EP20K60ETC144-1

The EP20K60ETC144-1 is an APEX-20KE family FPGA from Intel, combining MultiCore architecture with embedded system blocks (ESBs) to integrate look-up table (LUT) logic, product-term logic, and on-chip memory. This commercial-grade, surface-mount device targets designs that require embedded memory, flexible I/O, and programmable logic in a 144-LQFP package.

With 2,560 logic elements, approximately 32,768 bits of embedded RAM, and 92 I/O pins, the device supports medium-density logic and memory functions while operating over a 1.71 V to 1.89 V supply range and a 0 °C to 85 °C temperature range.

Key Features

• Core Architecture  MultiCore architecture integrating LUT logic, product-term logic, and embedded memory (ESB) to support register-intensive and combinatorial functions.
• Logic Resources  Approximately 2,560 logic elements and a device gate capacity of 162,000 gates, enabling medium-density programmable logic implementations.
• Embedded Memory  Approximately 32,768 bits of on-chip RAM provided by ESBs for FIFOs, dual-port RAM, and CAM-style functions.
• I/O Capabilities  92 user I/O pins with MultiVolt I/O interface support (per APEX 20K family) and programmable I/O features such as output slew-rate control and individual tri-state enables.
• Clock Management  Family-level support for up to four PLLs, a built-in low-skew clock tree, and programmable clock phase/delay features to manage multi-clock designs.
• Power and Voltage  Internal/required supply operation in the specified range of 1.71 V to 1.89 V; device designed for low-power operation with ESB power-saving modes (APEX 20K family).
• Package and Mounting  144-LQFP (144-TQFP 20×20) surface-mount package suitable for standard PCB assembly processes; commercial temperature grade 0 °C to 85 °C.
• Standards and Interface Support  Family-level support for high-speed interfaces including DDR SDRAM and ZBT SRAM, LVDS up to 840 Mbits/channel, and PCI 3.3-V operation (APEX 20K family).
• Test and Debug  Embedded JTAG boundary-scan circuitry (contributes up to 57,000 additional gates) to support board-level test and programming.

Typical Applications

• Embedded system integration  Use the MultiCore architecture and ESBs to implement SOPC-style functions and on-chip memory buffers for system-level designs.
• Memory interface logic  Implement DDR SDRAM or ZBT SRAM controllers and buffering using the device’s embedded RAM and I/O signaling capabilities.
• High-speed I/O and protocol bridging  Leverage MultiVolt I/O support and family-level LVDS and PCI interface capabilities for mixed-voltage connectivity and peripheral bridging.
• Signal processing and buffering  Use embedded FIFOs and dual-port RAM implemented in ESBs for packet buffering, data alignment, and stream processing tasks.

Unique Advantages

• Integrated memory and logic: Embedded system blocks provide on-chip RAM and product-term logic, reducing the need for external memory components for many designs.
• Balanced mid-range density: With 2,560 logic elements and 162,000 gates, the device fits applications that require more capability than small PLDs while staying cost-effective.
• Flexible I/O support: MultiVolt I/O compatibility and programmable pin features simplify interfacing to a range of peripheral voltages and high-speed standards.
• Clocking versatility: Multiple PLLs, a low-skew clock tree, and programmable clock features enable complex timing architectures and reduced clock skew.
• Testability: Integrated JTAG boundary-scan support facilitates board-level test and in-system programming.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching typical commercial electronic product environments.

Why Choose EP20K60ETC144-1?

The EP20K60ETC144-1 offers a practical balance of logic density, on-chip memory, and flexible I/O in a compact 144-LQFP package. Its APEX-20KE family architecture—combining LUTs, product-term logic, and ESBs—enables system-level integration for designs that need embedded RAM, FIFO buffering, and programmable logic without excessive external components.

This device is well suited to engineers and procurement teams designing commercial embedded systems, mid-density data-path logic, and memory-interface applications who require predictable supply voltage operation and standard commercial temperature grading.

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