EP2S60F1020I4N

The EP2S60F1020I4N is an Intel Stratix® II FPGA supplied in a 1020-BBGA surface-mount package (33×33). It delivers a high-density programmable fabric with 60,440 logic elements, approximately 2.54 Mbits of embedded memory, and up to 718 user I/O pins for dense, I/O‑rich designs.

Built on the Stratix II device family architecture, the device includes family-level features such as dedicated DSP resources, PLLs and clock networks, TriMatrix memory structures, and an advanced I/O structure—making it suitable for designs that require significant logic capacity, memory, and high I/O counts within an industrial temperature range.

Key Features

• High Logic Capacity — 60,440 logic elements to implement complex user logic and state machines.
• Embedded Memory — Approximately 2.54 Mbits of on-chip RAM for buffering, FIFOs, and storage close to logic.
• Extensive I/O — Up to 718 I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Power Supply — Core supply operating from 1.15 V to 1.25 V to match board power-rail design requirements.
• Package & Mounting — 1020-BBGA (supplier package shown as 1020-FBGA, 33×33) in a surface-mount form factor for compact, high-density board layouts.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for demanding environments.
• Standards & Compliance — RoHS compliant for regulatory alignment in manufacturing.
• Stratix II Family Capabilities — Family-level features documented in the Stratix II device handbook include DSP blocks, enhanced PLLs, multi-level clock networks, TriMatrix memory, and advanced I/O standards support.

Typical Applications

• Telecommunications & Networking: Use the device where high logic density and large I/O counts are needed for packet processing, interface bridging, or custom switching logic.
• Industrial Control & Automation: Suitable for control systems and motor-drive interfaces that require robust operation across −40 °C to 100 °C and extensive I/O connectivity.
• High-Speed Data Acquisition: Implement multi-channel capture, buffering, and preprocessing leveraging the device’s embedded memory and logic resources.
• Signal Processing & DSP Tasks: Leverage the Stratix II family’s dedicated DSP resources and clocking structures for custom filtering, aggregation, or real-time compute functions.

Unique Advantages

• High Integration Density: 60,440 logic elements reduce external glue logic by accommodating large functions on-chip.
• Large On‑Chip Memory: Approximately 2.54 Mbits of embedded RAM enables local buffering and low-latency data paths.
• Massive I/O Capacity: Up to 718 I/O pins support wide parallel buses and multiple peripheral interfaces without external expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact Surface‑Mount Package: 1020-BBGA (33×33) offers a high pin count in a compact footprint suitable for space‑constrained PCBs.
• Family-Level DSP & Clocking Features: Access to Stratix II architecture capabilities such as DSP blocks and advanced PLL/clock networks for deterministic timing and signal processing.

Why Choose EP2S60F1020I4N?

The EP2S60F1020I4N positions itself as a high-density Stratix II FPGA option for designs that need substantial logic, embedded memory, and a very large I/O complement in a compact surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for production environments that demand reliability across temperature extremes.

Designs that require on-chip DSP resources, flexible clocking, and abundant I/O will find this device aligns with those needs, offering a balance of integration and board-level simplification backed by the Stratix II family documentation and feature set.

Request a quote or submit an inquiry for part number EP2S60F1020I4N to check availability, obtain pricing, or discuss packaging and supply options for your design needs.