EP20K600EFC672-2X

The EP20K600EFC672-2X is an APEX-20KE family FPGA from Intel designed for commercial embedded and system applications. It uses the APEX MultiCore architecture integrating look-up table (LUT) logic, product-term logic, and embedded memory blocks to support register‑intensive and memory‑intensive functions.

This device targets high-density logic and I/O requirements, combining tens of thousands of logic elements, substantial on‑chip RAM, and advanced clock and I/O capabilities for complex digital designs.

Key Features

• Logic Capacity — 24,320 logic elements (LEs) and approximately 1,537,000 gates provide high-density programmable logic for complex designs.
• Embedded Memory — Approximately 0.311 Mbits (311,296 bits) of on-chip RAM available for FIFOs, dual-port RAM and other memory functions using ESB structures.
• I/O Density — 508 user I/O pins to support broad peripheral and interface connectivity requirements.
• Clock Management — On-chip clock management features from the APEX 20K family including up to four PLLs, low-skew clock tree, and programmable phase/delay control for precise timing.
• Flexible I/O Standards — MultiVolt I/O interface support and advanced I/O features from the APEX 20K family for interfacing with a range of voltage domains and high-speed signaling.
• Power — Internal voltage supply range documented at 1.71 V to 1.89 V to match the device’s specified operating conditions.
• Package and Mounting — 672-BBGA package with supplier device package listed as 672-FBGA (27x27); surface-mount device suitable for standard PCB assembly.
• Commercial Grade and RoHS — Commercial temperature grade (0 °C to 85 °C) and RoHS‑compliant.

Typical Applications

• High-density logic integration — Use the device for complex control and processing where tens of thousands of logic elements and large embedded memory are required.
• Memory-intensive functions — Implement FIFOs, dual-port RAM, and CAM using the device’s embedded system blocks for on-chip buffering and storage.
• High I/O interfacing — Deploy in systems needing extensive external connectivity or multiple parallel interfaces supported by 508 user I/Os.

Unique Advantages

• High logic density: 24,320 logic elements and over 1.5 million gates enable integration of large logic networks on a single device, reducing board-level component count.
• Significant on-chip RAM: Approximately 0.311 Mbits of embedded memory supports data buffering and embedded storage without external RAM.
• Robust clocking features: Family-level clock management (multiple PLLs, low-skew tree, programmable phase/delay) facilitates precise timing and synchronized domains.
• Broad I/O capacity: 508 I/O pins provide flexibility for connecting multiple peripherals, memory interfaces, and high-pin-count subsystems.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS-compliant, suitable for mainstream commercial electronic products.
• Compact BGA package: 672-BBGA (supplier: 672-FBGA (27x27)) offers a dense, surface-mount footprint for space-constrained PCBs.

Why Choose EP20K600EFC672-2X?

The EP20K600EFC672-2X positions itself as a high‑density, commercially rated FPGA option within the APEX 20K family, combining substantial logic resources, embedded memory, and extensive I/O in a compact BGA package. Its MultiCore architecture and family clock/I/O features make it suitable for embedded systems that require integrated memory functions, precise clock control, and large-scale logic integration.

This device is well suited for design teams targeting commercial embedded applications that need scalable logic capacity within the APEX 20K family while benefiting from on‑chip memory resources, flexible I/O, and a compact surface-mount package.

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