EP20K60EQC208-2XN

IC FPGA 148 I/O 208QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 148 32768 2560 208-BFQFP

Quantity 510 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O148Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells2560
Number of Gates162000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of EP20K60EQC208-2XN – APEX-20KE Field Programmable Gate Array (FPGA), 208-BFQFP

The EP20K60EQC208-2XN is an APEX-20KE family FPGA offered in a 208-BFQFP package. It implements a MultiCore architecture that combines look-up table (LUT) logic, product-term logic and embedded system block (ESB) memory to enable integrated, programmable system functions.

This device targets commercial embedded and system designs that require a balance of logic capacity, on-chip RAM, multi-voltage I/O flexibility and configurable clock management for applications such as bus interfacing, memory controllers and custom I/O logic.

Key Features

  • Core architecture  MultiCore architecture integrating LUT logic, product-term logic and embedded system block (ESB) memory for register‑ and combinatorial‑intensive functions.
  • Logic resources  2,560 logic elements (LEs) and approximately 162,000 gates to implement mid-density logic and glue‑logic functions.
  • On-chip memory  32,768 bits of embedded RAM available for FIFOs, dual‑port RAM and content‑addressable memory implementations using ESBs.
  • I/O capability  148 user I/O pins with MultiVolt I/O interface support (1.8 V, 2.5 V, 3.3 V and 5.0 V levels referenced in the APEX 20K family), programmable slew and tri‑state control for flexible system interfacing.
  • Clock management  Integrated clock resources including up to four PLLs, a low‑skew clock tree and features such as ClockLock, ClockBoost and ClockShift for phase/delay control and clock multiplication/division.
  • Low‑power design  Designed for low‑power operation with internal supply range specified at 1.71 V to 1.89 V and ESB programmable power‑saving modes.
  • External memory and bus support  Architecture supports high‑speed external memories (including DDR SDRAM and ZBT SRAM) and bus interfaces; family notes PCI compliance for certain configurations.
  • Package & mounting  Supplied in a 208‑BFQFP package (supplier device package listed as 208‑PQFP (28x28)); surface‑mount device suitable for standard PCB assembly workflows.
  • Commercial temperature grade  Operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Bus and bridge interfaces  Use the device’s MultiVolt I/O and PCI‑related features to implement custom bus logic, peripheral bridging and protocol adaptation.
  • Memory controller and buffering  Implement DDR/ZBT memory interfaces, FIFOs and buffering using the embedded system block memory and on‑chip RAM.
  • Custom I/O and glue logic  Deploy for complex I/O aggregation, signal conditioning and timing-handling tasks where multiple voltage domains and programmable I/O are required.
  • Clocked digital systems  Leverage integrated PLLs and clock management features for controlled clock distribution, phase shifting and clock multiplication/division in synchronous designs.

Unique Advantages

  • Integrated system building blocks: The MultiCore architecture and ESBs consolidate LUT logic and embedded memory, reducing external component count for many system functions.
  • Balanced mid‑density resources: 2,560 logic elements and ~162,000 gates provide a practical mix of capacity for custom logic and control functions without the overhead of higher‑density devices.
  • Flexible I/O and interfacing: 148 user I/Os plus MultiVolt support enable straightforward connections across multiple voltage domains and standard interfaces.
  • Robust clock control: Multiple PLLs and clock features let you tailor clocking topology and timing for high‑performance synchronous designs.
  • Power‑conscious operation: Low‑voltage internal supply range and ESB power‑saving options help manage board‑level power budgets.
  • Commercial grade and RoHS compliant: Suitable for a wide range of commercial embedded applications with RoHS environmental compliance.

Why Choose EP20K60EQC208-2XN?

The EP20K60EQC208-2XN delivers an effective mid‑range FPGA option within the APEX‑20KE family, combining 2,560 logic elements, embedded RAM, extensive I/O and configurable clocking in a 208‑pin surface‑mount package. Its MultiCore architecture and ESB features enable integrated implementations of memory, FIFO and product‑term logic, simplifying board design and reducing external component needs.

This part is well suited for commercial embedded systems that require flexible I/O voltage support, moderate logic density and on‑chip memory for buffering and control tasks. It offers designers a balance of integration, clocking flexibility and power options backed by the APEX 20K device family feature set.

Request a quote or submit a product inquiry to get pricing and availability for the EP20K60EQC208-2XN.

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