EP2S60F1020C5
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 718 2544192 60440 1020-BBGA |
|---|---|
| Quantity | 1,262 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 718 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3022 | Number of Logic Elements/Cells | 60440 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2544192 |
Overview of EP2S60F1020C5 – Stratix® II Field Programmable Gate Array (FPGA), 60,440 Logic Elements, 718 I/O
The EP2S60F1020C5 is a Stratix® II Field Programmable Gate Array (FPGA) offered in a 1020-BBGA package. It provides a high-density logic fabric with 60,440 logic elements, approximately 2.54 Mbits of embedded memory, and 718 user I/O pins suitable for complex, I/O‑heavy commercial designs.
Built on the Stratix II device family architecture, the device includes on-chip resources referenced in the device handbook—such as DSP blocks, PLLs and advanced clocking, TriMatrix memory structures, and high‑speed I/O support—making it appropriate for demanding digital signal processing, communications, and high‑performance logic integration in commercial applications.
Key Features
- Core Capacity — 60,440 logic elements provide a high level of programmable logic for complex system integration and custom silicon replacement.
- Embedded Memory — Approximately 2.54 Mbits of on‑chip RAM for buffering, lookup tables, and data storage close to logic blocks.
- High Pin Count I/O — 718 user I/O pins support wide bus interfaces and dense external connectivity.
- Stratix II Architecture Enhancements — Documented family features include DSP blocks, MultiTrack interconnect, TriMatrix memory organization, PLLs and advanced clock networks, and on‑chip termination and I/O standard support for high‑speed interfaces.
- Power — Core voltage supply range of 1.15 V to 1.25 V to match system power domains and support standard Stratix II power platforms.
- Package & Mounting — 1020‑BBGA package (supplier device package: 1020‑FBGA, 33×33) in a surface‑mount form factor for compact, high‑pin‑count board designs.
- Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Environmental Compliance — RoHS compliant.
Typical Applications
- High‑performance DSP systems — Use the device’s on‑chip memory and DSP resources for filtering, modulation/demodulation, and other signal processing tasks.
- Communications & Networking — High pin count and Stratix II high‑speed I/O support enable wide parallel interfaces, external memory interfacing, and protocol bridging.
- Custom Logic & Prototyping — Dense logic capacity and flexible clocking make the device suitable for ASIC prototyping and complex control logic consolidation.
- Embedded Systems with Large I/O Needs — 718 I/Os support sensor arrays, parallel data capture, and multi‑channel interfaces in commercial equipment.
Unique Advantages
- High logic density: 60,440 logic elements enable integration of multiple functions into a single device, reducing board-level component count.
- Significant on‑chip memory: Approximately 2.54 Mbits of embedded RAM minimizes external memory dependency for many buffering and LUT requirements.
- Extensive I/O capacity: 718 user I/O pins provide the routing flexibility required for dense, high‑bandwidth system designs.
- Comprehensive architecture features: Stratix II family capabilities—DSP blocks, PLLs, TriMatrix memory, and advanced I/O—support demanding timing and data‑path requirements.
- Compact, high‑pin package: 1020‑BBGA (33×33 FBGA equivalent) balances footprint and I/O density for space‑constrained commercial boards.
- Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operating range and RoHS conformity for standard commercial product deployments.
Why Choose EP2S60F1020C5?
The EP2S60F1020C5 positions itself as a high‑capacity, high‑I/O Stratix II FPGA for commercial projects that require substantial logic resources, embedded memory, and extensive connectivity. Its architecture—documented across the Stratix II device handbook—delivers programmable DSP blocks, PLLs and advanced clocking, and TriMatrix memory structures that support complex timing and dataflow requirements.
This device is well suited to design teams consolidating functions into a single FPGA to reduce BOM and board complexity, teams prototyping ASIC functionality, or commercial equipment OEMs requiring dense I/O and substantial on‑chip memory in a surface‑mount BBGA package.
Request a quote or submit your procurement inquiry to receive pricing and availability information for EP2S60F1020C5.

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