EP2S130F1020C5

IC FPGA 742 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 742 6747840 132540 1020-BBGA

Quantity 508 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O742Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6627Number of Logic Elements/Cells132540
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6747840

Overview of EP2S130F1020C5 – Stratix® II Field Programmable Gate Array (FPGA), 1020-BBGA

The EP2S130F1020C5 is an Intel Stratix II family FPGA in a 1020-BBGA surface-mount package, engineered for high-density programmable logic and system integration. It provides a large programmable fabric with 132,540 logic elements, approximately 6.75 Mbits of embedded memory, and 742 user I/O pins to support complex data paths and dense I/O requirements.

Designed for commercial-grade applications, this device operates from a 1.15 V to 1.25 V core supply and a 0 °C to 85 °C operating temperature range, and is RoHS compliant. The Stratix II architecture includes integrated clocking, DSP capabilities, and extensive configuration and test features for complex digital designs.

Key Features

  • Core Logic: 132,540 logic elements provide a high-density programmable fabric suitable for large-scale logic integration and state-machine-heavy designs.
  • Embedded Memory: Approximately 6.75 Mbits of on-chip RAM arranged for TriMatrix memory and block memory usage to support buffering, FIFOs, and shared data storage.
  • I/O Capacity: 742 user I/O pins support a wide range of external interfaces and parallel/serial connectivity requirements.
  • Clocking & DSP: Stratix II family features include enhanced and fast PLLs, global and hierarchical clock networks, and dedicated digital signal processing blocks for timing and compute-intensive functions.
  • Configuration & Test: IEEE 1149.1 JTAG boundary-scan support, SignalTap II embedded logic analyzer, and multiple configuration schemes for system bring-up and in-system debug.
  • Power & Operating Range: Core supply voltage 1.15–1.25 V with commercial operating temperature range 0 °C to 85 °C.
  • Package & Mounting: 1020-BBGA (supplier package 1020-FBGA 33×33) in a surface-mount form factor for dense PCB implementations.
  • Compliance: RoHS compliant, meeting environmental regulations for lead-free assembly.

Typical Applications

  • Telecommunications & Networking: Large logic capacity, abundant I/O and integrated clocking make the device suitable for packet processing, interface bridging, and protocol engines.
  • Digital Signal Processing: On-chip DSP blocks and substantial embedded memory support FIR/IIR filters, channel processing, and real-time data manipulation.
  • High-density System Integration: High I/O count and a compact 1020-BBGA package enable consolidation of multiple functions onto a single FPGA in space-constrained designs.
  • Memory Interface & Controller Designs: Dedicated I/O structure and memory resources facilitate external RAM interfacing and custom memory controller implementations.

Unique Advantages

  • High Logic Density: 132,540 logic elements allow integration of large subsystems on a single device, reducing board-level complexity.
  • Substantial On-Chip RAM: Approximately 6.75 Mbits of embedded memory reduces dependency on external memory for buffering and intermediate storage.
  • Extensive I/O Resources: 742 I/Os provide flexibility for parallel buses, multi-channel interfaces, and mixed-signal connectivity options.
  • Integrated Timing and DSP Support: On-chip PLLs, hierarchical clocking, and DSP blocks simplify implementation of high-performance, deterministic systems.
  • In-System Visibility: JTAG boundary-scan and SignalTap II support improve debug efficiency and shorten system bring-up cycles.
  • RoHS Compliance & Surface-Mount Packaging: 1020-BBGA surface-mount form factor and RoHS compliance support modern assembly and regulatory requirements.

Why Choose EP2S130F1020C5?

The EP2S130F1020C5 combines a large programmable fabric, significant on-chip memory, and extensive I/O in a compact 1020-BBGA package, making it well suited to commercial applications that require high integration and flexible I/O. Its Stratix II architecture provides built-in clocking, DSP resources, and configuration/test capabilities that accelerate development of complex digital systems.

This device is targeted at engineering teams building high-density logic and signal-processing systems who need a reliable, RoHS-compliant FPGA with strong in-system debug and configuration options. Its voltage and temperature specifications support stable operation within standard commercial environments.

Request a quote or submit an inquiry to receive pricing, availability, and support information for EP2S130F1020C5. Our team can provide procurement guidance and technical assistance for integrating this Stratix II FPGA into your design.

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