EP2S60F484C4

The EP2S60F484C4 is a Stratix® II Field Programmable Gate Array (FPGA) from Intel designed for commercial-temperature applications. It combines a high logic element count with on-chip memory and a large I/O complement to support complex, high-density programmable logic implementations.

Built on the Stratix II architecture (device handbook), the device integrates logic array structures, embedded memory, DSP-capable resources, PLLs and high-speed I/O capabilities, making it suitable for designs that require substantial on-chip logic, memory and I/O density within a 484-ball BGA package.

Key Features

• Logic Capacity – 60,440 logic elements (cells) provide substantial programmable logic resources for complex custom hardware designs.
• On‑Chip Memory – Approximately 2.544 Mbits of embedded memory for local data storage and buffering within FPGA fabric.
• I/O Density – 334 I/O pins to support wide parallel interfaces and multiple external peripherals.
• Voltage Supply – Core supply range of 1.15 V to 1.25 V, enabling proper integration with system power domains.
• Package & Mounting – 484-BBGA package (supplier device package: 484-FBGA, 23×23 mm) in a surface-mount form factor for dense board-level integration.
• Operating Conditions – Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance – RoHS compliant for regulatory and environmental conformity.
• Architecture Details (from device handbook) – Stratix II architecture topics include logic array blocks, adaptive logic modules, TriMatrix memory, DSP blocks, PLLs/clock networks and high-speed I/O structures.

Typical Applications

• High‑density digital processing – Use the device to implement complex state machines, packet processing or combinational/sequential logic that requires tens of thousands of logic elements.
• Custom hardware acceleration – Leverage on-chip logic and approximately 2.544 Mbits of embedded memory to implement hardware-accelerated functions and data buffering.
• Multi‑interface bridging – 334 I/Os enable wide parallel interfaces, protocol bridging and connectivity between multiple peripherals or subsystems.
• Clocked systems with PLL requirements – Stratix II clocking resources and PLL structures (documented in the device handbook) support designs that require programmable clock networks and synchronization.

Unique Advantages

• High logic density: The 60,440 logic elements allow large designs to be implemented on a single device, reducing board-level component count.
• Integrated on‑chip memory: Approximately 2.544 Mbits of embedded RAM reduce external memory dependence and improve data locality for latency-sensitive functions.
• Significant I/O capacity: 334 I/O pins support broad external connectivity and parallel data paths without requiring additional interface chips.
• Compact board footprint: The 484-BBGA (484-FBGA, 23×23 mm) surface-mount package enables high-density PCB layouts while keeping I/O accessible.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, appropriate for standard commercial and enterprise applications.
• Regulatory readiness: RoHS compliance eases integration into products that require lead-free manufacturing processes.

Why Choose EP2S60F484C4?

EP2S60F484C4 positions itself as a high‑capacity Stratix II FPGA option for engineers needing substantial on-chip logic, memory and I/O in a compact BGA package. The combination of 60,440 logic elements, approximately 2.544 Mbits of embedded memory and 334 I/Os supports dense, interface-rich designs in commercial-temperature applications.

Referencing the Stratix II device handbook, the device's architecture—covering logic array blocks, DSP resources, memory organization and programmable clocking—enables flexible implementation of complex digital functions while simplifying system-level partitioning between programmable logic and external components.

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