EP2S60F672I4N

The EP2S60F672I4N is a Stratix II field-programmable gate array (FPGA) IC that delivers high logic density and extensive on-chip memory in a compact 672-ball BGA package. It is supplied by Intel (Altera) as part of the Stratix II device family and is targeted at industrial applications requiring substantial programmable logic, embedded RAM, and a large I/O complement.

With 60,440 logic elements, approximately 2.544 Mbits of embedded memory, 3,022 logic array blocks (LABs) and 492 I/Os, this device supports complex logic consolidation, DSP blocks and high-speed I/O use cases while operating over a broad industrial temperature range and a 1.15 V–1.25 V core supply window.

Key Features

• Core Architecture — Stratix II FPGA family device architecture offering 60,440 logic elements and 3,022 logic array blocks (LABs) for dense programmable logic implementation.
• Embedded Memory — Approximately 2.544 Mbits of on-chip RAM to support large buffering, state machines and memory-intensive logic functions.
• High I/O Count — 492 I/O pins to support broad interfacing needs, including multi‑bank I/O and external memory interfaces described in the Stratix II documentation.
• Package & Mounting — 672-ball BGA package (supplier package: 672-FBGA, 27×27) with surface-mount mounting for space-efficient board integration.
• Power — Core supply voltage range of 1.15 V to 1.25 V to match Stratix II recommended operating conditions.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Standards & Compliance — RoHS compliant.
• Documentation — Supported by the Stratix II Device Handbook and device datasheets that cover architecture, I/O standards, PLLs, DSP blocks and configuration/testing features.

Typical Applications

• High-density logic consolidation: Implement complex glue logic and custom processing pipelines using 60,440 logic elements and plentiful LAB resources.
• Signal processing and DSP: Utilize embedded memory and documented digital signal processing blocks for filtering, encoding and real‑time data paths.
• High-speed I/O and memory interfaces: Support external memory interfacing and advanced I/O standards with 492 I/Os and the Stratix II I/O feature set.
• Industrial control and automation: Leverage the industrial operating temperature range (−40 °C to 100 °C) for deployment in demanding environments.

Unique Advantages

• High logic density: 60,440 logic elements enable consolidation of large logic functions into a single FPGA device, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 2.544 Mbits of embedded memory provides on-chip buffering and storage for state machines, FIFOs and data processing.
• Extensive I/O capability: 492 I/Os allow broad peripheral and memory connectivity without external multiplexing.
• Industrial temperature range: Rated for −40 °C to 100 °C to meet harsher environmental requirements common in industrial deployments.
• Compact BGA footprint: 672-FBGA (27×27) surface-mount package balances high pin count with a compact PCB footprint.
• Documented architecture and support: Backed by the Stratix II Device Handbook and dedicated datasheet material covering architecture, PLLs, I/O and configuration options.

Why Choose EP2S60F672I4N?

The EP2S60F672I4N is positioned for designs that require a high number of logic elements, significant on-chip RAM and a large I/O complement within an industrial-grade FPGA package. Its combination of 60,440 logic elements, approximately 2.544 Mbits of embedded memory and 492 I/Os provides a balanced platform for consolidating complex logic, accelerating signal processing tasks and interfacing to multiple peripherals or memories.

Designed as part of the Stratix II family and supported by detailed device documentation, the EP2S60F672I4N delivers a proven architecture and the technical references needed for system-level integration and testing in industrial applications.

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