EP2S90F1020C4

IC FPGA 758 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 758 4520488 90960 1020-BBGA

Quantity 825 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O758Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520488

Overview of EP2S90F1020C4 – Stratix® II FPGA, 90,960 Logic Elements, 1020-BBGA

The EP2S90F1020C4 is a Stratix® II field programmable gate array (FPGA) in a 1020-ball BGA package. It provides a high-density programmable fabric with 90,960 logic elements and approximately 4.52 Mbits of embedded memory, targeted for commercial-grade electronic designs.

This device pairs a large logic capacity with a broad I/O complement (758 I/O pins) and advanced Stratix II family features such as dedicated DSP resources, flexible clocking and PLLs, and comprehensive configuration and debug support—making it suitable for designs requiring high logic density, extensive I/O, and on-chip memory resources.

Key Features

  • Core Logic Density  90,960 logic elements provide substantial programmable logic capacity for complex digital designs.
  • Embedded Memory  Approximately 4.52 Mbits of on-chip RAM (4,520,488 total RAM bits) for FIFOs, buffers, and state storage.
  • I/O Capacity & Package  758 I/O pins in a 1020-BBGA (supplier package: 1020-FBGA, 33×33) surface-mount package enable wide external connectivity and dense board-level integration.
  • Power & Operating Range  Core supply between 1.15 V and 1.25 V with commercial operating temperature range of 0 °C to 85 °C.
  • Stratix II Family Architecture  Family-level capabilities described in the device handbook include Adaptive Logic Modules (ALMs), Logic Array Blocks, TriMatrix memory organization, dedicated DSP blocks, and MultiTrack interconnects for scalable routing and implementation.
  • Clocking & PLLs  Enhanced and fast PLLs and a hierarchical clock network architecture (documented for Stratix II devices) support flexible clock management and distribution.
  • I/O and Interface Support  Stratix II device documentation includes advanced I/O structure features such as double data rate I/O, multi‑voltage I/O interfaces, programmable drive strength, on‑chip termination, and high‑speed differential I/O support.
  • Configuration & Debug  Family-level support includes IEEE 1149.1 JTAG boundary-scan and the SignalTap II embedded logic analyzer for in-system debug and visibility.
  • Compliance & Packaging  Commercial-grade, RoHS-compliant surface-mount device in a high-density FBGA package suitable for standard SMT assembly processes.

Typical Applications

  • Memory Interface & Bridge  Use the device’s external memory interfacing capabilities and substantial on-chip RAM to implement memory controllers, buffering, and external RAM bridges.
  • Digital Signal Processing  Leverage documented DSP block resources and abundant logic elements for fixed-function or programmable signal processing pipelines.
  • High-I/O Data Routing  Deploy the 758 I/O pins and multi‑voltage I/O support for applications requiring broad external connectivity and differential signaling.
  • Prototyping and In-System Debug  Use JTAG boundary-scan and the SignalTap II embedded logic analyzer for development, validation, and in-system observability.

Unique Advantages

  • High Logic Capacity: 90,960 logic elements enable complex combinational and sequential designs without external logic expansion.
  • Significant On‑Chip Memory: Approximately 4.52 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
  • Extensive I/O Count: 758 I/O pins in a compact 1020-BBGA footprint simplify board routing for systems with high peripheral or bus requirements.
  • Flexible Clocking & DSP Support: Stratix II family clocking architectures and DSP block resources (as documented) support advanced timing architectures and signal-processing tasks.
  • Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation with RoHS-compliant packaging for mainstream commercial electronics.
  • On‑Board Development Features: Built-in JTAG and SignalTap II support facilitate debugging and reduce development cycle time.

Why Choose EP2S90F1020C4?

The EP2S90F1020C4 combines large-scale programmable logic (90,960 logic elements) with substantial on-chip memory and a high I/O count to address demanding commercial designs that require integration of complex digital functions, memory buffering, and broad external connectivity. Its 1020-BBGA surface-mount package and documented Stratix II family features—such as PLLs, DSP blocks, flexible I/O standards, and configuration/debug capabilities—make it suitable for applications where density and functional integration matter.

This FPGA is appropriate for design teams seeking a commercially graded Stratix II device that balances logic capacity, embedded memory, and I/O resources while providing the family-level architecture and tools referenced in the device handbook for implementation and debug.

Request a quote or submit an inquiry to receive pricing and availability for the EP2S90F1020C4 Stratix® II FPGA for your next design.

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