EP2S60F1020I4

IC FPGA 718 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 718 2544192 60440 1020-BBGA

Quantity 41 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1020-BBGANumber of I/O718Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2S60F1020I4 – Stratix® II FPGA, 60,440 logic elements, 718 I/O, 1020‑BBGA

The EP2S60F1020I4 is a Stratix® II field programmable gate array (FPGA) from Intel (Altera) offering a high-density logic fabric, extensive embedded memory, and a very high I/O count in a space-efficient BGA package. This device targets complex digital designs that require large programmable logic capacity, substantial on-chip RAM, and a broad set of I/O resources.

Key device characteristics include 60,440 logic elements, approximately 2.54 Mbits of embedded RAM, 718 I/O pins, industrial-grade operation from −40 °C to 100 °C, and a 1020‑BBGA surface-mount package. The Stratix II device family architecture (documented in the Stratix II Device Handbook) provides advanced clocking, memory structures, DSP resources and high-speed I/O support suitable for demanding system designs.

Key Features

  • Core logic capacity — 60,440 logic elements for implementing large-scale programmable logic and complex state machines.
  • Embedded memory — Approximately 2.54 Mbits of on-chip RAM to reduce external memory requirements and simplify board-level design.
  • High I/O density — 718 user I/O pins to support extensive peripheral interfacing and multi-channel data paths.
  • Power supply range — Primary core supply specified between 1.15 V and 1.25 V for core power planning and regulation design.
  • Industrial temperature rating — Specified operating range from −40 °C to 100 °C for deployment in industrial environments.
  • Package & mounting — 1020‑BBGA (supplier package: 1020‑FBGA 33×33) surface-mount package for high pin-count, compact board layouts.
  • RoHS compliant — Meets RoHS environmental requirements.
  • Stratix II architecture highlights — Series-level features documented in the device handbook include multi‑track interconnect, TriMatrix memory organization, DSP blocks, PLLs and comprehensive clock networks, and advanced I/O structure and timing resources.

Typical Applications

  • High‑density logic integration — Implement large custom logic blocks and complex state machines enabled by 60,440 logic elements.
  • High‑I/O interface systems — Aggregate multiple parallel interfaces or dense I/O subsystems using 718 available I/O pins.
  • Memory‑intensive embedded designs — Leverage approximately 2.54 Mbits of on-chip RAM to reduce external memory BOM and improve latency.
  • Industrial control and instrumentation — Industrial-grade specification and −40 °C to 100 °C operation suit deployments in industrial environments and temperature‑challenged equipment.

Unique Advantages

  • High programmable capacity: 60,440 logic elements provide headroom for complex digital functions without immediately requiring multiple devices.
  • Reduced external memory needs: Approximately 2.54 Mbits of embedded RAM helps simplify board design and cut parts count.
  • Extensive system connectivity: 718 I/O pins enable dense peripheral and bus integration, minimizing additional interface components.
  • Industrial reliability: Specified operating temperature from −40 °C to 100 °C supports robust operation in industrial settings.
  • Compact, high‑pin‑count package: 1020‑BBGA (33×33) surface-mount package allows high I/O density in a space-efficient footprint.
  • Documented family architecture: Backed by the Stratix II Device Handbook and Altera/Intel documentation covering architecture, clocking, memory, I/O, and configuration options.

Why Choose EP2S60F1020I4?

The EP2S60F1020I4 delivers a balance of large programmable logic capacity, substantial on-chip RAM, and very high I/O density in an industrial-grade BGA package. It is suited for designs that require consolidated logic, heavy memory usage on chip, and extensive external interfacing while operating across a wide temperature range.

Supported by Stratix II family documentation, the device is appropriate for engineering teams who need a documented architecture, predictable electrical and thermal parameters (1.15–1.25 V core supply, −40 °C to 100 °C operation), and RoHS compliance for production designs.

If you would like pricing or availability information, request a quote or submit a purchase inquiry to obtain a formal quote and delivery details for EP2S60F1020I4.

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