EP2S60F484C3N

The EP2S60F484C3N is a Stratix® II field programmable gate array (FPGA) offered by Intel. It provides a reconfigurable logic fabric with on-chip memory and extensive I/O in a 484‑BBGA package designed for surface‑mount assembly.

Device documentation for the Stratix II family highlights architecture elements such as adaptive logic modules, TriMatrix memory, DSP blocks, PLLs and advanced I/O structures, making this device suitable for designs that require substantial programmable logic, embedded memory and flexible I/O interfaces.

Key Features

• Logic Capacity — 60,440 logic elements (logic cells) for implementing complex custom logic and control functions.
• Embedded Memory — Approximately 2.54 Mbits of on‑chip RAM (total RAM bits: 2,544,192) to support buffers, FIFOs and local storage.
• I/O Resources — 334 I/O pins to interface with external devices and memory; device handbook references extensive I/O structure and advanced I/O standard support.
• Package & Mounting — 484‑BBGA package (supplier device package: 484‑FBGA, 23×23) with surface‑mount mounting type for compact board designs.
• Power — Core voltage supply range of 1.15 V to 1.25 V for internal logic operation.
• Operating Temperature & Grade — Commercial grade with an operating range of 0 °C to 85 °C.
• Family Architecture (referenced) — Stratix II device handbook describes LABs/ALMs, TriMatrix memory, DSP blocks, PLLs and multi‑track interconnect for system integration and timing control.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑speed data processing — Use DSP blocks and on‑chip memory to implement custom signal processing pipelines and data path accelerators as described in the device handbook.
• Memory interface controllers — Implement external memory interfaces and controllers leveraging the FPGA’s on‑chip RAM and I/O resources.
• Custom communication logic — Implement protocol engines and I/O buffering using the device’s extensive I/O and PLL/clocking resources.
• Embedded system glue and peripheral control — Integrate custom logic, peripheral interfaces and control functions within a single programmable device.

Unique Advantages

• High logic density: 60,440 logic elements allow large, integrated designs that reduce external glue logic.
• Substantial embedded memory: Approximately 2.54 Mbits of on‑chip RAM supports buffering and local data storage without external memory in many use cases.
• Rich I/O count: 334 I/O pins provide flexibility when interfacing to peripherals, memories and high‑speed links.
• Documented architecture: The Stratix II device handbook provides detailed information on LAB/ALM architecture, memory, DSP blocks and clock networks to assist design and optimization.
• Compact package: 484‑BBGA (23×23 FBGA footprint) enables a high‑density board layout while remaining surface‑mount compatible.
• RoHS compliant: Meets environmental requirements for lead‑free assembly processes.

Why Choose EP2S60F484C3N?

The EP2S60F484C3N combines a high count of logic elements, several megabits of embedded RAM and a broad complement of I/O in a 484‑BBGA package, making it a practical choice for designers who need significant on‑chip resources in a compact, surface‑mount part. The Stratix II family documentation provides in‑depth guidance on architecture, memory organization, DSP blocks and clocking to support system implementation and tuning.

This device is well suited for commercial‑grade applications that require reconfigurable logic, embedded memory and flexible I/O. Its specification set supports integration and scalability within product lines where programmable logic density and documented architecture are important selection criteria.

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