EP2S60F672C4N

IC FPGA 492 I/O 672FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 492 2544192 60440 672-BBGA

Quantity 1,120 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O492Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2S60F672C4N – Stratix II FPGA, 60,440 logic elements, 672-BBGA

The EP2S60F672C4N is an Intel Stratix® II field programmable gate array (FPGA) offered in a 672-ball BGA package. It delivers a substantial programmable logic capacity together with embedded memory and extensive I/O, designed for commercial-grade digital systems.

Built on the Stratix II device architecture, the part provides integrated resources such as logic elements, on-chip RAM, programmable I/O, and advanced clocking and DSP-related blocks (as detailed in the Stratix II device handbook), making it suitable for a range of commercial programmable-logic applications where integration and predictable operating conditions matter.

Key Features

  • Logic Capacity  60,440 logic elements (cells) to implement complex digital functions and glue logic for system integration.
  • Embedded Memory  Approximately 2.54 Mbits of on-chip RAM for buffering, lookup tables, and mid-sized data storage requirements.
  • I/O Count  492 user I/O pins to support broad peripheral interfacing and multi-channel connectivity.
  • Clocking & DSP Resources  Stratix II device architecture includes PLLs, enhanced clock networks, and dedicated DSP-oriented circuitry as described in the device handbook, enabling flexible clocking and signal-processing building blocks.
  • Power Supply  Core voltage range of 1.15 V to 1.25 V for the device core supply.
  • Package & Mounting  672-ball FBGA package (27 × 27 mm footprint) with surface-mount mounting for compact board integration.
  • Operating Range & Grade  Commercial operating temperature range 0 °C to 85 °C; RoHS-compliant.

Typical Applications

  • External memory interfaces  Implement memory controllers and interface logic leveraging the device’s embedded RAM and I/O resources.
  • Digital signal processing  Build DSP pipelines and data-path accelerators using the Stratix II architecture’s DSP-oriented circuitry and clocking features.
  • High-density I/O systems  Support multi-channel I/O and protocol bridging with 492 available I/O pins for connectivity to sensors, peripherals, and off-chip controllers.
  • Custom programmable logic for commercial products  Serve as the programmable backbone for commercial-grade electronics that require field-upgradeable logic and embedded memory.

Unique Advantages

  • High logic density: 60,440 logic elements provide ample capacity to consolidate multiple functions into a single programmable device, reducing system complexity.
  • Substantial on-chip memory: Approximately 2.54 Mbits of embedded RAM simplifies buffering and lookup implementations without immediate need for external memory.
  • Extensive I/O: 492 user I/O pins enable flexible interfacing and support for multi-channel communication and control tasks.
  • Integrated clocking and DSP resources: On-device PLLs and DSP-oriented circuitry (documented in the Stratix II handbook) facilitate precise clock management and signal-processing functions.
  • Compact BGA package: 672-ball FBGA (27 × 27 mm) provides a space-efficient form factor for high-density board layouts.
  • Commercial suitability and compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant for standard commercial deployments.

Why Choose EP2S60F672C4N?

The EP2S60F672C4N combines substantial programmable logic, embedded memory, and a high I/O count within a compact 672-BBGA package, positioning it for commercial designs that require integrated digital processing and flexible interfacing. Its inclusion in the Stratix II family means the device benefits from documented architecture elements such as advanced clocking, PLLs, and DSP-related resources described in the device handbook.

This part is suited for designers and teams implementing mid- to high-density programmable logic functions in commercial products who need predictable operating conditions, RoHS compliance, and a compact package for board-level integration. Its resource mix supports scalable designs that may be iterated or updated through FPGA reprogramming.

Request a quote or submit a procurement inquiry for EP2S60F672C4N to receive pricing and availability information tailored to your project requirements.

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