EP20K60EFC324-2

The EP20K60EFC324-2 is an APEX-20K family Field Programmable Gate Array (FPGA) in a 324-ball BGA package designed for commercial applications. It provides a mid-range logic capacity with a combination of on-chip memory and a high pin count to support a variety of embedded logic and I/O requirements.

This device is suited for designs that require up to 2,560 logic elements, approximately 32 Kbits of embedded RAM, and up to 196 I/O signals while operating within a 1.71 V to 1.89 V core supply range and a commercial temperature window.

Key Features

• Logic Capacity – 2,560 logic elements enabling implementation of medium-complexity digital functions and control logic.
• Gate Equivalent – 162,000 gates for a clear indicator of overall logic resources.
• Embedded Memory – 32,768 bits (approximately 32 Kbits) of on-chip RAM for small data buffers, state storage, and local memory needs.
• I/O Count – 196 I/O pins to support multiple external interfaces and peripherals.
• Power – Core voltage supply range of 1.71 V to 1.89 V to match low-voltage system designs.
• Package & Mounting – 324-ball FBGA (324-BGA, 19×19) in a surface-mount package for compact board-level integration.
• Operating Range – Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance – RoHS compliant for environmental regulatory requirements.

Typical Applications

• Embedded Control and Glue Logic – Use the 2,560 logic elements and 196 I/Os to implement glue logic, bus bridging, and control functions in commercial electronic products.
• Interface and Protocol Handling – Implement protocol conversion or custom interface logic where multiple I/O lines and on-chip memory buffers are required.
• Custom Peripheral Logic – Offload peripheral sequencing, timing, and simple data processing tasks from a host microcontroller using the device’s logic and RAM resources.

Unique Advantages

• Balanced Logic and Memory – 2,560 logic elements combined with approximately 32 Kbits of on-chip RAM provides an effective mix for medium-complexity designs without external memory.
• High I/O Density – 196 I/Os reduce the need for additional interface chips, simplifying board-level connectivity.
• Compact Surface-Mount Package – 324-FBGA (19×19) package supports high-density PCB layouts while maintaining a surface-mount assembly flow.
• Low-Voltage Core – 1.71 V to 1.89 V supply supports integration into low-voltage power domains common in modern commercial electronics.
• Regulatory Compliance – RoHS compliance supports environmental requirements for commercial products.

Why Choose EP20K60EFC324-2?

The EP20K60EFC324-2 positions itself as a practical FPGA choice for commercial designs that need a mid-range mix of logic, embedded RAM, and a high I/O count in a compact BGA package. Its 2,560 logic elements, 196 I/Os, and approximately 32 Kbits of on-chip RAM make it suitable for integrating custom control, interfacing, and protocol tasks directly on-chip.

With a defined core voltage range and commercial temperature rating, this device fits into standard commercial product development flows where RoHS compliance and surface-mount packaging are required. It is a fit for engineers and procurement teams seeking a reliable FPGA building block for moderate-complexity designs.

Request a quote or submit a procurement inquiry to receive pricing and availability for EP20K60EFC324-2.