, offering a balanced solution for mid-density programmable logic needs. Its MultiCore architecture and ESB-based memory allow designers to implement register-intensive and memory-dependent functions on-chip, reducing external components and simplifying system integration.
This device is suited to teams and engineers developing embedded control, interface logic, and custom digital functions who require configurable clock management, MultiVolt I/O support, and a commercial temperature rating. Its family-level feature set and RoHS compliance provide long-term design support and regulatory conformance for commercial applications.
Request a quote or submit a quotation request to receive pricing and availability for the EP20K60EQC208-3.

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