EP2S130F1020C5N

IC FPGA 742 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 742 6747840 132540 1020-BBGA

Quantity 570 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O742Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6627Number of Logic Elements/Cells132540
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6747840

Overview of EP2S130F1020C5N – Stratix® II Field Programmable Gate Array (1020‑BBGA)

The EP2S130F1020C5N is a Stratix® II Field Programmable Gate Array (FPGA) IC from Intel, provided in a 1020‑BBGA package. The device integrates a high-density programmable logic matrix, abundant on‑chip memory, and extensive I/O to address complex system designs that require customizable digital logic, signal processing, and high‑pin‑count interfacing.

Architected as part of the Stratix II family, the device includes dedicated blocks for memory, DSP, PLL/clocking and configuration, making it suitable for designs that need large logic capacity, multiple clock domains, and flexible I/O support while operating within commercial temperature and voltage ranges.

Key Features

  • Logic Capacity — 132,540 logic elements and 6,627 logic array blocks deliver significant programmable logic resources for complex glue logic, state machines, and custom datapaths.
  • Embedded Memory — Approximately 6.75 Mbits of on‑chip RAM, organized in TriMatrix memory and memory blocks as described in the device handbook, for FIFOs, buffers, and data storage.
  • High Pin Count I/O — 742 I/O pins support wide parallel interfaces and dense board-level connectivity in a single device.
  • Clocking and Timing — Integrated PLLs and hierarchical/global clocking networks provide multiple clock domains and precise timing control as outlined in the Stratix II device handbook.
  • DSP and High‑Speed Resources — Dedicated digital signal processing block resources and high‑speed I/O support for signal processing and external memory interfacing, referenced in the device documentation.
  • Configuration & Test Support — JTAG boundary‑scan, SignalTap II embedded logic analyzer support, and multiple configuration schemes are documented for development and debugging workflows.
  • Power and Supply — Core supply operating range of 1.15 V to 1.25 V, enabling predictable power design and supply planning.
  • Package & Mounting — 1020‑BBGA (supplier package: 1020‑FBGA, 33×33) in a surface‑mount package suitable for compact, high‑density board designs.
  • Commercial Grade & Environmental — Commercial operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental and regulatory alignment.

Typical Applications

  • Digital Signal Processing — Use the device’s DSP block resources and embedded memory to implement filters, transforms, and algorithm acceleration.
  • High‑Speed I/O and Memory Interfaces — Leverage the 742 I/O pins and documented external memory interfacing capabilities for wide data buses and memory controllers.
  • Custom Hardware Acceleration — Implement compute‑intensive datapaths and hardware accelerators using the large logic element count and on‑chip RAM.
  • System Integration & Prototyping — Use JTAG, SignalTap II and the device’s configuration options to prototype, debug, and iterate complex system designs.

Unique Advantages

  • High Logic Density: 132,540 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count and board complexity.
  • Substantial Embedded Memory: Approximately 6.75 Mbits of on‑chip RAM provide local storage for buffering, packet processing, and stateful logic without external SRAM.
  • Extensive I/O Connectivity: 742 I/O pins support broad external interfacing options for parallel buses, multiple peripherals, and multi‑lane connections.
  • Flexible Clocking: Integrated PLLs and hierarchical clock networks allow multiple synchronized clock domains suitable for mixed‑frequency systems.
  • Documented Development & Test Support: On‑chip configuration and test features such as JTAG and SignalTap II are documented for streamlined debug and validation.
  • Compact, Surface‑Mount Packaging: 1020‑BBGA (1020‑FBGA, 33×33) offers a high pin‑count in a compact footprint for space‑constrained designs.

Why Choose EP2S130F1020C5N?

The EP2S130F1020C5N positions itself as a high‑capacity Stratix II FPGA option for teams that require large programmable logic resources, significant embedded memory, and extensive I/O in a single commercial‑grade device. Its documented architecture—covering logic array blocks, TriMatrix memory, DSP blocks, PLLs, and configuration/test features—supports complex system designs that demand flexibility and on‑chip integration.

Backed by the Stratix II device handbook and manufacturer documentation, the device is appropriate for engineering teams building high‑density digital systems where consolidation, deterministic clocking, and in‑system debug are priorities.

Request a quote or submit an RFQ for EP2S130F1020C5N to get pricing and availability information for your next design.

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