EP2S130F1020C4N

IC FPGA 742 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 742 6747840 132540 1020-BBGA

Quantity 407 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O742Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6627Number of Logic Elements/Cells132540
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6747840

Overview of EP2S130F1020C4N – Stratix® II FPGA, 132,540 logic elements, 742 I/O, 1020‑BBGA

The EP2S130F1020C4N is a Stratix® II field-programmable gate array (FPGA) offered in a 1020‑BBGA (1020‑FBGA, 33×33) package for surface-mount applications. It provides a high density of programmable logic, on-chip memory and I/O resources suitable for complex digital systems that require extensive logic fabric and high I/O counts.

With 132,540 logic elements and approximately 6.75 Mbits of embedded memory, this commercial‑grade device targets applications that need dense logic integration, abundant on-chip RAM, flexible I/O and advanced clocking and DSP support as described in the Stratix II device documentation.

Key Features

  • Core Logic Density  132,540 logic elements (ALMs/LUT-based fabric) and 6,627 LABs/CLBs supporting complex digital functions and large-scale integration.
  • Embedded Memory  Approximately 6.75 Mbits of on-chip RAM for local storage, buffering and memory-intensive functions.
  • High I/O Count  742 user I/O pins to support dense peripheral, bus and multi-channel interface requirements.
  • Advanced I/O and Signaling  Device documentation details support for double data rate I/O, multi‑volt I/O standards, on‑chip termination and programmable drive strengths to simplify high-speed interface design.
  • Clocking and DSP Resources  Stratix II architecture includes PLLs and hierarchical/global clock networks plus dedicated DSP circuitry for precision clock management and signal processing workloads.
  • Configuration, Test and Debug  IEEE 1149.1 JTAG boundary-scan support and SignalTap II embedded logic analyzer capability are provided for configuration, in-system testing and debug.
  • Robust System Features  Hot-socketing specifications, power-on reset circuitry and SEU detection features are described in the device handbook to support reliable system integration.
  • Package, Power and Temperature  1020‑BBGA (1020‑FBGA, 33×33) surface-mount package, supply voltage range 1.15 V to 1.25 V, commercial operating temperature 0 °C to 85 °C, and RoHS compliance.

Typical Applications

  • High-density digital systems  Integration of large logic functions and control logic where hundreds of thousands of logic elements and significant on-chip RAM are required.
  • High-speed interfaces and memory controllers  Designs that utilize many I/O pins and advanced I/O features such as DDR signaling and on‑chip termination for external memory and link interfaces.
  • Signal processing and DSP acceleration  Systems that leverage the Stratix II DSP blocks and PLLs for timing and processing of high-bandwidth data streams.
  • In-system debug and test  Development and production environments that benefit from JTAG boundary-scan and the SignalTap II embedded logic analyzer for debug and validation.

Unique Advantages

  • Highly integrated logic and memory: 132,540 logic elements together with approximately 6.75 Mbits of embedded RAM reduce external memory needs and simplify board-level design.
  • Very high I/O density: 742 I/O pins enable complex multi-channel interfaces and large connector or mezzanine designs without external I/O expanders.
  • Comprehensive clocking and DSP support: Dedicated PLLs, hierarchical clock networks and DSP resources support precise timing and efficient signal processing implementations.
  • Built-in test and configuration features: JTAG boundary-scan and SignalTap II capabilities speed bring-up, debugging and in-field diagnostics.
  • System reliability features: Hot-socketing provisions and power-on reset circuitry described in the device handbook help protect system integrity during power sequencing and service operations.
  • Commercial-grade, RoHS-compliant package: 1020‑BBGA surface-mount package with a 0 °C to 85 °C operating range and RoHS compliance for standard commercial applications.

Why Choose EP2S130F1020C4N?

The EP2S130F1020C4N combines a dense logic fabric, substantial on-chip RAM and a very high I/O count in a compact 1020‑BBGA package, making it suited for designs that require extensive integration without significant board-level complexity. Its Stratix II architecture provides documented support for advanced I/O, clocking, DSP blocks and system-level features that aid both development and deployment.

This commercial-grade FPGA is appropriate for engineers and teams building high-density digital systems, memory interfaces, signal processing platforms and complex control logic where documented device features and measurable resource counts (logic elements, RAM bits, I/O) are key selection criteria.

Request a quote or submit a pricing inquiry to receive availability and ordering information for EP2S130F1020C4N.

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