EP2S60F484C3

The EP2S60F484C3 is a Stratix® II family Field Programmable Gate Array from Intel (Altera) designed for high-density programmable logic implementations. It provides a large resource set—60,440 logic elements, approximately 2.54 Mbits of embedded memory and 334 user I/Os—targeting applications that require substantial logic, on-chip RAM and flexible I/O connectivity.

Built for commercial temperature operation and surface-mount deployment, this device combines Stratix II architecture elements (including dedicated DSP and clocking resources described in the device handbook) with a 484-ball BGA package for compact system integration.

Key Features

• High-density logic 60,440 logic elements to implement complex finite-state machines, custom datapaths and large combinational logic blocks.
• Embedded memory Approximately 2.54 Mbits of on-chip RAM for buffering, FIFOs, and small memory-mapped structures without external memory.
• Generous I/O count 334 I/O pins to support broad peripheral, memory and high-speed interface connectivity.
• Power and supply Core voltage supply range of 1.15 V to 1.25 V to match Stratix II core requirements and system power budgets.
• Package and mounting 484-BBGA (supplier package 484-FBGA, 23×23) surface-mount package for compact PCB designs and high pin density.
• Operating range Commercial-grade operation from 0 °C to 85 °C suitable for mainstream embedded and communications equipment.
• RoHS compliant Conforms to RoHS requirements for lead-free assembly and regulatory alignment.
• Stratix II architecture support Device family handbook details advanced features such as digital signal processing blocks, PLLs and multi-level clock networks for deterministic system timing and on-chip signal processing.

Typical Applications

• High-density logic integration — Implement custom ASIC-like functions, glue logic and complex control for instrumentation and communication equipment.
• Embedded memory buffering — Use on-chip RAM for packet buffering, FIFOs or lookup tables to reduce external memory bandwidth needs.
• High-pin-count system I/O — Integrate a wide range of interfaces and peripherals using the device’s 334 I/Os for system control, sensor aggregation and board-level routing.
• Signal processing and clocking — Leverage Stratix II architectural features documented in the device handbook for on-chip DSP tasks and sophisticated clock management.

Unique Advantages

• Substantial logic capacity: 60,440 logic elements enable consolidation of multiple functions onto a single FPGA, reducing system BOM and interconnect complexity.
• Significant on-chip memory: Approximately 2.54 Mbits of embedded RAM allows local data storage for buffering and algorithmic state without immediate external memory.
• Wide I/O availability: 334 user I/Os provide flexibility to connect diverse peripherals, external memories and board-level interfaces directly to the FPGA fabric.
• Compact BGA package: 484-ball BGA (23×23 supplier package) offers high pin density while keeping PCB footprint optimized for space-constrained designs.
• Commercial temperature rating: Rated 0 °C to 85 °C for mainstream embedded and communications applications where commercial-grade operation is required.
• Vendor-documented architecture: Backed by the Stratix II device handbook which documents architecture, DSP blocks, PLLs and configuration/testing features useful for engineering validation.

Why Choose EP2S60F484C3?

The EP2S60F484C3 positions itself as a high-capacity Stratix II FPGA option for designs that require a large logic fabric, significant on-chip memory and broad I/O connectivity within a commercial temperature envelope. Its combination of 60,440 logic elements, roughly 2.54 Mbits of embedded RAM and 334 I/Os makes it suitable for consolidating complex digital functions and handling moderate embedded memory needs on-chip.

Engineers selecting this device benefit from Stratix II family documentation and architectural features (including DSP resources and advanced clocking) described in the device handbook, supporting deterministic timing and on-chip processing while maintaining RoHS-compliant, surface-mount packaging for modern PCB assembly.

Request a quote or submit a pricing inquiry to obtain availability and volume pricing for EP2S60F484C3.