EP2S130F1020C4N
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 742 6747840 132540 1020-BBGA |
|---|---|
| Quantity | 407 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 742 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6627 | Number of Logic Elements/Cells | 132540 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6747840 |
Overview of EP2S130F1020C4N – Stratix® II FPGA, 132,540 logic elements, 742 I/O, 1020‑BBGA
The EP2S130F1020C4N is a Stratix® II field-programmable gate array (FPGA) offered in a 1020‑BBGA (1020‑FBGA, 33×33) package for surface-mount applications. It provides a high density of programmable logic, on-chip memory and I/O resources suitable for complex digital systems that require extensive logic fabric and high I/O counts.
With 132,540 logic elements and approximately 6.75 Mbits of embedded memory, this commercial‑grade device targets applications that need dense logic integration, abundant on-chip RAM, flexible I/O and advanced clocking and DSP support as described in the Stratix II device documentation.
Key Features
- Core Logic Density 132,540 logic elements (ALMs/LUT-based fabric) and 6,627 LABs/CLBs supporting complex digital functions and large-scale integration.
- Embedded Memory Approximately 6.75 Mbits of on-chip RAM for local storage, buffering and memory-intensive functions.
- High I/O Count 742 user I/O pins to support dense peripheral, bus and multi-channel interface requirements.
- Advanced I/O and Signaling Device documentation details support for double data rate I/O, multi‑volt I/O standards, on‑chip termination and programmable drive strengths to simplify high-speed interface design.
- Clocking and DSP Resources Stratix II architecture includes PLLs and hierarchical/global clock networks plus dedicated DSP circuitry for precision clock management and signal processing workloads.
- Configuration, Test and Debug IEEE 1149.1 JTAG boundary-scan support and SignalTap II embedded logic analyzer capability are provided for configuration, in-system testing and debug.
- Robust System Features Hot-socketing specifications, power-on reset circuitry and SEU detection features are described in the device handbook to support reliable system integration.
- Package, Power and Temperature 1020‑BBGA (1020‑FBGA, 33×33) surface-mount package, supply voltage range 1.15 V to 1.25 V, commercial operating temperature 0 °C to 85 °C, and RoHS compliance.
Typical Applications
- High-density digital systems Integration of large logic functions and control logic where hundreds of thousands of logic elements and significant on-chip RAM are required.
- High-speed interfaces and memory controllers Designs that utilize many I/O pins and advanced I/O features such as DDR signaling and on‑chip termination for external memory and link interfaces.
- Signal processing and DSP acceleration Systems that leverage the Stratix II DSP blocks and PLLs for timing and processing of high-bandwidth data streams.
- In-system debug and test Development and production environments that benefit from JTAG boundary-scan and the SignalTap II embedded logic analyzer for debug and validation.
Unique Advantages
- Highly integrated logic and memory: 132,540 logic elements together with approximately 6.75 Mbits of embedded RAM reduce external memory needs and simplify board-level design.
- Very high I/O density: 742 I/O pins enable complex multi-channel interfaces and large connector or mezzanine designs without external I/O expanders.
- Comprehensive clocking and DSP support: Dedicated PLLs, hierarchical clock networks and DSP resources support precise timing and efficient signal processing implementations.
- Built-in test and configuration features: JTAG boundary-scan and SignalTap II capabilities speed bring-up, debugging and in-field diagnostics.
- System reliability features: Hot-socketing provisions and power-on reset circuitry described in the device handbook help protect system integrity during power sequencing and service operations.
- Commercial-grade, RoHS-compliant package: 1020‑BBGA surface-mount package with a 0 °C to 85 °C operating range and RoHS compliance for standard commercial applications.
Why Choose EP2S130F1020C4N?
The EP2S130F1020C4N combines a dense logic fabric, substantial on-chip RAM and a very high I/O count in a compact 1020‑BBGA package, making it suited for designs that require extensive integration without significant board-level complexity. Its Stratix II architecture provides documented support for advanced I/O, clocking, DSP blocks and system-level features that aid both development and deployment.
This commercial-grade FPGA is appropriate for engineers and teams building high-density digital systems, memory interfaces, signal processing platforms and complex control logic where documented device features and measurable resource counts (logic elements, RAM bits, I/O) are key selection criteria.
Request a quote or submit a pricing inquiry to receive availability and ordering information for EP2S130F1020C4N.

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