EP2S30F672I4

The EP2S30F672I4 is a Stratix® II field programmable gate array (FPGA) from Intel designed for industrial applications that require programmable logic and high I/O density. The device implements Stratix II architecture and integrates a large number of logic elements and on‑chip RAM to support complex, customized digital designs.

Key on‑chip resources include 33,880 logic elements, approximately 1.37 Mbits of embedded memory, and up to 500 I/O pins. The device is supplied in a 672‑BBGA package and is specified for a 1.15 V to 1.25 V core supply and an operating temperature range of −40 °C to 100 °C.

Key Features

• Stratix II architecture Implements Stratix II device family architecture with documented functional blocks for programmable logic, clocking and I/O structures.
• Logic capacity 33,880 logic elements (logic cells) to implement custom digital logic and state machines.
• Embedded memory Approximately 1.37 Mbits of on‑chip RAM for on‑board buffering, FIFOs and data storage.
• I/O density Up to 500 I/O pins to support wide peripheral connectivity and multi‑channel interfaces.
• Clocking and DSP support Integrated PLLs and documented digital signal processing block support for timing management and signal processing functions.
• Package and mounting 672‑BBGA package (supplier device package: 672‑FBGA 27×27) optimized for surface mount assembly.
• Power supply range Core supply specified from 1.15 V to 1.25 V.
• Industrial temperature grade Specified operating range from −40 °C to 100 °C for industrial environments.
• Standards and debug support Device handbook documents include IEEE 1149.1 JTAG boundary‑scan support and an embedded logic analyzer (SignalTap II) option for in‑system debug and testing.
• RoHS compliant Conforms to RoHS requirements.

Typical Applications

• Industrial automation Programmable logic and robust temperature range make the device suitable for control, sequencing and I/O aggregation in industrial equipment.
• High‑density I/O systems Use the 500 I/O pins to implement multi‑channel interfaces, board‑level aggregators, or protocol bridging where large pin counts are required.
• Signal processing and control On‑chip memory and documented DSP resources support buffering and custom signal processing pipelines in instrumentation and control applications.
• Custom embedded platforms Logic capacity and Stratix II architecture enable tailored embedded functions, offloading tasks from host processors or ASICs.

Unique Advantages

• Substantial logic density: 33,880 logic elements provide the headroom to implement complex custom logic without immediate device migration.
• Significant on‑chip memory: Approximately 1.37 Mbits of embedded RAM reduces dependence on external memory for many buffering and staging tasks.
• Large I/O complement: Up to 500 I/Os allow direct interfacing to multiple peripherals and buses, simplifying board-level design.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in harsh and controlled industrial environments.
• Comprehensive development support: Stratix II device handbook details configuration, JTAG boundary‑scan, SignalTap II embedded logic analyzer and PLL/clocking resources to aid development and debugging.
• RoHS compliance: Meets RoHS requirements for lead‑free manufacturing processes.

Why Choose EP2S30F672I4?

The EP2S30F672I4 positions itself as a versatile Stratix II FPGA for industrial designs that demand a combination of substantial logic capacity, embedded memory and high I/O count in a compact BGA package. Its documented architecture—including clocking, DSP blocks, and on‑chip memory—supports a wide range of custom digital implementations where integration and configurability matter.

Designed for applications that require reliable operation across a broad temperature range and a defined core voltage window, this device is suitable for engineers looking to implement medium‑to‑high complexity FPGA designs with clear, datasheet‑backed specifications and development features.

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