EP2S60F1020C3N
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 718 2544192 60440 1020-BBGA |
|---|---|
| Quantity | 668 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 718 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 6 (Time on Label) | Number of LABs/CLBs | 3022 | Number of Logic Elements/Cells | 60440 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2544192 |
Overview of EP2S60F1020C3N – Stratix® II Field Programmable Gate Array (FPGA) IC 718 2544192 60440 1020-BBGA
The EP2S60F1020C3N is a Stratix II family Field Programmable Gate Array (FPGA) from Intel (Altera). It implements the Stratix II architecture and provides a high-density programmable logic resource suitable for complex digital designs.
Key device attributes include 60,440 logic elements, approximately 2.5 Mbits of embedded memory, and 718 I/O pins in a 1020-ball FBGA (33×33) package. The device operates from a core voltage range of 1.15 V to 1.25 V and is rated for commercial temperature operation (0 °C to 85 °C).
Key Features
- Core Logic Density 60,440 logic elements (cells) provide substantial programmable fabric for complex state machines, datapaths, and custom logic implementations.
- Embedded Memory Approximately 2.5 Mbits of on-chip RAM for FIFOs, buffers, and local data storage without external memory for many functions.
- High I/O Count 718 user I/O pins support wide parallel interfaces and large connectivity requirements for board-level integration.
- Power and Voltage Core supply voltage range from 1.15 V to 1.25 V, enabling designs that follow Stratix II core power domains and supply planning.
- Package & Mounting 1020-ball FBGA (33×33) surface-mount package for compact, high-pin-count board designs.
- Operating Range & Compliance Commercial grade operation from 0 °C to 85 °C and RoHS compliant construction.
- Stratix II Architecture Documentation Supported by the Stratix II Device Handbook and related Altera/Intel documentation for architecture, PLLs, I/O structure, and configuration options.
Typical Applications
- High-speed communications Use the device’s large I/O count and Stratix II architecture to implement parallel interfaces, protocol bridging, and custom transceiver logic.
- Digital signal processing acceleration Leverage the Stratix II DSP-related architecture and on-chip memory to build custom DSP datapaths and accelerators.
- Memory interface controllers Implement external RAM interfacing and memory controllers using the available embedded memory and I/O resources.
- Custom programmable logic and prototyping Deploy the FPGA for board-level prototyping, glue logic, and complex state machines requiring large logic and I/O capacity.
Unique Advantages
- High logic capacity: 60,440 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
- Substantial embedded memory: Approximately 2.5 Mbits of on-chip RAM supports local buffering and storage for data-intensive tasks.
- Extensive I/O connectivity: 718 I/Os accommodate wide buses, multiple peripherals, and complex I/O topologies without multiplexing compromises.
- Compact high-pin-count package: 1020-ball FBGA (33×33) provides dense routing and mechanical stability for space-constrained designs.
- Documented architecture: Comprehensive Stratix II device documentation details clocking, I/O standards, PLLs, and configuration options to streamline design and verification.
- Regulatory and assembly readiness: RoHS compliance and surface-mount packaging align with contemporary manufacturing and environmental requirements.
Why Choose EP2S60F1020C3N?
The EP2S60F1020C3N positions itself as a high-density Stratix II FPGA option for designs that require a large amount of programmable logic, substantial on-chip memory, and a very high I/O count. Its 1020-ball FBGA package and documented Stratix II architecture make it suitable for system designs that demand integration of complex digital functions and extensive board-level connectivity.
Engineers and teams designing communication controllers, DSP accelerators, memory interfaces, or consolidated programmable logic blocks will find the combination of logic capacity, embedded RAM, and I/O resources well matched to mid- to large-scale digital implementations. The device’s commercial temperature grade and RoHS compliance support standard production environments backed by the Stratix II device handbook and Altera/Intel documentation.
Request a quote or submit an inquiry to receive pricing and availability details for EP2S60F1020C3N and to discuss how this Stratix II FPGA can fit your next design.

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