EP2S60F1020C3N

IC FPGA 718 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 718 2544192 60440 1020-BBGA

Quantity 668 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O718Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level6 (Time on Label)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2S60F1020C3N – Stratix® II Field Programmable Gate Array (FPGA) IC 718 2544192 60440 1020-BBGA

The EP2S60F1020C3N is a Stratix II family Field Programmable Gate Array (FPGA) from Intel (Altera). It implements the Stratix II architecture and provides a high-density programmable logic resource suitable for complex digital designs.

Key device attributes include 60,440 logic elements, approximately 2.5 Mbits of embedded memory, and 718 I/O pins in a 1020-ball FBGA (33×33) package. The device operates from a core voltage range of 1.15 V to 1.25 V and is rated for commercial temperature operation (0 °C to 85 °C).

Key Features

  • Core Logic Density 60,440 logic elements (cells) provide substantial programmable fabric for complex state machines, datapaths, and custom logic implementations.
  • Embedded Memory Approximately 2.5 Mbits of on-chip RAM for FIFOs, buffers, and local data storage without external memory for many functions.
  • High I/O Count 718 user I/O pins support wide parallel interfaces and large connectivity requirements for board-level integration.
  • Power and Voltage Core supply voltage range from 1.15 V to 1.25 V, enabling designs that follow Stratix II core power domains and supply planning.
  • Package & Mounting 1020-ball FBGA (33×33) surface-mount package for compact, high-pin-count board designs.
  • Operating Range & Compliance Commercial grade operation from 0 °C to 85 °C and RoHS compliant construction.
  • Stratix II Architecture Documentation Supported by the Stratix II Device Handbook and related Altera/Intel documentation for architecture, PLLs, I/O structure, and configuration options.

Typical Applications

  • High-speed communications Use the device’s large I/O count and Stratix II architecture to implement parallel interfaces, protocol bridging, and custom transceiver logic.
  • Digital signal processing acceleration Leverage the Stratix II DSP-related architecture and on-chip memory to build custom DSP datapaths and accelerators.
  • Memory interface controllers Implement external RAM interfacing and memory controllers using the available embedded memory and I/O resources.
  • Custom programmable logic and prototyping Deploy the FPGA for board-level prototyping, glue logic, and complex state machines requiring large logic and I/O capacity.

Unique Advantages

  • High logic capacity: 60,440 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
  • Substantial embedded memory: Approximately 2.5 Mbits of on-chip RAM supports local buffering and storage for data-intensive tasks.
  • Extensive I/O connectivity: 718 I/Os accommodate wide buses, multiple peripherals, and complex I/O topologies without multiplexing compromises.
  • Compact high-pin-count package: 1020-ball FBGA (33×33) provides dense routing and mechanical stability for space-constrained designs.
  • Documented architecture: Comprehensive Stratix II device documentation details clocking, I/O standards, PLLs, and configuration options to streamline design and verification.
  • Regulatory and assembly readiness: RoHS compliance and surface-mount packaging align with contemporary manufacturing and environmental requirements.

Why Choose EP2S60F1020C3N?

The EP2S60F1020C3N positions itself as a high-density Stratix II FPGA option for designs that require a large amount of programmable logic, substantial on-chip memory, and a very high I/O count. Its 1020-ball FBGA package and documented Stratix II architecture make it suitable for system designs that demand integration of complex digital functions and extensive board-level connectivity.

Engineers and teams designing communication controllers, DSP accelerators, memory interfaces, or consolidated programmable logic blocks will find the combination of logic capacity, embedded RAM, and I/O resources well matched to mid- to large-scale digital implementations. The device’s commercial temperature grade and RoHS compliance support standard production environments backed by the Stratix II device handbook and Altera/Intel documentation.

Request a quote or submit an inquiry to receive pricing and availability details for EP2S60F1020C3N and to discuss how this Stratix II FPGA can fit your next design.

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