EP2S60F484C4N

The EP2S60F484C4N is a Stratix® II field-programmable gate array (FPGA) from Intel, delivering a high-density programmable fabric with 60,440 logic elements organized into 3,022 logic array blocks. The device includes substantial embedded memory and a large I/O count for complex system integration.

Designed for FPGA-based designs that require dense logic, on-chip RAM and extensive I/O, the device offers configurable architecture elements such as DSP blocks, PLLs and multi-track interconnects documented in the Stratix II device handbook.

Key Features

• Logic Capacity — 60,440 logic elements organized across 3,022 Logic Array Blocks (LABs) to implement complex digital logic and custom datapaths.
• Embedded Memory — Approximately 2.54 Mbits of on-chip RAM (2,544,192 bits) for buffering, lookup tables and intermediate data storage.
• I/O Density — 334 user I/O pins to support wide parallel interfaces, external memory buses and multi‑lane connectivity.
• Power and Voltage — Core supply range of 1.15 V–1.25 V to match system power rails and support targeted power budgets.
• Package and Mounting — 484‑BBGA package (supplier package: 484‑FBGA, 23×23) in a surface-mount form factor for compact board layouts.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard embedded and electronic systems.
• Configuration & Test Support — Device handbook documents IEEE 1149.1 JTAG boundary-scan and SignalTap II embedded logic analyzer capabilities for in-system debug and programming.
• Clocking & DSP Support — Stratix II architecture includes enhanced and fast PLLs, global/hierarchical clocking and dedicated DSP resources (as documented in the device handbook).
• Standards & Compliance — RoHS compliant for environmental conformity with lead-free assembly requirements.

Typical Applications

• High‑performance Embedded Systems — Implement custom processors, accelerators and control logic by exploiting the device's dense logic and on-chip RAM.
• Digital Signal Processing — Use documented DSP blocks and abundant logic to implement filtering, transforms and real‑time signal pipelines.
• Memory Interface & Bridge Designs — Leverage the I/O count and dedicated memory interfacing guidance in the device handbook for external RAM and bus controllers.
• Prototyping and System Integration — High logic density and extensive I/O make the device suitable for board-level prototypes and integration of complex subsystems.

Unique Advantages

• High Logic Density: 60,440 logic elements allow large designs and multiple functions to be consolidated on a single FPGA, reducing board-level complexity.
• Substantial On‑Chip Memory: Approximately 2.54 Mbits of embedded RAM support deep buffering and table-based logic without immediate external memory dependence.
• Large I/O Count: 334 I/O pins provide flexibility for parallel interfaces, wide data buses and multi-channel connectivity.
• Comprehensive Clocking and DSP Resources: Built-in PLLs and documented DSP features enable precise clock management and efficient signal-processing implementations.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for standard commercial electronics and controlled-environment systems.
• Documented Development Support: The Stratix II device handbook details configuration, testing and architecture references to accelerate design and validation.

Why Choose EP2S60F484C4N?

The EP2S60F484C4N positions itself as a high-density Stratix II FPGA option for designs that require a large logic fabric, meaningful on-chip RAM and extensive I/O in a compact BGA package. Its documented architecture—covering logic array blocks, PLLs, DSP resources and configuration/testing features—helps engineering teams map complex digital functions into a single programmable device.

This device is appropriate for developers and system designers seeking scalable FPGA capacity within the Stratix II family, backed by comprehensive device handbook documentation for architecture, timing, power and configuration guidance.

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