EP2S60F1020I4
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 718 2544192 60440 1020-BBGA |
|---|---|
| Quantity | 41 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 718 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3022 | Number of Logic Elements/Cells | 60440 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2544192 |
Overview of EP2S60F1020I4 – Stratix® II FPGA, 60,440 logic elements, 718 I/O, 1020‑BBGA
The EP2S60F1020I4 is a Stratix® II field programmable gate array (FPGA) from Intel (Altera) offering a high-density logic fabric, extensive embedded memory, and a very high I/O count in a space-efficient BGA package. This device targets complex digital designs that require large programmable logic capacity, substantial on-chip RAM, and a broad set of I/O resources.
Key device characteristics include 60,440 logic elements, approximately 2.54 Mbits of embedded RAM, 718 I/O pins, industrial-grade operation from −40 °C to 100 °C, and a 1020‑BBGA surface-mount package. The Stratix II device family architecture (documented in the Stratix II Device Handbook) provides advanced clocking, memory structures, DSP resources and high-speed I/O support suitable for demanding system designs.
Key Features
- Core logic capacity — 60,440 logic elements for implementing large-scale programmable logic and complex state machines.
- Embedded memory — Approximately 2.54 Mbits of on-chip RAM to reduce external memory requirements and simplify board-level design.
- High I/O density — 718 user I/O pins to support extensive peripheral interfacing and multi-channel data paths.
- Power supply range — Primary core supply specified between 1.15 V and 1.25 V for core power planning and regulation design.
- Industrial temperature rating — Specified operating range from −40 °C to 100 °C for deployment in industrial environments.
- Package & mounting — 1020‑BBGA (supplier package: 1020‑FBGA 33×33) surface-mount package for high pin-count, compact board layouts.
- RoHS compliant — Meets RoHS environmental requirements.
- Stratix II architecture highlights — Series-level features documented in the device handbook include multi‑track interconnect, TriMatrix memory organization, DSP blocks, PLLs and comprehensive clock networks, and advanced I/O structure and timing resources.
Typical Applications
- High‑density logic integration — Implement large custom logic blocks and complex state machines enabled by 60,440 logic elements.
- High‑I/O interface systems — Aggregate multiple parallel interfaces or dense I/O subsystems using 718 available I/O pins.
- Memory‑intensive embedded designs — Leverage approximately 2.54 Mbits of on-chip RAM to reduce external memory BOM and improve latency.
- Industrial control and instrumentation — Industrial-grade specification and −40 °C to 100 °C operation suit deployments in industrial environments and temperature‑challenged equipment.
Unique Advantages
- High programmable capacity: 60,440 logic elements provide headroom for complex digital functions without immediately requiring multiple devices.
- Reduced external memory needs: Approximately 2.54 Mbits of embedded RAM helps simplify board design and cut parts count.
- Extensive system connectivity: 718 I/O pins enable dense peripheral and bus integration, minimizing additional interface components.
- Industrial reliability: Specified operating temperature from −40 °C to 100 °C supports robust operation in industrial settings.
- Compact, high‑pin‑count package: 1020‑BBGA (33×33) surface-mount package allows high I/O density in a space-efficient footprint.
- Documented family architecture: Backed by the Stratix II Device Handbook and Altera/Intel documentation covering architecture, clocking, memory, I/O, and configuration options.
Why Choose EP2S60F1020I4?
The EP2S60F1020I4 delivers a balance of large programmable logic capacity, substantial on-chip RAM, and very high I/O density in an industrial-grade BGA package. It is suited for designs that require consolidated logic, heavy memory usage on chip, and extensive external interfacing while operating across a wide temperature range.
Supported by Stratix II family documentation, the device is appropriate for engineering teams who need a documented architecture, predictable electrical and thermal parameters (1.15–1.25 V core supply, −40 °C to 100 °C operation), and RoHS compliance for production designs.
If you would like pricing or availability information, request a quote or submit a purchase inquiry to obtain a formal quote and delivery details for EP2S60F1020I4.

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