EP2S130F1020C3

The EP2S130F1020C3 is a Stratix® II field-programmable gate array (FPGA) in a 1020-ball BGA package designed for applications requiring high logic density and extensive I/O. With 132,540 logic elements and approximately 6.75 Mbits of embedded memory, it delivers a programmable platform for complex digital designs that demand high on-chip resources and large external connectivity.

Supplied in a 33 × 33 1020-FBGA surface-mount package and rated for commercial operation (0 °C to 85 °C), this device is intended for board-level integration where compact, high-density programmable logic and ROHS-compliant components are required.

Key Features

• Core Logic 132,540 logic elements to implement densely packed programmable digital functions and complex custom logic blocks.
• Embedded Memory Approximately 6.75 Mbits of on-chip RAM for buffering, look-up tables, and algorithm state storage without external memory for many functions.
• I/O Density 742 I/Os provide extensive connectivity for high-pin-count interfaces, parallel buses, and multi-channel systems.
• Power Supply Operates from a 1.15 V to 1.25 V core supply window, enabling predictable power-rail planning for system design.
• Package and Mounting 1020-BBGA (supplier device package 1020-FBGA, 33 × 33) in a surface-mount format for compact PCB integration and high routing density.
• Operating Range & Grade Commercial grade device specified for 0 °C to 85 °C operating temperature.
• Environmental Compliance RoHS compliant to support environmentally responsible manufacturing and assembly processes.

Typical Applications

• High-density digital processing Implement complex logic functions and custom data paths using the large pool of logic elements and embedded memory.
• I/O-intensive systems Support multi-channel interfaces, wide parallel buses, and dense connector layouts with 742 I/Os.
• Custom acceleration and prototyping Configure hardware-accelerated functions and prototype system-level designs requiring substantial on-chip resources.
• Board-level integration The 1020-BBGA surface-mount package enables compact placement on densely populated PCBs where area and routing are constrained.

Unique Advantages

• High logic capacity: 132,540 logic elements give designers room to implement large, feature-rich designs without partitioning across multiple devices.
• Significant on-chip memory: Approximately 6.75 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O connectivity: 742 I/Os simplify integration with multi-channel peripherals and high-pin-count interfaces, reducing the need for external multiplexing.
• Compact system footprint: The 1020-BBGA (33 × 33) package combines high density and surface-mount mounting for space-constrained PCB designs.
• Predictable power planning: A defined core supply range of 1.15 V to 1.25 V helps with power budgeting and regulator selection.
• RoHS compliant: Meets environmental directives to support compliant product builds and manufacturing processes.

Why Choose EP2S130F1020C3?

The EP2S130F1020C3 positions itself as a high-capacity Stratix® II FPGA option for designers needing large programmable logic resources, substantial embedded memory, and one of the highest I/O counts in a single device package. Its combination of 132,540 logic elements, approximately 6.75 Mbits of on-chip RAM, and 742 I/Os makes it suitable for complex board-level systems where integration density and connectivity matter.

Its 1020-BBGA surface-mount package and commercial temperature rating support compact PCB implementation in commercial applications. For engineering teams seeking a scalable, resource-rich FPGA platform with clear power and environmental attributes, the EP2S130F1020C3 offers a verifiable foundation for system designs.

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