EP2S60F484I4N

The EP2S60F484I4N is a Stratix® II field-programmable gate array (FPGA) featuring 60,440 logic elements and approximately 2.54 Mbits of embedded memory. It implements the Stratix II architecture and integrates on-chip resources intended for complex digital logic, signal processing and high-density I/O systems.

Designed for industrial applications, this device provides a broad I/O complement (334 pins), on-chip clocking and configuration capabilities, and a compact 484‑BBGA (484‑FBGA, 23×23) surface-mount package. It operates from a core voltage range of 1.15 V to 1.25 V and across an operating temperature range of −40 °C to 100 °C.

Key Features

• Large programmable fabric — 60,440 logic elements to implement complex logic architectures and hardware accelerators.
• Embedded memory — Approximately 2.54 Mbits of on-chip RAM for buffering, state storage and local data processing.
• Extensive I/O — 334 I/O pins in a 484‑BBGA package for dense external connectivity and multi‑standard interfacing.
• Clocking and timing — On-chip PLLs and comprehensive clock network support as documented in the Stratix II device handbook for flexible clock distribution.
• DSP and high-speed support — Device architecture includes dedicated digital signal processing resources and high-speed I/O capabilities referenced in the product handbook.
• Configuration, test and debug — JTAG boundary-scan support and the SignalTap II embedded logic analyzer are available for in-system test, configuration and debug.
• Robust packaging and mounting — Surface-mount 484‑BBGA (supplier package listed as 484‑FBGA, 23×23) for compact board integration.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Core supply range — Core voltage specified between 1.15 V and 1.25 V to match target system power rails.
• Standards and compliance — RoHS compliant.
• System-level features — Documentation highlights features such as hot-socketing support and power-on reset circuitry for flexible system behavior during power sequencing.

Typical Applications

• Industrial control and automation — Leverage the device’s industrial temperature rating, dense I/O and on-chip memory for motor control, PLCs and factory automation interfaces.
• High-speed communications — Use the extensive I/O count, PLLs and high-speed I/O support for protocol bridging, packet processing and network interface logic.
• Digital signal processing — Implement filtering, FFTs and other DSP tasks using the device’s digital signal processing resources and embedded RAM.
• Custom hardware acceleration — Offload compute-heavy functions to the FPGA fabric and local memory to accelerate algorithms in embedded systems and test equipment.

Unique Advantages

• High integration density: 60,440 logic elements combined with ~2.54 Mbits of on-chip RAM reduce external component requirements and simplify board-level design.
• Broad external connectivity: 334 I/O pins in a compact 484‑BBGA footprint enable high-pin-count designs without large packages.
• Industrial-ready operation: −40 °C to 100 °C rating and surface-mount package support deployment in industrial environments.
• Comprehensive configuration and debug: JTAG boundary-scan and embedded logic analysis features in the Stratix II family help streamline bring-up and in-field diagnostics.
• Flexible clocking and timing: On-chip PLLs and documented clock networks provide options for multi-clock designs and timing optimization.
• Standards compliance: RoHS conformity supports regulatory and manufacturing requirements.

Why Choose EP2S60F484I4N?

The EP2S60F484I4N positions itself as a high-density Stratix II FPGA suitable for industrial and high-performance embedded designs that require large programmable logic capacity, significant on-chip memory and extensive I/O. Its documented architecture—covering ALMs, TriMatrix memory, DSP blocks, PLLs, and a complete configuration and test feature set—supports complex system implementations and in-field diagnostics.

Design teams targeting industrial control, communication infrastructure, DSP acceleration or custom hardware acceleration will find the device’s combination of logic resources, memory, configurable clocking and industrial temperature range useful for developing robust, compact solutions with streamlined BOM and board-level integration.

Request a quote or submit your purchase inquiry today to evaluate EP2S60F484I4N for your next FPGA design project.