EP20K60EQI208-2X

IC FPGA 148 I/O 208QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 148 32768 2560 208-BFQFP

Quantity 575 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O148Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells2560
Number of Gates162000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits32768

Overview of EP20K60EQI208-2X – APEX-20KE Field Programmable Gate Array (FPGA), 2560 Logic Elements

The EP20K60EQI208-2X is an APEX-20KE family FPGA from Intel, offering a MultiCore™ architecture that integrates lookup-table logic, product-term logic and embedded memory for system-on-programmable-chip (SOPC) applications. With 2,560 logic elements, approximately 32,768 bits of embedded RAM, and 148 user I/O pins in a 208-BFQFP package, this device targets industrial embedded systems and mid-density programmable logic applications where integration, flexible I/O and on-chip memory are important.

Key Features

  • Core Architecture — APEX-20KE MultiCore™ architecture integrating LUT logic and product-term logic, optimized for register- and combinatorial-intensive functions.
  • Logic Capacity — 2,560 logic elements (LEs) and up to 162,000 system gates for implementing mid-density logic functions.
  • Embedded Memory — 32,768 bits of on-chip RAM (embedded system blocks) suitable for FIFOs, dual-port RAM and other memory functions.
  • I/O and Interfaces — 148 user I/O pins with MultiVolt™ I/O interface support for 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling, plus advanced I/O standards supported across the APEX-20K family.
  • Clock and Timing — Flexible clock management with up to four PLLs, a built-in low-skew clock tree and up to eight global clock signals for complex timing domains.
  • Power — Designed for low-power operation with internal supply requirements specified at 1.71 V to 1.89 V and ESB programmable power-saving options noted in the family datasheet.
  • Package & Mounting — 208-BFQFP surface-mount package (supplier package: 208-PQFP 28×28) for compact board integration.
  • Temperature & Grade — Industrial grade operation with an operating temperature range of 0 °C to 85 °C.
  • Standards & Testability — Family-level features include JTAG boundary-scan support as part of the APEX-20K architecture.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Implement control logic, motor control interfaces or protocol bridging with 2,560 logic elements and local RAM for buffering and state storage.
  • Communications and I/O Bridging — Use flexible MultiVolt I/O and abundant user pins for protocol translation, I/O aggregation and board-level interface logic.
  • Embedded System Integration — Combine LUT logic and embedded system blocks to build on-chip FIFOs, small RAM buffers and control-state machines for compact SOPC designs.
  • Memory Interface Support — Leverage embedded RAM and family-level support for external memory interfaces in mid-density designs requiring deterministic timing.

Unique Advantages

  • Integrated SOPC Architecture: Combines LUT, product-term logic and embedded memory to consolidate discrete components and simplify system design.
  • Flexible I/O Voltage Support: MultiVolt I/O capability (1.8 V, 2.5 V, 3.3 V, 5.0 V) enables direct interfacing to multiple logic families without extensive level-shifting.
  • On-Chip Memory Resources: Approximately 32,768 bits of embedded RAM provide local buffering for FIFOs and small data structures, reducing external memory needs.
  • Robust Clock Management: Multiple PLLs and a low-skew clock tree simplify multi-domain timing and support clock multiplication, division and phase adjustments at the device level.
  • Industrial Temperature Rating: Specified for 0 °C to 85 °C operation, suitable for a wide range of industrial embedded environments.
  • Compact Surface-Mount Packaging: 208-BFQFP (28×28 PQFP footprint) delivers a balance of pin count and PCB area for dense board layouts.

Why Choose EP20K60EQI208-2X?

The EP20K60EQI208-2X provides a balanced mid-density FPGA option with 2,560 logic elements, embedded RAM and a broad set of family-level features for system integration. Its APEX-20KE architecture and flexible clock and I/O capabilities make it suitable for embedded control, interface bridging and SOPC-style designs where on-chip memory and multi-voltage interfacing reduce external BOM and simplify board-level design.

With industrial-grade temperature specification, RoHS compliance and a compact 208-BFQFP package, this device is positioned for customers seeking a reliable, integrated programmable logic solution for mid-complexity applications with clear on-chip resources and established architectural features from the APEX-20K family.

Request a quote or submit a product inquiry to receive pricing, availability and sourcing details for the EP20K60EQI208-2X.

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